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Dual in-line package
Known as:
Quadruple in-line package
, Dual inline package
, Dip (electronics)
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In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular…
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Related topics
Related topics
50 relations
555 timer IC
6264
74181
Atmel AVR
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Transverse oscillations and stability of prominences in a magnetic field dip
D. Kolotkov
,
G. Nisticò
,
V. Nakariakov
2016
Corpus ID: 53977330
Aims. An analytical model of the global transverse oscillations and mechanical stability of a quiescent prominence in the…
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2011
2011
Isotopic evidence for the source and fate of phosphorus in Everglades wetland ecosystems
Xin Li
,
Yang Wang
,
J. Stern
,
B. Gu
2011
Corpus ID: 16835126
2011
2011
Türkiye’de okul öncesinde drama alanında yapılan lisansüstü tezlerin incelenmesi
Münevver Can Yaşar
,
N. Aral
2011
Corpus ID: 193982556
Bu arastirmada, Turkiye’de okul oncesinde drama alaninda yapilmi s lisansustu tezlerin tematik da g ilimlari incelenmistir…
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2007
2007
Package-Level Integrated LTCC Antenna for RF Package Application
Sang-Hyuk Wi
,
Jin-Seok Kim
,
+4 authors
J. Yook
IEEE Transactions on Advanced Packaging
2007
Corpus ID: 615792
This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an…
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2006
2006
Measurement of deformation and strain in first level C4 interconnect and stacked die using optical digital image correlation
L. Kehoe
,
P. Lynch
,
V. Guénebaut
Electronic Components and Technology Conference
2006
Corpus ID: 37709168
In this paper, we demonstrate the application of digital image correlation (DIC) to the measurement of nanometer scale…
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2005
2005
YABANCI DİL ÖĞRETİMİNDE İLETİŞİMSEL YETİ
Tahsin Aktaş
2005
Corpus ID: 177914970
Bu arastirmada iletisim kuraminin yabancidil ogretimi icin ongordugu iletisimsel yeti kavrami bilimsel literaturun isiginda…
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2004
2004
A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures
A. Tay
,
Y. Ma
,
T. Nakamura
,
S. H. Ong
The Ninth Intersociety Conference on Thermal and…
2004
Corpus ID: 10097819
This paper describes a numerical and experimental study of the failure of polymer-metal interfaces in plastic-encapsulated IC…
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Highly Cited
1999
Highly Cited
1999
Cameron: high level language compilation for reconfigurable systems
J. Hammes
,
Bob Rinker
,
W. Bohm
,
W. Najjar
,
B. Draper
,
R. Beveridge
International Conference on Parallel…
1999
Corpus ID: 2528806
This paper presents the Cameron Project, which aims to provide a high level, algorithmic language and optimizing compiler for the…
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1997
1997
A 2.7 V 2.5 GHz bipolar chipset for digital wireless communication
S. Heinen
,
K. Hadjizada
,
+6 authors
E. Matschke
IEEE International Solids-State Circuits…
1997
Corpus ID: 43571609
The chipset targets primarily the digital cordless european telecommunication (DECT) standard, that applies to business as well…
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Highly Cited
1981
Highly Cited
1981
Listric Normal Faults
A. Bally
,
D. Bernoulli
,
G. Davies
,
L. Montadert
1981
Corpus ID: 55188706
The importance of listric normal faults in the formation of sedimentary basins is becoming increasingly more obvious. Based on…
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