Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

1937-2018
010020019372017

Papers overview

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2017
2017
We demonstrate a silicon photonics coherent transceiver in a ball-grid-array package. It can be handled like a conventional… (More)
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2016
2016
Vibration reliability test for plastic ball grid array solder joints have been developed by performing vibration tests with… (More)
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2008
2008
This paper presents test results and specifications for SJ BISTTM, an innovative sensing method for detecting faults in solder… (More)
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2007
2007
An update on a method (SJ BISTtrade) to detect intermittencies in Ball Grid Array (BGA) packages is presented, and another method… (More)
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2007
2007
The solder-joint reliability of plastic ball grid array (PBGA) packages for an avionics application was assessed. The fatigue… (More)
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Highly Cited
2006
Highly Cited
2006
Wafer Level Packaging (fan-in WLB, Wafer Level Ball Grid Array) is the upcoming future packaging technology with many advantages… (More)
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2005
2005
With increasing attention on component damage caused by motherboard flexure during manufacturing processes, strain-based… (More)
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2005
2005
Printed circuit boards were assembled at Jabil's San Jose facility using their qualified surface mount assembly processes. The… (More)
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2004
2004
  • Y. P. Zhang
  • IEEE Transactions on Antennas and Propagation
  • 2004
The recent advances in such highly integrated RF transceivers as radio system-on-chip and radio system-in-package have called for… (More)
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1999
1999
Due to the large number of I/O’s in a BallGrid-Array (BGA) package, routing becomes more and more an important work. A ring-based… (More)
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