Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells [IC interconnect applications]

@article{Nihei2005LowresistanceMC,
  title={Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells [IC interconnect applications]},
  author={Mizuhisa Nihei and Daiyu Kondo and Akio Kawabata and Shintaro Sato and Hideo Shioya and Mamoru Sakaue and Taisuke Iwai and Mari Ohfuti and Yuji Awano},
  journal={Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.},
  year={2005},
  pages={234-236}
}
We have succeeded in lowering the resistance of multi-walled carbon nanotube (MWNT) vias, using parallel channel conduction of each tube's inner shells. By optimizing the structure of the interface between MWNTs and Ti bottom contact layers, we could obtain a via resistance of 0.7 /spl Omega/ for a 2-/spl mu/m-diameter via consisting of about 1000 MWNTs. The corresponding resistance of about 0.7 k/spl Omega/ per MWNT indicates that most of the inner shells contribute to carrier conduction as an… CONTINUE READING
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