Fabrication of Nanowire Anisotropic Conductive Film for Ultra-Fine Pitch Flip Chip Interconnection

@article{Lin2005FabricationON,
  title={Fabrication of Nanowire Anisotropic Conductive Film for Ultra-Fine Pitch Flip Chip Interconnection},
  author={Ren-Jen Lin and Yung-Yu Hsu and Yu-Chih Chen and Syh-Yuh Cheng and R. Uang},
  journal={Proceedings Electronic Components and Technology, 2005. ECTC '05.},
  year={2005},
  pages={66-70}
}
As the prediction that the I/O pitch will decrease from 60 um in 2004 to 20 um beyond 2010 by ITRS roadmap, flip chip interconnection by traditional ACF containing conductive particles with micro-meter size will face more and more challenge. One of many possible solutions is using high aspect-ratio metal posts or flake instead of conductive particles for electrical interconnection between chip and substrate. But this interconnection by metal posts is less reliable compared with elastic… CONTINUE READING

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