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Chip carrier

Known as: LCC, Leadless chip carrier, ILCC 
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits. Connections are made on all four… 
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Related topics

Related topics

43 relations
Atmel AVRBall grid arrayCopper–tungstenDie (integrated circuit)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Review
2011
Review
2011
Photovoltaic DC-Building-Module-Based BIPV System—Concept and Design Considerations
The photovoltaic (PV) modules used in the building-integrated PV (BIPV) system, generally, can be installed in different… 
Review
2011
Review
2011
Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging
Silicon photonics is a new technology that should at least enable electronics and optics to be integrated on the same… 
Review
2008
Review
2008
Neglected innovators: How do innovative firms that do not perform R&D innovate? : Results of an analysis of the Innobarometer 2007 survey No. 215
Highly Cited
2007
Highly Cited
2007
The Redistributed Chip Package: A Breakthrough for Advanced Packaging
The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… 
Highly Cited
2004
Highly Cited
2004
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
Highly Cited
2004
Highly Cited
2004
Fast flip-chip power grid analysis via locality and grid shells
  • E. Chiprout
  • IEEE/ACM International Conference on Computer…
  • 2004
  • Corpus ID: 15983606
Full-chip power grid analysis is time consuming. Several techniques have been proposed to tackle the problem but typically they… 
Review
2002
Review
2002
A 0.5-8.5 GHz fully differential CMOS distributed amplifier
A fully integrated fully differential distributed amplifier with 5.5 dB pass-band gain and 8.5 GHz unity-gain bandwidth is… 
Highly Cited
2001
Highly Cited
2001
A DNA array sensor utilizing magnetic microbeads and magnetoelectronic detection
Highly Cited
2001
Highly Cited
2001
A low-power 8-PAM serial transceiver in 0.5-μm digital CMOS
A CMOS multi-level (8-PAM) transceiver is described. Preemphasis is implemented without an increase in DAC resolution or digital… 
Highly Cited
1971
Highly Cited
1971
High Temperature Electronics.
Abstract : The fabrication of a silicon carbide (SiC) junction field effect transistor (J-FET) was shown practicable. Several… 
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