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Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… 
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Related topics

Related topics

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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2008
2008
Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST
This paper presents test results and specifications for SJ BISTTM, an innovative sensing method for detecting faults in solder… 
Highly Cited
2006
Highly Cited
2006
The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and… 
2006
2006
Drop impact analysis of Sn-Ag-Cu solder joints using dynamic high-strain rate plastic strain as the impact damage driving force
Board-level drop reliability test and analysis requires dynamic characterization of high strain-rate properties of bulk solder… 
2005
2005
Plastic Ball Grid Array (PBGA)
The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s OverMolded… 
Highly Cited
2005
Highly Cited
2005
Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad
The most frequent failure of wireless, handheld, and movable consumer electronic products is an accidental drop to the ground… 
Highly Cited
2004
Highly Cited
2004
A multiagent genetic algorithm for global numerical optimization
In this paper, multiagent systems and genetic algorithms are integrated to form a new algorithm, multiagent genetic algorithm… 
2002
2002
Optimal design for a ball grid array wire bonding process using a neuro-genetic approach
This study presents an integrated method in which neural networks, genetic algorithms, and exponential desirability functions are… 
2001
2001
A hardware and software monitor for high-level system-on-chip verification
Verification of today's Systems-on-Chip (SoC) occurs at low abstraction-levels, typically at register-transfer level (RTL). As… 
1995
1995
The market for ball grid array packages
The Ball Grid Array (BGA) package has been developed to provide a high density, leadless surface mount alternative to existing… 
1987
1987
The abundance of heterocystous blue-green algae in rice soils and inocula used for application in rice fields
SummaryAlgal populations were quantified (as colony-forming units [CFU] per square centimetre) in 102 samples of rice soils from… 
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