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Chip carrier

Known as: LCC, Leadless chip carrier, ILCC 
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits. Connections are made on all four… 
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Related topics

Related topics

43 relations
Atmel AVRBall grid arrayCopper–tungstenDie (integrated circuit)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2007
Highly Cited
2007
The Redistributed Chip Package: A Breakthrough for Advanced Packaging
The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… 
Highly Cited
2006
Highly Cited
2006
A 5-GHz 108-Mb/s 2 $\times$2 MIMO Transceiver RFIC With Fully Integrated 20.5-dBm ${\rm P}_{\rm 1dB}$ Power Amplifiers in 90-nm CMOS
Multiple antenna transceivers combined with MIMO signal processing offer the potential for increased data rates and/or range in… 
2006
2006
A strain range based model for life assessment of Pb-free SAC solder interconnects
This paper presents a strain based fatigue model for Pb-free SAC (Sn3.9Ag0.7Cu) solder interconnects based on the results of a… 
2005
2005
3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling
Three dimensional packaging is emerging as the solution for microelectronics development toward system on chip (SOC) and system… 
Highly Cited
2005
Highly Cited
2005
Wireless communication in a flip-chip package using integrated antennas on silicon substrates
An intrachip wireless interconnect using integrated antennas is demonstrated in a flip-chip ball grid array package. The wireless… 
2005
2005
Fabrication of Nanowire Anisotropic Conductive Film for Ultra-Fine Pitch Flip Chip Interconnection
As the prediction that the I/O pitch will decrease from 60 um in 2004 to 20 um beyond 2010 by ITRS roadmap, flip chip… 
Review
2004
Review
2004
Technology development and basic theory study of fluid dispensing - a review
Fluid dispensing is widely applied in chip package and circuit assembly. This paper reviews the advantage and limits of four… 
Review
2004
Review
2004
Reliability issues for flip-chip packages
2004
2004
Thermal characterization of stacked-die packages
Thermal characterization for multi-chip packages is a complicated process. Unlike the single-chip package, for which thermal… 
Highly Cited
1971
Highly Cited
1971
High Temperature Electronics.
Abstract : The fabrication of a silicon carbide (SiC) junction field effect transistor (J-FET) was shown practicable. Several… 
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