Via (electronics)

Known as: Deep vertical interconnect access, Blind via, DVIA (electronics) 
A via or VIA (Latin for path or way, also known as vertical interconnect access) is an electrical connection between layers in a physical electronic… (More)
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Papers overview

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Highly Cited
2012
Highly Cited
2012
3D-stacked ICs that employ through-silicon vias (TSVs) to connect multiple dies vertically have gained wide-spread interest in… (More)
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Highly Cited
2010
Highly Cited
2010
Pre-bond test is preferred for a three-dimensional integrated circuit (3D IC), since it reduces stacking yield loss and thus… (More)
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Highly Cited
2009
Highly Cited
2009
Through-Silicon Vias (TSVs) have garnered a lot of interest in recent years because TSV is a key enabling technology for three… (More)
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Highly Cited
2007
Highly Cited
2007
3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC… (More)
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Highly Cited
2006
Highly Cited
2006
The artificial magnetic conductor (AMC) and electromagnetic band gap (EBG) characteristics of planar periodic metallic arrays… (More)
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Highly Cited
2006
Highly Cited
2006
Scaling, for enhanced performance and cost reduction, has pushed existing CMOS materials much closer to their intrinsic… (More)
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Highly Cited
2005
Highly Cited
2005
In this paper, a new approach for the development of planar metamaterial structures is developed. For this purpose, split-ring… (More)
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Highly Cited
2005
Highly Cited
2005
Planar periodic metallic arrays behave as artificial magnetic conductor (AMC) surfaces when placed on a grounded dielectric… (More)
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Highly Cited
2001
Highly Cited
2001
This paper presents a method for analyzing multilayered rectangular and irregular shaped power distribution planes in the… (More)
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Highly Cited
1996
Highly Cited
1996
A nanoimprint process that presses a mold into a thin thermoplastic polymer film on a substrat create vias and trenches with a… (More)
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