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Ball grid array
Known as:
Plastic ball grid array
, LFBGA
, ΜFCBGA
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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently…
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50 relations
AMD 580 chipset series
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Highly Cited
2011
Highly Cited
2011
A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application
Hongtao Xu
,
Y. Palaskas
,
A. Ravi
,
M. Sajadieh
,
Mohammed A. El-Tanani
,
K. Soumyanath
IEEE Journal of Solid-State Circuits
2011
Corpus ID: 33860370
A 2.4 GHz outphasing power amplifier (PA) is implemented in a 32 nm CMOS process. An inverter-based class-D PA topology is…
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2011
2011
A discrete shuffled frog optimization algorithm
M. Vakil-Baghmisheh
,
Katayoun Madani
,
A. Navarbaf
Artificial Intelligence Review
2011
Corpus ID: 29825992
The shuffled frog leaping (SFL) optimization algorithm has been successful in solving a wide range of real-valued optimization…
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2009
2009
Medical data mining using BGA and RGA for weighting of features in fuzzy k-NN classification
Ping-Hung Tang
,
Ming-Hseng Tseng
International Conference on Machine Learning and…
2009
Corpus ID: 20761121
The k-nearest neighbor (k-NN) algorithm is commonly used in applications of classifiers and data mining and the related area due…
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2007
2007
Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications
H. Qi
,
M. Osterman
,
M. Pecht
IEEE transactions on components and packaging…
2007
Corpus ID: 7462433
The solder-joint reliability of plastic ball grid array (PBGA) packages for an avionics application was assessed. The fatigue…
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2007
2007
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging
J. Koo
,
Seung-Boo Jung
Microelectronics and reliability
2007
Corpus ID: 39045702
2005
2005
Plastic Ball Grid Array (PBGA)
A. Mawer
2005
Corpus ID: 113013219
The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s OverMolded…
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2005
2005
Flip chip ball grid array component testing under board flexure
G. Hsieh
,
A. Mcallister
Proceedings Electronic Components and Technology…
2005
Corpus ID: 10694638
With increasing attention on component damage caused by motherboard flexure during manufacturing processes, strain-based…
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Review
2004
Review
2004
Reliability issues for flip-chip packages
P. Ho
,
Guotao Wang
,
Min Ding
,
Jie-Hua Zhao
,
X. Dai
Microelectronics and reliability
2004
Corpus ID: 31058063
Highly Cited
2004
Highly Cited
2004
A multiagent genetic algorithm for global numerical optimization
Weicai Zhong
,
Jing Liu
,
M. Xue
,
Licheng Jiao
IEEE Transactions on Systems, Man, and…
2004
Corpus ID: 38545220
In this paper, multiagent systems and genetic algorithms are integrated to form a new algorithm, multiagent genetic algorithm…
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Highly Cited
1997
Highly Cited
1997
A Real Coded Genetic Algorithm with an Explorer and an Exploiter Populations
S. Tsutsui
,
Ashish Ghosh
,
D. Corne
,
Y. Fujimoto
International Conference on Genetic Algorithms
1997
Corpus ID: 18436038
We introduce the concept of a bi-population scheme for real-coded GAs (bGAs) consisting of an explorer sub-GA and an exploiter…
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