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Ball grid array
Known as:
Plastic ball grid array
, LFBGA
, ΜFCBGA
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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently…
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50 relations
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Identification of Faulty BGA Solder Joints in X-Ray Images
M. Laghari
,
Q. Memon
2015
Corpus ID: 37436617
2012
2012
Wearout reliability study of Cu and Au wires used in flash memory fine line BGA package
C.L. Gan
,
E. Ng
,
B. L. Chan
,
T. Kwuanjai
,
S. Jakarin
,
U. Hashim
Impact
2012
Corpus ID: 20762791
Bond reliability at a Cu wire bond under a humid environment is a major concern in replacing Au wires. Conventional bare Cu…
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2009
2009
A 40Gb/s multi-data-rate CMOS transceiver chipset with SFI-5 interface for optical transmission systems
Yasushi Amamiya
,
Shunichi Kaeriyama
,
+16 authors
Nobuhiro Kawahara
IEEE International Solid-State Circuits…
2009
Corpus ID: 206996121
As 40Gb/s optical communication systems enter the commercial stage, the transceiver, which is a key component of these systems…
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2008
2008
Input-Output Feedback Linearization Cascade Controller Using Genetic Algorithm for Rotary Inverted Pendulum System
I. Hassanzadeh
,
Saleh Mobayen
,
A. Harifi
2008
Corpus ID: 16282054
The Rotary Inverted Pendulum (RIP) system is a significant classical problem of control engineering which has been investigated…
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2007
2007
Integrated Modeling of C4 Interconnects
J. Sylvestre
Proceedings 57th Electronic Components and…
2007
Corpus ID: 25968870
An extensive methodology for the numerical modeling of C4 interconnects in flip chip organic packages is presented, with…
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2005
2005
Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies
Anand Lal
,
E. Bradley
,
Jignesh Sharda
Proceedings Electronic Components and Technology…
2005
Corpus ID: 27501657
The mechanical reliability of BGA assemblies is sensitive to the intermetallic compounds that are formed at the solder/base metal…
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2005
2005
New insights in critical solder joint location
M. Modi
,
C. McCormick
,
N. Armendariz
Proceedings Electronic Components and Technology…
2005
Corpus ID: 45803121
Current numerical modeling approaches to assess BGA solder joint thermal mechanical fatigue, typically identify the max DNP…
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2005
2005
High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability
X. Dai
,
N. Pan
,
+4 authors
T. Michalka
Proceedings Electronic Components and Technology…
2005
Corpus ID: 36155351
For high performance computer system applications, there are limitations for reliably and cost effectively attaching high I/O…
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Review
2001
Review
2001
RF and Microwave Component Development in LTCC
L. Devlin
,
G. Pearson
,
J. Pittock
2001
Corpus ID: 32093902
Low Temperature Co-fired Ceramic (LTCC) technology is a multi-layer ceramic process that can be used to fabricate low cost, high…
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1994
1994
A new mini Ball Grid Array (mBGA) multichip module technology
R. Chanchani
,
K. Treece
,
P. Dressendorfer
1994
Corpus ID: 108910012
A new die-level packaging technology, mBGA, is reported in this paper. The mBGA enables high circuit packaging density on…
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