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Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… Expand
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Papers overview

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2017
2017
We demonstrate a silicon photonics coherent transceiver in a ball-grid-array package. It can be handled like a conventional… Expand
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2015
2015
State-of-the-art microfabricated ion traps for quantum information research are approaching nearly one hundred control electrodes… Expand
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2015
2015
Pb-free solder joints exposed to elevated isothermal temperatures for prolonged periods of time undergo microstructural and… Expand
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Highly Cited
2011
Highly Cited
2011
Abstract Sn–Ag–Cu composite solders reinforced with nano-sized, nonreacting, noncoarsening 1 wt% TiO 2 particles were prepared by… Expand
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Highly Cited
2008
Highly Cited
2008
The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au… Expand
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Highly Cited
1997
Highly Cited
1997
A new heuristic approach for minimizing possiblynonlinear and non-differentiable continuous spacefunctions is presented. By means… Expand
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Highly Cited
1996
Highly Cited
1996
The Breeder Genetic Algorithm (BGA) is based on the equation for the response to selection. In order to use this equation for… Expand
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Highly Cited
1996
Highly Cited
1996
Reliability testing and data analysis failure analysis and root cause identification design for reliability solder joint… Expand
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Highly Cited
1994
Highly Cited
1994
Introduction to BGA technology ceramic substrates for BGA packages BT substrates for BGA packages PCBs for BGA ceramic BGA… Expand
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Highly Cited
1993
Highly Cited
1993
In this paper a new genetic algorithm called the Breeder Genetic Algorithm (BGA) is introduced. The BGA is based on artificial… Expand
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