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Via (electronics)

Known as: Deep vertical interconnect access, Blind via, DVIA (electronics) 
A via or VIA (Latin for path or way, also known as vertical interconnect access) is an electrical connection between layers in a physical electronic… 
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Related topics

Related topics

33 relations
Annealed pyrolytic graphiteAntifuseBead probe technologyCopper interconnect

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2009
Highly Cited
2009
Electromigration Failure Distributions of Cu/Low-$k$ Dual-Damascene Vias: Impact of the Critical Current Density and a New Reliability Extrapolation Methodology
We examine the effects of void morphology and critical current density (jc) on the electromigration failure distributions of Cu… 
Highly Cited
2007
Highly Cited
2007
Thin-Film Encapsulated RF MEMS Switches
A wafer-level thin-film encapsulation process has been demonstrated to package radio-frequency (RF) microelectromechanical… 
Highly Cited
2006
Highly Cited
2006
Factors affecting copper filling process within high aspect ratio deep vias for 3D chip stacking
Through-silicon-via (TSV) copper electrodes can provide shortest-length and highest-density connections with reduced signal delay… 
Highly Cited
2005
Highly Cited
2005
Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells [IC interconnect applications]
We have succeeded in lowering the resistance of multi-walled carbon nanotube (MWNT) vias, using parallel channel conduction of… 
Highly Cited
1998
Highly Cited
1998
A>400 GHz f/sub max/ transferred-substrate heterojunction bipolar transistor IC technology
We report transferred-substrate AlInAs/GaInAs bipolar transistors. A device having a 0.6 /spl mu/m/spl times/25 /spl mu/m emitter… 
Highly Cited
1997
Highly Cited
1997
New capabilities of OBIRCH method for fault localization and defect detection
We have improved the optical beam induced resistance change (OBIRCH) method so as to detect (1) a current path as small as 10-50… 
Highly Cited
1990
Highly Cited
1990
An electromagnetic approach for modeling high performance computer packages
Described here is an electromagnetic approach for the analysis of high-performance computer packages such as the thermal… 
Highly Cited
1983
Highly Cited
1983
Minimum-Via Topological Routing
  • Chi-Ping Hsu
  • IEEE Trans. Comput. Aided Des. Integr. Circuits…
  • 1983
  • Corpus ID: 17126741
A new approach to the two-dimensional routing utilizing two layers is proposed. It consists of two major steps, topological… 
Highly Cited
1983
Highly Cited
1983
Hierarchical Channel Router
Highly Cited
1983
Highly Cited
1983
Hierarchical channel router
The channel routing problem is a special care of the wire routing problem when interconnections have to be performed within a… 
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