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Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… 
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Papers overview

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2006
2006
Board-level drop reliability test and analysis requires dynamic characterization of high strain-rate properties of bulk solder… 
2005
2005
The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s OverMolded… 
Highly Cited
2005
Highly Cited
2005
The most frequent failure of wireless, handheld, and movable consumer electronic products is an accidental drop to the ground… 
2002
2002
This study presents an integrated method in which neural networks, genetic algorithms, and exponential desirability functions are… 
2001
2001
Verification of today's Systems-on-Chip (SoC) occurs at low abstraction-levels, typically at register-transfer level (RTL). As… 
1995
1995
The Ball Grid Array (BGA) package has been developed to provide a high density, leadless surface mount alternative to existing… 
1994
1994
A new die-level packaging technology, mBGA, is reported in this paper. The mBGA enables high circuit packaging density on… 
1987
1987
SummaryAlgal populations were quantified (as colony-forming units [CFU] per square centimetre) in 102 samples of rice soils from…