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Electronic packaging
Known as:
Blob top
, Electronic package
, Packaging (disambiguation)
Electronic packaging is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to…
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Related topics
Related topics
11 relations
Burn-in
Co-fired ceramic
Conformal coating
Failure of electronic components
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Review
2009
Review
2009
Recent Advances in Conductive Adhesives for Electronic Packaging Technology
Jong‐Woong Kim
,
Young-Chul Lee
,
Bo-In Noh
,
Jeong-Won Yoon
,
Seung-Boo Jung
2009
Corpus ID: 107243679
Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a…
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2007
2007
Effect of citrate to nitrate ratio on the decomposition characteristics and phase formation of alumina
S. Banerjee
,
P. Sujatha Devi
2007
Corpus ID: 54878806
This paper reports the effect of the variation of citrate to nitrate ratio on the thermal decomposition characteristics of…
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2006
2006
Modern micropassives: fabrication and electrical properties
A. Dziedzic
2006
Corpus ID: 14316135
This paper presents the concept and modern technological approach to the fabrication of discrete, integrated and integral…
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2005
2005
Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly
Jin-Sang Hwang
,
M. Yim
,
K. Paik
2005
Corpus ID: 53487251
The flip-chip technology using anisotropic conductive films (ACFs) is gaining growing interest due to its technical advantages…
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Review
2004
Review
2004
Recent advances on electrical conductive adhesives (ECAs)
Y. Li
,
C. Wong
4th IEEE International Conference on Polymers and…
2004
Corpus ID: 40516263
As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more…
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2002
2002
Linearized superposition using CFD for thermal and power characterization of electronic equipment with significant thermal radiation and natural convection
P. Gauché
,
Wen Wei
2002
Corpus ID: 18292913
This paper presents a computational analysis for a PCB level natural convection system that is used to validate the principle of…
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2000
2000
Virtual thermo-mechanical prototyping of electronic packaging using Philips optimization strategy
J. Janssen
,
Guoqi Zhang
,
+4 authors
L. Ernst
2000
Corpus ID: 114073143
This paper presents part of our research and development results for virtual thermo-mechanical prototyping of electronic…
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1999
1999
Mechanical Analysis of Electronic Packaging Systems
Mckeown
1999
Corpus ID: 110548457
Analytical tools thermal performance analysis mechanical performance analysis life analysis other analysis analysis of test data…
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1998
1998
How to select underfill materials for solder bumped flip chips on low cost substrates
J. Lau
,
C. Chang
1998
Corpus ID: 28404476
Ten different underfill materials with different size and content of filler, and epoxy from four different vendors are studied in…
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1993
1993
Electronic Packaging, Microelectronics, and Interconnection Dictionary
C. Harper
,
Martin B. Miller
1993
Corpus ID: 106469891
A dictionary focusing on the multidisciplinary field of electronic packaging, this work features an extensive collection of terms…
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