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Dual in-line package

Known as: Quadruple in-line package, Dual inline package, Dip (electronics) 
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular… 
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Papers overview

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2016
2016
Aims. An analytical model of the global transverse oscillations and mechanical stability of a quiescent prominence in the… 
2011
2011
Bu arastirmada, Turkiye’de okul oncesinde drama alaninda yapilmi s lisansustu tezlerin tematik da g ilimlari incelenmistir… 
2007
2007
This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an… 
2006
2006
In this paper, we demonstrate the application of digital image correlation (DIC) to the measurement of nanometer scale… 
2005
2005
Bu arastirmada iletisim kuraminin yabancidil ogretimi icin ongordugu iletisimsel yeti kavrami bilimsel literaturun isiginda… 
2004
2004
This paper describes a numerical and experimental study of the failure of polymer-metal interfaces in plastic-encapsulated IC… 
Highly Cited
1999
Highly Cited
1999
This paper presents the Cameron Project, which aims to provide a high level, algorithmic language and optimizing compiler for the… 
1997
1997
The chipset targets primarily the digital cordless european telecommunication (DECT) standard, that applies to business as well… 
Highly Cited
1981
Highly Cited
1981
The importance of listric normal faults in the formation of sedimentary basins is becoming increasingly more obvious. Based on…