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Ball grid array
Known as:
Plastic ball grid array
, LFBGA
, ΜFCBGA
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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently…
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50 relations
AMD 580 chipset series
Automated X-ray inspection
Bead probe technology
Boundary scan
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2008
2008
Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package
Y. T. Chin
,
P. Lam
,
H. Yow
,
T. Tou
Microelectronics and reliability
2008
Corpus ID: 29548935
2007
2007
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging
J. Koo
,
Seung-Boo Jung
Microelectronics and reliability
2007
Corpus ID: 39045702
2006
2006
Drop impact analysis of Sn-Ag-Cu solder joints using dynamic high-strain rate plastic strain as the impact damage driving force
J. Pang
,
F. Che
Electronic Components and Technology Conference
2006
Corpus ID: 20431284
Board-level drop reliability test and analysis requires dynamic characterization of high strain-rate properties of bulk solder…
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2005
2005
Plastic Ball Grid Array (PBGA)
A. Mawer
2005
Corpus ID: 113013219
The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s OverMolded…
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Highly Cited
2005
Highly Cited
2005
Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad
Shengquan E. Ou
,
Yuhuan Xu
,
K. Tu
,
M. O. Alam
,
Y. Chan
Proceedings Electronic Components and Technology…
2005
Corpus ID: 37215567
The most frequent failure of wireless, handheld, and movable consumer electronic products is an accidental drop to the ground…
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2002
2002
Optimal design for a ball grid array wire bonding process using a neuro-genetic approach
C. Su
,
T. Chiang
2002
Corpus ID: 58930343
This study presents an integrated method in which neural networks, genetic algorithms, and exponential desirability functions are…
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2001
2001
A hardware and software monitor for high-level system-on-chip verification
Mohammed El Shobaki
,
L. Lindh
Proceedings of the IEEE . 2nd International…
2001
Corpus ID: 10354958
Verification of today's Systems-on-Chip (SoC) occurs at low abstraction-levels, typically at register-transfer level (RTL). As…
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1995
1995
The market for ball grid array packages
E. Jan Vardaman
,
R. Crowley
,
T. Goodman
Proceedings of Japan International Electronic…
1995
Corpus ID: 122179163
The Ball Grid Array (BGA) package has been developed to provide a high density, leadless surface mount alternative to existing…
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1994
1994
A new mini Ball Grid Array (mBGA) multichip module technology
R. Chanchani
,
K. Treece
,
P. Dressendorfer
1994
Corpus ID: 108910012
A new die-level packaging technology, mBGA, is reported in this paper. The mBGA enables high circuit packaging density on…
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1987
1987
The abundance of heterocystous blue-green algae in rice soils and inocula used for application in rice fields
P. Roger
,
S. Santiago-Ardales
,
P. Reddy
,
I. Watanabe
Biology and Fertility of Soils
1987
Corpus ID: 26221064
SummaryAlgal populations were quantified (as colony-forming units [CFU] per square centimetre) in 102 samples of rice soils from…
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