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Copper interconnect
Known as:
Copper chip
, Copper-based chips
Copper-based chips are semiconductor integrated circuits which use copper for interconnections in the metalization layer, the BEOL. Since copper is a…
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Related topics
24 relations
Back end of line
Chemical-mechanical planarization
Deep-level trap
Doping (semiconductor)
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
On the feasibility of ab initio electronic structure calculations for Cu using a single s orbital basis
G. Hegde
,
R. Bowen
2015
Corpus ID: 94156559
The accuracy of a single s-orbital representation of Cu towards enabling multi-thousand atom ab initio calculations of electronic…
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2009
2009
SENSITIVITY ANALYSIS IN METROLOGY: STUDY AND COMPARISON ON DIFFERENT INDICES FOR MEASUREMENT UNCERTAINTY
A. Allard
,
N. Fischer
2009
Corpus ID: 117066453
2009
2009
TSV Stress Testing and Modeling for 3D IC Applications
T. Chidambaram
,
C. McDonough
,
R. Geer
,
W. Wang
16th IEEE International Symposium on the Physical…
2009
Corpus ID: 16144993
The stress investigation on through-silicon vias (TSVs) is important for 3D IC development. This work summarizes the stress…
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2006
2006
A test structure for contact and via failure analysis in deep-submicrometer CMOS technologies
A. Cabrini
,
Daniele Cantarelli
,
+5 authors
G. Torelli
IEEE transactions on semiconductor manufacturing
2006
Corpus ID: 13617719
Reliability and yield of CMOS integrated circuits are becoming more and more dependent on interconnect elements (contacts, vias…
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Review
2004
Review
2004
Opportunities and challenges for high-k gate dielectrics
T. Ma
International Symposium on the Physical and…
2004
Corpus ID: 110020612
Some key issues related to the development of high-k dielectric technology, including gate stack processing, formation of…
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2003
2003
Determination of worst-case crosstalk noise for non-switching victims in GHz+ interconnects
Jun Chen
,
Lei He
Proceedings of the ASP-DAC Asia and South Pacific…
2003
Corpus ID: 10354411
Considering RLC interconnect model and multiple switching aggressors, we study switching pattern generation and switching time…
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2002
2002
Efficient Coupled Noise Estimation for OnChip Interconnects
Raminderpal Singh
2002
Corpus ID: 61304651
1999
1999
Electrolyte composition monitoring for copper interconnect applications
T. C. Taylor
,
T. Ritzdorf
,
F. Lindberg
,
B. Carpenter
,
M. Lefebvre
1999
Corpus ID: 91212687
Electroplating, widely used for deposition of metal films in electronics applications, is one viable method for effecting copper…
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1997
1997
Integration of Low-k Dielectric Materials Into Sub-0.25-μm Interconnects
R. S. List
,
Abha Singh
,
A. Ralston
,
G. Dixit
1997
Corpus ID: 164543069
As the dimensions of ultralarge-scale-integration devices scale to smaller feature sizes and larger die dimensions, the…
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1995
1995
Optoelectronic Interconnects III
Ray T. Chen
,
H. S. Hinton
1995
Corpus ID: 137183498