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Copper interconnect
Known as:
Copper chip
, Copper-based chips
Copper-based chips are semiconductor integrated circuits which use copper for interconnections in the metalization layer, the BEOL. Since copper is a…
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24 relations
Back end of line
Chemical-mechanical planarization
Deep-level trap
Doping (semiconductor)
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
Precursor Synthesis and Film Formation of Mesoporous Pure Silica Zeolite Low-k Films for ULSI Interconnects
Tadashi Sato
2019
Corpus ID: 139582122
2009
2009
TSV Stress Testing and Modeling for 3D IC Applications
T. Chidambaram
,
C. McDonough
,
R. Geer
,
W. Wang
16th IEEE International Symposium on the Physical…
2009
Corpus ID: 16144993
The stress investigation on through-silicon vias (TSVs) is important for 3D IC development. This work summarizes the stress…
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2009
2009
SENSITIVITY ANALYSIS IN METROLOGY: STUDY AND COMPARISON ON DIFFERENT INDICES FOR MEASUREMENT UNCERTAINTY
A. Allard
,
N. Fischer
2009
Corpus ID: 117066453
2008
2008
PHYSICS BASED FULL-CHIP SCALE MODELING OF COPPER ELECTROCHEMICAL DEPOSITION
R. Ghulghazaryan
,
N. Khachatryan
,
V. Sukharev
2008
Corpus ID: 55443451
Full-chip multi-scale physics based pattern dependent copper electrochemical deposition models are considered.
2008
2008
DFM Based Detailed Routing Algorithm for ECP and CMP
Yinchun Shen
,
Yici Cai
,
Qiang Zhou
,
Xianlong Hong
IEEE International Symposium on Quality…
2008
Corpus ID: 8132780
This paper presents a novel DFM (design for manufacture)-driven detailed routing algorithm that seeks to minimize the thickness…
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2006
2006
A test structure for contact and via failure analysis in deep-submicrometer CMOS technologies
A. Cabrini
,
Daniele Cantarelli
,
+5 authors
G. Torelli
IEEE transactions on semiconductor manufacturing
2006
Corpus ID: 13617719
Reliability and yield of CMOS integrated circuits are becoming more and more dependent on interconnect elements (contacts, vias…
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2003
2003
Determination of worst-case crosstalk noise for non-switching victims in GHz+ interconnects
Jun Chen
,
Lei He
Proceedings of the ASP-DAC Asia and South Pacific…
2003
Corpus ID: 10354411
Considering RLC interconnect model and multiple switching aggressors, we study switching pattern generation and switching time…
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2002
2002
Efficient Coupled Noise Estimation for OnChip Interconnects
Raminderpal Singh
2002
Corpus ID: 61304651
1999
1999
Electrolyte composition monitoring for copper interconnect applications
T. C. Taylor
,
T. Ritzdorf
,
F. Lindberg
,
B. Carpenter
,
M. Lefebvre
1999
Corpus ID: 91212687
Electroplating, widely used for deposition of metal films in electronics applications, is one viable method for effecting copper…
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1995
1995
Optoelectronic Interconnects III
Ray T. Chen
,
H. S. Hinton
1995
Corpus ID: 137183498