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Via (electronics)

Known as: Deep vertical interconnect access, Blind via, DVIA (electronics) 
A via or VIA (Latin for path or way, also known as vertical interconnect access) is an electrical connection between layers in a physical electronic… 
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Related topics

Related topics

33 relations
Annealed pyrolytic graphiteAntifuseBead probe technologyCopper interconnect

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2008
2008
300-Gb/s 24-channel bidirectional Si carrier transceiver Optochip for board-level interconnects
A parallel optical transceiver module with 24-transmitter plus 24-receiver channels has been designed and fabricated. The… 
2007
2007
Carbon Nanotube/Copper Composites for Via Filling and Thermal Management
With excellent current carrying capacity and extremely high thermal conductivity, carbon nanotube (CNT) has been proposed for… 
Highly Cited
2006
Highly Cited
2006
Factors affecting copper filling process within high aspect ratio deep vias for 3D chip stacking
Through-silicon-via (TSV) copper electrodes can provide shortest-length and highest-density connections with reduced signal delay… 
Highly Cited
2005
Highly Cited
2005
Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells [IC interconnect applications]
We have succeeded in lowering the resistance of multi-walled carbon nanotube (MWNT) vias, using parallel channel conduction of… 
Highly Cited
2004
Highly Cited
2004
Targeted layout modifications for semiconductor yield/reliability enhancement
A new layout modification tool for the automation of layout modifications to improve the yield and reliability of semiconductor… 
Highly Cited
1997
Highly Cited
1997
New capabilities of OBIRCH method for fault localization and defect detection
We have improved the optical beam induced resistance change (OBIRCH) method so as to detect (1) a current path as small as 10-50… 
Highly Cited
1983
Highly Cited
1983
Minimum-Via Topological Routing
  • Chi-Ping Hsu
  • IEEE Trans. Comput. Aided Des. Integr. Circuits…
  • 1983
  • Corpus ID: 17126741
A new approach to the two-dimensional routing utilizing two layers is proposed. It consists of two major steps, topological… 
Highly Cited
1983
Highly Cited
1983
Hierarchical Channel Router
Highly Cited
1983
Highly Cited
1983
Hierarchical channel router
The channel routing problem is a special care of the wire routing problem when interconnections have to be performed within a… 
Highly Cited
1975
Highly Cited
1975
Capacitance models for integrated circuit metallization wires
New concepts are introduced relating aspects of circuit theory to the multicapacitances which can be obtained from a computer… 
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