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Via (electronics)

Known as: Deep vertical interconnect access, Blind via, DVIA (electronics) 
A via or VIA (Latin for path or way, also known as vertical interconnect access) is an electrical connection between layers in a physical electronic… 
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Related topics

Related topics

33 relations
Annealed pyrolytic graphiteAntifuseBead probe technologyCopper interconnect

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Inundações na Cidade de Lisboa durante o Século XX e os seus factores agraventes
INUNDATIONS IN LISBON DURING THE 20TH CENTURY AND THEIR URBANAND PHYSICAL CAUSES. Lisbon often suffers inundations, which must be… 
2011
2011
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs
It is widely-known that coupling exists between adjacent through-silicon vias (TSVs) in 3D ICs. Since this TSV-to-TSV coupling is… 
2011
2011
Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias
3-D integration provides a means to overcome the difficulties in design and manufacturing of system-on-chip (SOC) and memory… 
2010
2010
A compact and low cost elementary radiating cell for satellite broadcasting automotive receiving arrays
In this communication, the printed circuit board implementation of a complete elementary radiating cell for a low profile Ku-band… 
2007
2007
Carbon Nanotube/Copper Composites for Via Filling and Thermal Management
With excellent current carrying capacity and extremely high thermal conductivity, carbon nanotube (CNT) has been proposed for… 
2006
2006
Polymer Optical Interconnects—A Scalable Large-Area Panel Processing Approach
A flexible approach to producing optical interconnects on 609.6$ast ,$609.6 mm large-area panels is demonstrated. Stepwise… 
2005
2005
Thermal performance of collector-up HBTs for small high-power amplifiers with a novel thermal via structure underneath the HBT fingers
We will describe the thermal performance of a special heterojunction bipolar transistor (HBT) structure for mobile communication… 
2002
2002
Superconformal Electrodeposition in Vias
Conditions for which superconformal filling of vias can be expected are predicted using the curvature enhanced accelerator… 
1998
1998
Rothko: A Three-Dimensional FPGA
Using transferred circuits and metal interconnections placed between layers of active devices anywhere on the chip, Rothko aims… 
1989
1989
Area-optimal three-layer channel routing
The channel routing problem in the knock-knee mode is considered. The algorithm presented always constructs a correct layout in a…