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Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2009
2009
A 40Gb/s multi-data-rate CMOS transceiver chipset with SFI-5 interface for optical transmission systems
As 40Gb/s optical communication systems enter the commercial stage, the transceiver, which is a key component of these systems… 
2005
2005
Plastic Ball Grid Array (PBGA)
The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s OverMolded… 
2005
2005
High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability
For high performance computer system applications, there are limitations for reliably and cost effectively attaching high I/O… 
2005
2005
Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies
The mechanical reliability of BGA assemblies is sensitive to the intermetallic compounds that are formed at the solder/base metal… 
2003
2003
Efficient evolutionary algorithms for the clustering problem in directed graphs
  • C. DiasL. Ochi
  • The Congress on Evolutionary Computation, . CEC…
  • 2003
  • Corpus ID: 2603765
We present improvements in the performance of standard genetic algorithms (GAs) as regards the solution of highly complex… 
2001
2001
A hardware and software monitor for high-level system-on-chip verification
Verification of today's Systems-on-Chip (SoC) occurs at low abstraction-levels, typically at register-transfer level (RTL). As… 
Review
2001
Review
2001
METHODS FOR STUDYING BLUE-GREEN ALGAE IN RICEFIELDS : DISTRIBUTIONAL ECOLQGY , SAMPLING STRATEGIES , AND ESTIMATION OF ABUNDANCE
Many methods for studying blue-green algae (BGA) in wetland ricefields have been adopted, modified, designed, and tested during… 
2001
2001
Effect of Intermetallic Compounds on Vibration Fatigue of BGA Solder Joint
This paper studies the vibration fatigue failure of BGA solder-joints reflowed with different temperature profiles, and aging at… 
Highly Cited
2000
Highly Cited
2000
Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization
Au/Ni metallization has become increasingly common in microelectronic packaging when Cu pads are joined with Pb-Sn solder. Recent… 
1994
1994
A new mini Ball Grid Array (mBGA) multichip module technology
A new die-level packaging technology, mBGA, is reported in this paper. The mBGA enables high circuit packaging density on… 
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