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Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… 
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Papers overview

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2012
2012
Rice is one of the oldest cultivated crops and most staple food crop for more than a third of the world's population. It is the… 
Highly Cited
2011
Highly Cited
2011
A 2.4 GHz outphasing power amplifier (PA) is implemented in a 32 nm CMOS process. An inverter-based class-D PA topology is… 
Highly Cited
2010
Highly Cited
2010
A 0.12-µm SiGe phased-array Rx IC for beam-steered wireless communication in the 60-GHz band is described. It has 16 RF phase… 
2009
2009
The k-nearest neighbor (k-NN) algorithm is commonly used in applications of classifiers and data mining and the related area due… 
2007
2007
The solder-joint reliability of plastic ball grid array (PBGA) packages for an avionics application was assessed. The fatigue… 
Highly Cited
2006
Highly Cited
2006
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and… 
2005
2005
The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s OverMolded… 
2005
2005
With increasing attention on component damage caused by motherboard flexure during manufacturing processes, strain-based…