Skip to search formSkip to main contentSkip to account menu

Semiconductor package

Known as: Packaged part, Semiconductor packages 
A semiconductor package is a metal, plastic, glass or ceramic casing containing one or more semiconductor electronic components. Individual discrete… 
Wikipedia (opens in a new tab)

Related topics

Related topics

34 relations
Chip carrierDual in-line packageEPROMElectronic packaging

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Encapsulated wafer level package technology (eWLCS)
This paper introduces a new encapsulated WLCSP product (eWLCS). The new product has a thin protective coating applied to all… 
2012
2012
High volume production of magnetic sensors for the automotive market
Magnetic sensors, like other electronic components used in automobiles need to be manufactured on-time in high volume at very… 
2011
2011
Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes
2010
2010
From isolated tenancy hosted application to multi-tenancy: Toward a systematic migration method for web application
Software as a Service (SaaS) attracts small and medium enterprises by its low investment, flexibility and easy to manage… 
2009
2009
Stiction in Low Humidity Environment
The susceptibility of MEMS devices, treated with anti-stiction coatings, to stiction in a low humidity environment has been… 
2006
2006
A novel "SMAFTI" package for inter-chip wide-band data transfer
A package structure with inter-chip connection is proposed for broadband data transfer and low latency electrical communication… 
2003
2003
Production Testing of ATLAS MDT Front-End Electronics
The production and testing of 360,000 channels of onchamber electronics for the ATLAS Monitored Drift Tube system is described… 
2002
2002
A compact 30 GHz MMIC high power amplifier (3 W CW) in chip and packaged form
This paper presents performance of a compact 3 W HPA (High Power Amplifier) in MMIC and packaged form at 30 GHz. A low cost high… 
1997
1997
Electroless Gold Plating For Semiconductor Package Substrate
The density of circuits on substrate mounted semiconductor devices has been rapidly increasing. To meet this growing need… 
Highly Cited
1982
Highly Cited
1982
The thin-film module as a high-performance semiconductor package
This paper discusses a multichip module for future VLSI computer packages on which an array of silicon chips is directly attached… 
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy (opens in a new tab), Terms of Service (opens in a new tab), and Dataset License (opens in a new tab)