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Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Effect of NPK levels, BGA and FYM on growth and yield of rice (Oryza sativa L.).
2012
2012
Wearout reliability study of Cu and Au wires used in flash memory fine line BGA package
Bond reliability at a Cu wire bond under a humid environment is a major concern in replacing Au wires. Conventional bare Cu… 
2009
2009
A 40Gb/s multi-data-rate CMOS transceiver chipset with SFI-5 interface for optical transmission systems
As 40Gb/s optical communication systems enter the commercial stage, the transceiver, which is a key component of these systems… 
2008
2008
A New Method for Optimal Harmonic Meter Placement
In this research, a new method based on Singular Value Decomposition (SVD) is proposed to solve the problem of optimal placement… 
2005
2005
High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability
For high performance computer system applications, there are limitations for reliably and cost effectively attaching high I/O… 
2005
2005
Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies
The mechanical reliability of BGA assemblies is sensitive to the intermetallic compounds that are formed at the solder/base metal… 
2001
2001
Effect of Intermetallic Compounds on Vibration Fatigue of BGA Solder Joint
This paper studies the vibration fatigue failure of BGA solder-joints reflowed with different temperature profiles, and aging at… 
Highly Cited
2000
Highly Cited
2000
Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization
Au/Ni metallization has become increasingly common in microelectronic packaging when Cu pads are joined with Pb-Sn solder. Recent… 
1995
1995
Bio-International ’94 Conference on Bioavailability, Bioequivalence and Pharmacokinetic Studiesand Pre-Conference Satellite on ‘in vivo/in vitro correlation’
Organized by the International Pharmaceutical Federation (FlP) together with American Association of Pharmaceutical Scientists… 
1994
1994
A new mini Ball Grid Array (mBGA) multichip module technology
A new die-level packaging technology, mBGA, is reported in this paper. The mBGA enables high circuit packaging density on…