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Copper–tungsten

Known as: Tungsten-copper, CuW, WCu 
Copper–tungsten (tungsten–copper, CuW, or WCu) is a mixture of copper and tungsten. As copper and tungsten are not mutually soluble, the material is… Expand
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Highly Cited
2012
Highly Cited
2012
Multibiometric systems are being increasingly de- ployed in many large-scale biometric applications (e.g., FBI-IAFIS, UIDAI… Expand
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Highly Cited
2009
Highly Cited
2009
An intense pulsed light (IPL) from a xenon flash lamp was used to sinter copper nanoink printed on low-temperature polymer… Expand
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Highly Cited
2007
Highly Cited
2007
The localized surface plasmon resonance (LSPR) of oxide-free Cu nanoparticles fabricated by nanosphere lithography is examined by… Expand
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Highly Cited
2007
Highly Cited
2007
Scalable nonvolatile memory devices that operate at low voltage and current, exhibit multilevel cell capability, and can be read… Expand
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Highly Cited
2004
Highly Cited
2004
The grain-size effect on deformation twinning in nanocrystalline copper is studied. It has been reported that deformation… Expand
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Highly Cited
2003
Highly Cited
2003
We have developed a method to deposit Cu metal onto surface-attached DNA, forming nanowirelike structures that are ∼3 nm tall… Expand
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Highly Cited
2002
Highly Cited
2002
Abstract The nucleation mechanisms of copper during electrodeposition of thin films from sulfate solutions were studied by… Expand
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Highly Cited
2001
Highly Cited
2001
In the recent past, investigations have focused increasingly on confined systems with micrometer and, in particular, nanometer… Expand
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Highly Cited
1999
Highly Cited
1999
simulations of the plastic behavior of nanocrystalline copper. The simulations show that the main deformation mode is sliding in… Expand
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Highly Cited
1972
Highly Cited
1972
The theory of lithosphere plate tectonics, embodying the concepts of sea-floor spreading, transform faulting, and underthrusting… Expand
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