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Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… Expand
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Related topics

Related topics

50 relations
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Review
2018
Review
2018
Big GIS analytics framework for agriculture supply chains: A literature review identifying the current trends and future perspectives
Abstract The world population is estimated to reach nine billion by 2050. Many challenges are adding pressure on the current… Expand
2017
2017
Silicon photonics coherent transceiver in a ball-grid array package
We demonstrate a silicon photonics coherent transceiver in a ball-grid-array package. It can be handled like a conventional… Expand
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2015
2015
Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes
Pb-free solder joints exposed to elevated isothermal temperatures for prolonged periods of time undergo microstructural and… Expand
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2014
2014
Ball-grid array architecture for microfabricated ion traps
State-of-the-art microfabricated ion traps for quantum information research are approaching nearly one hundred control electrodes… Expand
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Highly Cited
2008
Highly Cited
2008
Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages
The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au… Expand
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Highly Cited
1997
Highly Cited
1997
Differential Evolution – A Simple and Efficient Heuristic for global Optimization over Continuous Spaces
A new heuristic approach for minimizing possiblynonlinear and non-differentiable continuous spacefunctions is presented. By means… Expand
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Highly Cited
1996
Highly Cited
1996
From Recombination of Genes to the Estimation of Distributions I. Binary Parameters
The Breeder Genetic Algorithm (BGA) is based on the equation for the response to selection. In order to use this equation for… Expand
Highly Cited
1996
Highly Cited
1996
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Reliability testing and data analysis failure analysis and root cause identification design for reliability solder joint… Expand
Highly Cited
1994
Highly Cited
1994
Ball Grid Array Technology
  • J. Lau
  • 1994
    • Corpus ID: 136997489
Introduction to BGA technology ceramic substrates for BGA packages BT substrates for BGA packages PCBs for BGA ceramic BGA… Expand
Highly Cited
1993
Highly Cited
1993
Predictive Models for the Breeder Genetic Algorithm I. Continuous Parameter Optimization
In this paper a new genetic algorithm called the Breeder Genetic Algorithm (BGA) is introduced. The BGA is based on artificial… Expand
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