Chip carrier

Known as: LCC, Leadless chip carrier, ILCC 
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits. Connections are made on all four… (More)
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Atmel AVRBall grid arrayCopper–tungstenDie (integrated circuit)
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Papers overview

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2015
2015
Chip-level anti-reverse engineering using transformable interconnects
Cloning of integrated circuit (IC) chips have emerged as a significant threat to the semiconductor industry. Unauthorized… (More)
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2015
2015
CVD2014—A Database for Evaluating No-Reference Video Quality Assessment Algorithms
In this paper, we present a new video database: CVD2014-Camera Video Database. In contrast to previous video databases, this… (More)
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2010
2010
Slow wave and dielectric quasi-TEM modes of Metal-Insulator-Semiconductor (MIS) structure Through Silicon Via (TSV) in signal propagation and power delivery in 3D chip package
The effects of slow wave and dielectric quasi-TEM modes due to MIS (Metal-Insulator-Semiconductor) structure TSV (Through-Silicon… (More)
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2007
2007
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy
We examine electromigration fatigue reliability and morphological patterns of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite… (More)
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Highly Cited
2007
Highly Cited
2007
The Redistributed Chip Package: A Breakthrough for Advanced Packaging
The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… (More)
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2006
2006
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition
This paper aims to investigate the electromigration phenomenon of under-bump-metallization (UBM) and solder bumps of a flip-chip… (More)
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Highly Cited
2005
Highly Cited
2005
Scaling analysis of multilevel interconnect temperatures for high-performance ICs
This paper presents a comprehensive thermal scaling analysis of multilevel interconnects in deep nanometer scale CMOS… (More)
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2005
2005
Influence of temperature and humidity on adhesion of underfills for flip chip packaging
This paper systematically discusses the influence of temperature and humidity on the adhesion performance of underfill material… (More)
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2005
2005
Compact physical IR-drop models for chip/package co-design of gigascale integration (GSI)
The supply voltage decrease and power density increase of future GSI chips demand accurate models for the IR-drop. Compact… (More)
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Highly Cited
1997
Highly Cited
1997
MCF7/LCC9: an antiestrogen-resistant MCF-7 variant in which acquired resistance to the steroidal antiestrogen ICI 182,780 confers an early cross-resistance to the nonsteroidal antiestrogen tamoxifen.
Acquired resistance to antiestrogens is a major problem in the clinical management of initially endocrine responsive metastatic… (More)
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