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Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… 
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Related topics

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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Role of blue green algae in rice productivity.
Rice is one of the oldest cultivated crops and most staple food crop for more than a third of the world's population. It is the… 
Highly Cited
2011
Highly Cited
2011
A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application
A 2.4 GHz outphasing power amplifier (PA) is implemented in a 32 nm CMOS process. An inverter-based class-D PA topology is… 
Highly Cited
2007
Highly Cited
2007
The Redistributed Chip Package: A Breakthrough for Advanced Packaging
The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… 
2007
2007
Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications
The solder-joint reliability of plastic ball grid array (PBGA) packages for an avionics application was assessed. The fatigue… 
Highly Cited
2006
Highly Cited
2006
The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and… 
Highly Cited
2006
Highly Cited
2006
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
2005
2005
Plastic Ball Grid Array (PBGA)
The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s OverMolded… 
2005
2005
Flip chip ball grid array component testing under board flexure
With increasing attention on component damage caused by motherboard flexure during manufacturing processes, strain-based… 
Highly Cited
2005
Highly Cited
2005
Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages
In this paper, the fluid flow and heat transfer of liquid cooled foam heat sinks (FHSs) were experimentally investigated. Eight… 
Review
2004
Review
2004
Reliability issues for flip-chip packages
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