A novel "SMAFTI" package for inter-chip wide-band data transfer

Abstract

A package structure with inter-chip connection is proposed for broadband data transfer and low latency electrical communication between a high-capacity memory and a logic device interconnected by a feedthrough interposer (FTI) featuring a fine-wiring pattern and ultra-fine-pitch through vias. The FTI is formed on a silicon wafer using a photolithography… (More)

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