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Ball grid array
Known as:
Plastic ball grid array
, LFBGA
, ΜFCBGA
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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently…
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Identification of Faulty BGA Solder Joints in X-Ray Images
M. Laghari
,
Q. Memon
2015
Corpus ID: 37436617
2012
2012
Wearout reliability study of Cu and Au wires used in flash memory fine line BGA package
C.L. Gan
,
E. Ng
,
B. L. Chan
,
T. Kwuanjai
,
S. Jakarin
,
U. Hashim
Impact
2012
Corpus ID: 20762791
Bond reliability at a Cu wire bond under a humid environment is a major concern in replacing Au wires. Conventional bare Cu…
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2009
2009
A 40Gb/s multi-data-rate CMOS transceiver chipset with SFI-5 interface for optical transmission systems
Y. Amamiya
,
S. Kaeriyama
,
+16 authors
N. Kawahara
IEEE International Solid-State Circuits…
2009
Corpus ID: 206996121
As 40Gb/s optical communication systems enter the commercial stage, the transceiver, which is a key component of these systems…
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2007
2007
Integrated Modeling of C4 Interconnects
J. Sylvestre
Proceedings 57th Electronic Components and…
2007
Corpus ID: 25968870
An extensive methodology for the numerical modeling of C4 interconnects in flip chip organic packages is presented, with…
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2005
2005
High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability
X. Dai
,
Ning Pan
,
+4 authors
T. Michalka
Proceedings Electronic Components and Technology…
2005
Corpus ID: 36155351
For high performance computer system applications, there are limitations for reliably and cost effectively attaching high I/O…
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2005
2005
Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies
A. Lal
,
E. Bradley
,
J. Sharda
Proceedings Electronic Components and Technology…
2005
Corpus ID: 27501657
The mechanical reliability of BGA assemblies is sensitive to the intermetallic compounds that are formed at the solder/base metal…
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2004
2004
Effect of phosphorus fertilization on blue-green algal inoculum production and nitrogen yield under field conditions
R. N. Bisoyi
,
P. Singh
Biology and Fertility of Soils
2004
Corpus ID: 22418791
SummaryField experiments were conducted to assess the effects of the application of P on growth and N yield of inoculated and…
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2001
2001
Effect of Intermetallic Compounds on Vibration Fatigue of BGA Solder Joint
P. Tu
,
Y. Chan
,
J. Lai
2001
Corpus ID: 55316294
This paper studies the vibration fatigue failure of BGA solder-joints reflowed with different temperature profiles, and aging at…
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2001
2001
Effecto of Intermetallic Compounds on Vibration Fatigue of μBGA Solder Joint
P. Tu
2001
Corpus ID: 138513927
1994
1994
A new mini Ball Grid Array (mBGA) multichip module technology
R. Chanchani
,
K. Treece
,
P. Dressendorfer
1994
Corpus ID: 108910012
A new die-level packaging technology, mBGA, is reported in this paper. The mBGA enables high circuit packaging density on…
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