FAQ

Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

1937-2018
010020019372017

Related topics

Related topics

50 relations
AMD Accelerated Processing UnitBead probe technologyChip carrierChip-scale package
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Related mentions per year

Related mentions per year

1936-2018
19401960198020002020
Ball grid array
Transistor
Integrated circuit
Stiffness
Microprocessor
System on a chip

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Silicon photonics coherent transceiver in a ball-grid array package
We demonstrate a silicon photonics coherent transceiver in a ball-grid-array package. It can be handled like a conventional… (More)
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2016
2016
Vibration reliability test and analysis of plastic ball grid array
Vibration reliability test for plastic ball grid array solder joints have been developed by performing vibration tests with… (More)
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2008
2008
Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST
This paper presents test results and specifications for SJ BISTTM, an innovative sensing method for detecting faults in solder… (More)
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2007
2007
Intermittency detection and mitigation in Ball Grid Array (BGA) packages
An update on a method (SJ BISTtrade) to detect intermittencies in Ball Grid Array (BGA) packages is presented, and another method… (More)
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2007
2007
Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications
The solder-joint reliability of plastic ball grid array (PBGA) packages for an avionics application was assessed. The fatigue… (More)
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Highly Cited
2006
Highly Cited
2006
Embedded Wafer Level Ball Grid Array (eWLB)
Wafer Level Packaging (fan-in WLB, Wafer Level Ball Grid Array) is the upcoming future packaging technology with many advantages… (More)
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2005
2005
Flip chip ball grid array component testing under board flexure
With increasing attention on component damage caused by motherboard flexure during manufacturing processes, strain-based… (More)
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2005
2005
Lead-free Assembly Defects in Plastic Ball Grid Array Packages
Printed circuit boards were assembled at Jabil's San Jose facility using their qualified surface mount assembly processes. The… (More)
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2004
2004
Integrated circuit ceramic ball grid array package antenna
  • Y. P. Zhang
  • IEEE Transactions on Antennas and Propagation
  • 2004
The recent advances in such highly integrated RF transceivers as radio system-on-chip and radio system-in-package have called for… (More)
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1999
1999
A New Approach to the Ball Grid Array Package Routing
Due to the large number of I/O’s in a BallGrid-Array (BGA) package, routing becomes more and more an important work. A ring-based… (More)
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