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Semiconductor package
Known as:
Packaged part
, Semiconductor packages
A semiconductor package is a metal, plastic, glass or ceramic casing containing one or more semiconductor electronic components. Individual discrete…
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Related topics
Related topics
34 relations
Chip carrier
Dual in-line package
EPROM
Electronic packaging
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Production method of vertical LED packaged part and vertical LED packaged part
徐伟伦
2016
Corpus ID: 149925046
The invention provides a production method of a vertical LED packaged part and the vertical LED packaged part. The vertical LED…
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2011
2011
Users Guide on Scaled CMOS Reliability
M. Johnston
2011
Corpus ID: 55287744
2010
2010
Semiconductor package substrate and method for manufacturing the same
오융
2010
Corpus ID: 149546389
PURPOSE: A semiconductor package substrate and a manufacturing method thereof are provided to improve adhesive force between a…
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2010
2010
Basic PCB Level Assembly Process Methodology for 3D Package-on-Package
V. Solberg
2010
Corpus ID: 56064364
The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that each new…
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2008
2008
Thermal analysis automation system for semiconductor package
Yuanxiang Zhang
,
L. Liang
,
Yangjian Xia
,
Y. Liu
,
S. Irving
,
T. Luk
International Conference on Thermal, Mechanial…
2008
Corpus ID: 6177036
The technology of thermal analysis is very important in development of a new generation of IC package design, which aims to…
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2006
2006
Au-Ag based alloy wire for a semiconductor package
조종수
,
박용진
,
문정탁
,
허은규
,
오규환
2006
Corpus ID: 139714217
As high dry reliability as gold for a semiconductor package having a high-humidity reliability is provided is based alloy wire…
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2004
2004
Mechanical Tenacity Analysis of Moisture Barrier Bags for Semiconductor Packages
Keun-Soo Kim
,
Tae-Seong Kim
,
Min Yoo
,
H. Yoo
2004
Corpus ID: 135721711
We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during…
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2003
2003
Focused-lon-beam assisted bipolar transistor characterization and analog single-event transient circuit analysis of the OP27
J. Rowe
,
L. Massengill
,
+5 authors
M. Savage
Proceedings of the 7th European Conference on…
2003
Corpus ID: 44185344
We have applied a 3OkeV focused ion beam QTB) as a diagnostic tool for isolating and probing packaged-part devices for the…
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2003
2003
Production Testing of ATLAS MDT Front-End Electronics
E. Hazen
,
C. Posch
,
+4 authors
E. Hazen
2003
Corpus ID: 28311128
The production and testing of 360,000 channels of onchamber electronics for the ATLAS Monitored Drift Tube system is described…
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2000
2000
Microspring contacts on silicon : Delivering Moore's law-type scaling to semiconductor package, test and assembly
J. Novitsky
,
C. Miller
2000
Corpus ID: 115093610
For over thirty years, Moore's Law scaling continues to deliver impressive economic improvements in semiconductor manufacturing…
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