Skip to search form
Skip to main content
Skip to account menu
Semantic Scholar
Semantic Scholar's Logo
Search 227,200,138 papers from all fields of science
Search
Sign In
Create Free Account
Chip carrier
Known as:
LCC
, Leadless chip carrier
, ILCC
Expand
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits. Connections are made on all four…
Expand
Wikipedia
(opens in a new tab)
Create Alert
Alert
Related topics
Related topics
43 relations
Atmel AVR
Ball grid array
Copper–tungsten
Die (integrated circuit)
Expand
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
The fast neutron irradiation influence on the AlGaAs IR-LEDs reliability
A. Gradoboev
,
K. N. Orlova
,
I. A. Asanov
,
A. V. Simonova
Microelectronics and reliability
2016
Corpus ID: 206952741
2012
2012
Quality assurance for wire connections used in integrated circuits via magnetic imaging
P. A. Holzl
,
T. Wiesner
,
B. Zagar
IEEE International Instrumentation and…
2012
Corpus ID: 37701698
Electronic components used in high power applications must be able to deal with rough operating conditions, like frequent changes…
Expand
2009
2009
The over-bump applied resin wafer-level underfill process: Process, material and reliability
C. Feger
,
N. LaBianca
,
+4 authors
M. Francis
Electronic Components and Technology Conference
2009
Corpus ID: 26236240
The over bump applied resin (OBAR) process is a wafer-level underfill (WLUF) process in which a filled resin is applied over the…
Expand
2007
2007
Small-Pitch Flip-Chip-Bonded VCSEL Arrays Enabling Transmitter Redundancy and Monitoring in 2-D 10-Gbit/s Space-Parallel Fiber Transmission
H. Roscher
,
F. Rinaldi
,
R. Michalzik
IEEE Journal of Selected Topics in Quantum…
2007
Corpus ID: 45103267
We demonstrate novel pixel architectures in 2-D vertical-cavity surface-emitting laser (VCSEL) arrays offering additional…
Expand
2005
2005
3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling
S. Lee
,
R. Hon
,
S. Zhang
,
C. Wong
Proceedings Electronic Components and Technology…
2005
Corpus ID: 38056539
Three dimensional packaging is emerging as the solution for microelectronics development toward system on chip (SOC) and system…
Expand
2005
2005
Fabrication of Nanowire Anisotropic Conductive Film for Ultra-Fine Pitch Flip Chip Interconnection
Renbang Lin
,
Y. Hsu
,
Yu-Chih Chen
,
S. Cheng
,
R. Uang
Proceedings Electronic Components and Technology…
2005
Corpus ID: 21757022
As the prediction that the I/O pitch will decrease from 60 um in 2004 to 20 um beyond 2010 by ITRS roadmap, flip chip…
Expand
Review
2004
Review
2004
Technology development and basic theory study of fluid dispensing - a review
L. Jianping
,
Deng Guiling
Proceedings of the Sixth IEEE CPMT Conference on…
2004
Corpus ID: 39831012
Fluid dispensing is widely applied in chip package and circuit assembly. This paper reviews the advantage and limits of four…
Expand
Review
2004
Review
2004
Reliability issues for flip-chip packages
P. Ho
,
Guotao Wang
,
Min Ding
,
Jie-Hua Zhao
,
X. Dai
Microelectronics and reliability
2004
Corpus ID: 31058063
2004
2004
Thermal characterization of stacked-die packages
L. Zhang
,
N. Howard
,
V. Gumaste
,
A. Poddar
,
L. Nguyen
Twentieth Annual IEEE Semiconductor Thermal…
2004
Corpus ID: 41926461
Thermal characterization for multi-chip packages is a complicated process. Unlike the single-chip package, for which thermal…
Expand
1997
1997
Testing the 400 MHz IBM generation-4 CMOS chip
Thomas G. Foote
,
D. Hoffman
,
W. Huott
,
T. Koprowski
,
Bryan J. Robbins
,
M. P. Kusko
Proceedings International Test Conference
1997
Corpus ID: 6883561
This paper describes the design-for-test framework of the 400 MHz CMOS central processor (CP) used in the fourth generation (G4…
Expand
By clicking accept or continuing to use the site, you agree to the terms outlined in our
Privacy Policy
(opens in a new tab)
,
Terms of Service
(opens in a new tab)
, and
Dataset License
(opens in a new tab)
ACCEPT & CONTINUE