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Ball grid array
Known as:
Plastic ball grid array
, LFBGA
, ΜFCBGA
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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently…
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50 relations
AMD 580 chipset series
Automated X-ray inspection
Bead probe technology
Boundary scan
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Role of blue green algae in rice productivity.
Y. P. Paudel
,
S. Pradhan
,
B. Pant
,
B. Prasad
2012
Corpus ID: 84313714
Rice is one of the oldest cultivated crops and most staple food crop for more than a third of the world's population. It is the…
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Highly Cited
2011
Highly Cited
2011
A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application
Hongtao Xu
,
Y. Palaskas
,
A. Ravi
,
M. Sajadieh
,
Mohammed A. El-Tanani
,
K. Soumyanath
IEEE Journal of Solid-State Circuits
2011
Corpus ID: 33860370
A 2.4 GHz outphasing power amplifier (PA) is implemented in a 32 nm CMOS process. An inverter-based class-D PA topology is…
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Highly Cited
2010
Highly Cited
2010
A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS
S. Reynolds
,
A. Natarajan
,
+7 authors
B. Floyd
IEEE Radio Frequency Integrated Circuits…
2010
Corpus ID: 2426919
A 0.12-µm SiGe phased-array Rx IC for beam-steered wireless communication in the 60-GHz band is described. It has 16 RF phase…
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2009
2009
Medical data mining using BGA and RGA for weighting of features in fuzzy k-NN classification
Ping-Hung Tang
,
Ming-Hseng Tseng
International Conference on Machine Learning and…
2009
Corpus ID: 20761121
The k-nearest neighbor (k-NN) algorithm is commonly used in applications of classifiers and data mining and the related area due…
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2007
2007
Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications
H. Qi
,
M. Osterman
,
M. Pecht
IEEE transactions on components and packaging…
2007
Corpus ID: 7462433
The solder-joint reliability of plastic ball grid array (PBGA) packages for an avionics application was assessed. The fatigue…
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2007
2007
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging
J. Koo
,
Seung-Boo Jung
Microelectronics and reliability
2007
Corpus ID: 39045702
Highly Cited
2006
Highly Cited
2006
The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating
K. Zeng
,
R. Stierman
,
D. Abbott
,
M. Murtuza
2006
Corpus ID: 16501914
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and…
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2005
2005
Plastic Ball Grid Array (PBGA)
A. Mawer
2005
Corpus ID: 113013219
The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s OverMolded…
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2005
2005
Flip chip ball grid array component testing under board flexure
G. Hsieh
,
A. Mcallister
Proceedings Electronic Components and Technology…
2005
Corpus ID: 10694638
With increasing attention on component damage caused by motherboard flexure during manufacturing processes, strain-based…
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Review
2004
Review
2004
Reliability issues for flip-chip packages
P. Ho
,
Guotao Wang
,
Min Ding
,
Jie-Hua Zhao
,
X. Dai
Microelectronics and reliability
2004
Corpus ID: 31058063
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