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Electronic packaging
Known as:
Blob top
, Electronic package
, Packaging (disambiguation)
Electronic packaging is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to…
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Related topics
Related topics
11 relations
Burn-in
Co-fired ceramic
Conformal coating
Failure of electronic components
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
System Architecture of the BCU Payload on Tatiana-2
Shyh-Biau Jiang
,
T. Yeh
,
H. Yeh
,
J. Y. Liu
,
Ying-Hao Hsu
,
Li-Yeh Liu
2012
Corpus ID: 73523605
In conjunction with the international collaborative project of ESEMS (Experimental Scientific Education Micro Satellite) whose…
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Review
2009
Review
2009
Recent Advances in Conductive Adhesives for Electronic Packaging Technology
Jong‐Woong Kim
,
Young-Chul Lee
,
Bo-In Noh
,
Jeong-Won Yoon
,
Seung-Boo Jung
2009
Corpus ID: 107243679
Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a…
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2007
2007
Mechanism of Adhesive Film Popcorn in Electronic Packaging
Junfeng Zhao
,
Cheng Yang
,
Zhenyu Huang
,
Michael Wang
,
Changming Hu
Proceedings 57th Electronic Components and…
2007
Corpus ID: 25091264
Popcorn generally happens in lead frame based package, where the interface between molding compound and die (or die paddle) is…
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2006
2006
Modern micropassives: fabrication and electrical properties
A. Dziedzic
2006
Corpus ID: 14316135
This paper presents the concept and modern technological approach to the fabrication of discrete, integrated and integral…
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Review
2004
Review
2004
Recent advances on electrical conductive adhesives (ECAs)
Y. Li
,
C. Wong
4th IEEE International Conference on Polymers and…
2004
Corpus ID: 40516263
As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more…
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2002
2002
Linearized superposition using CFD for thermal and power characterization of electronic equipment with significant thermal radiation and natural convection
P. Gauché
,
Wen Wei
2002
Corpus ID: 18292913
This paper presents a computational analysis for a PCB level natural convection system that is used to validate the principle of…
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1999
1999
Mechanical Analysis of Electronic Packaging Systems
Mckeown
1999
Corpus ID: 110548457
Analytical tools thermal performance analysis mechanical performance analysis life analysis other analysis analysis of test data…
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1998
1998
How to select underfill materials for solder bumped flip chips on low cost substrates
J. Lau
,
C. Chang
1998
Corpus ID: 28404476
Ten different underfill materials with different size and content of filler, and epoxy from four different vendors are studied in…
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1993
1993
Electronic Packaging, Microelectronics, and Interconnection Dictionary
C. Harper
,
Martin B. Miller
1993
Corpus ID: 106469891
A dictionary focusing on the multidisciplinary field of electronic packaging, this work features an extensive collection of terms…
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Review
1979
Review
1979
The BELLPAC modular electronic packaging system
W. Harrod
,
A. G. Lubowe
Bell Labs technical journal
1979
Corpus ID: 35888605
The BELLPAC∗ system is a family of electronic packaging modules being used in the physical design of more than 40 new Bell…
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