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Chip carrier

Known as: LCC, Leadless chip carrier, ILCC 
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits. Connections are made on all four… 
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Related topics

Related topics

43 relations
Atmel AVRBall grid arrayCopper–tungstenDie (integrated circuit)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
The fast neutron irradiation influence on the AlGaAs IR-LEDs reliability
2012
2012
Quality assurance for wire connections used in integrated circuits via magnetic imaging
Electronic components used in high power applications must be able to deal with rough operating conditions, like frequent changes… 
2009
2009
The over-bump applied resin wafer-level underfill process: Process, material and reliability
The over bump applied resin (OBAR) process is a wafer-level underfill (WLUF) process in which a filled resin is applied over the… 
2007
2007
Small-Pitch Flip-Chip-Bonded VCSEL Arrays Enabling Transmitter Redundancy and Monitoring in 2-D 10-Gbit/s Space-Parallel Fiber Transmission
We demonstrate novel pixel architectures in 2-D vertical-cavity surface-emitting laser (VCSEL) arrays offering additional… 
2005
2005
3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling
Three dimensional packaging is emerging as the solution for microelectronics development toward system on chip (SOC) and system… 
2005
2005
Fabrication of Nanowire Anisotropic Conductive Film for Ultra-Fine Pitch Flip Chip Interconnection
As the prediction that the I/O pitch will decrease from 60 um in 2004 to 20 um beyond 2010 by ITRS roadmap, flip chip… 
Review
2004
Review
2004
Technology development and basic theory study of fluid dispensing - a review
Fluid dispensing is widely applied in chip package and circuit assembly. This paper reviews the advantage and limits of four… 
Review
2004
Review
2004
Reliability issues for flip-chip packages
2004
2004
Thermal characterization of stacked-die packages
Thermal characterization for multi-chip packages is a complicated process. Unlike the single-chip package, for which thermal… 
1997
1997
Testing the 400 MHz IBM generation-4 CMOS chip
This paper describes the design-for-test framework of the 400 MHz CMOS central processor (CP) used in the fourth generation (G4… 
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