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Ball grid array

Known as: Plastic ball grid array, LFBGA, ΜFCBGA 
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Role of blue green algae in rice productivity.
Rice is one of the oldest cultivated crops and most staple food crop for more than a third of the world's population. It is the… 
Highly Cited
2011
Highly Cited
2011
A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application
A 2.4 GHz outphasing power amplifier (PA) is implemented in a 32 nm CMOS process. An inverter-based class-D PA topology is… 
Highly Cited
2010
Highly Cited
2010
A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS
A 0.12-µm SiGe phased-array Rx IC for beam-steered wireless communication in the 60-GHz band is described. It has 16 RF phase… 
2009
2009
Medical data mining using BGA and RGA for weighting of features in fuzzy k-NN classification
The k-nearest neighbor (k-NN) algorithm is commonly used in applications of classifiers and data mining and the related area due… 
2007
2007
Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications
The solder-joint reliability of plastic ball grid array (PBGA) packages for an avionics application was assessed. The fatigue… 
2007
2007
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging
Highly Cited
2006
Highly Cited
2006
The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and… 
2005
2005
Plastic Ball Grid Array (PBGA)
The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s OverMolded… 
2005
2005
Flip chip ball grid array component testing under board flexure
With increasing attention on component damage caused by motherboard flexure during manufacturing processes, strain-based… 
Review
2004
Review
2004
Reliability issues for flip-chip packages
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