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Via (electronics)

Known as: Deep vertical interconnect access, Blind via, DVIA (electronics) 
A via or VIA (Latin for path or way, also known as vertical interconnect access) is an electrical connection between layers in a physical electronic… 
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Related topics

Related topics

33 relations
Annealed pyrolytic graphiteAntifuseBead probe technologyCopper interconnect

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2009
Highly Cited
2009
Electromigration Failure Distributions of Cu/Low-$k$ Dual-Damascene Vias: Impact of the Critical Current Density and a New Reliability Extrapolation Methodology
We examine the effects of void morphology and critical current density (jc) on the electromigration failure distributions of Cu… 
Review
2008
Review
2008
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
As traditional CMOS scaling becomes progressively more difficult and less beneficial to overall system performance, three… 
Highly Cited
2008
Highly Cited
2008
High aspect ratio TSV copper filling with different seed layers
The paper addresses the through silicon via (TSV) filling using electrochemical deposition (ECD) of copper. The impact of seed… 
Highly Cited
2006
Highly Cited
2006
Factors affecting copper filling process within high aspect ratio deep vias for 3D chip stacking
Through-silicon-via (TSV) copper electrodes can provide shortest-length and highest-density connections with reduced signal delay… 
Highly Cited
2005
Highly Cited
2005
Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells [IC interconnect applications]
We have succeeded in lowering the resistance of multi-walled carbon nanotube (MWNT) vias, using parallel channel conduction of… 
Highly Cited
1990
Highly Cited
1990
An electromagnetic approach for modeling high performance computer packages
Described here is an electromagnetic approach for the analysis of high-performance computer packages such as the thermal… 
Highly Cited
1983
Highly Cited
1983
Minimum-Via Topological Routing
  • C. Hsu
  • IEEE Trans. Comput. Aided Des. Integr. Circuits…
  • 1983
  • Corpus ID: 17126741
A new approach to the two-dimensional routing utilizing two layers is proposed. It consists of two major steps, topological… 
Highly Cited
1983
Highly Cited
1983
Hierarchical channel router
The channel routing problem is a special care of the wire routing problem when interconnections have to be performed within a… 
Highly Cited
1983
Highly Cited
1983
Hierarchical Channel Router
Highly Cited
1975
Highly Cited
1975
Capacitance models for integrated circuit metallization wires
New concepts are introduced relating aspects of circuit theory to the multicapacitances which can be obtained from a computer… 
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