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Chemical-mechanical planarization
Known as:
CMP
, Chemical mechanical planarisation
, Chemical mechanical polish
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Chemical mechanical polishing/planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be…
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Related topics
Related topics
16 relations
Back end of line
Copper interconnect
Etching (microfabrication)
Front end of line
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
Prediction of Material Removal Rate for Chemical Mechanical Planarization Using Decision Tree-Based Ensemble Learning
Zhixiong Li
,
Dazhong Wu
,
Tianyu Yu
Journal of manufacturing science and engineering
2019
Corpus ID: 115518315
Chemical mechanical planarization (CMP) has been widely used in the semiconductor industry to create planar surfaces with a…
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2018
2018
Recurrent feature-incorporated convolutional neural network for virtual metrology of the chemical mechanical planarization process
Ki Bum Lee
,
C. Kim
Journal of Intelligent Manufacturing
2018
Corpus ID: 117308205
In semiconductor manufacturing, the chemical mechanical planarization (CMP) process produces higher thickness variability in the…
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Review
2013
Review
2013
Chemical mechanical polishing: Theory and experiment
Dewen Zhao
,
Xinchun Lu
2013
Corpus ID: 54822056
For several decades, chemical mechanical polishing (CMP) has been the most widely used planarization method in integrated…
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Highly Cited
2007
Highly Cited
2007
Microelectronic Applications of Chemical Mechanical Planarization
Yuzhuo Li
2007
Corpus ID: 60020673
Highly Cited
2007
Highly Cited
2007
Optimization of multi-response processes using the VIKOR method
L. Tong
,
Chi-Chan Chen
,
Chung-Ho Wang
2007
Corpus ID: 56570605
Design of experiments and Taguchi methods are extensively adopted as off-line quality improvement techniques in industry. However…
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Highly Cited
2004
Highly Cited
2004
Single Crystal Nanowire Vertical Surround-Gate Field-Effect Transistor
H. Ng
,
Jie Han
,
Toshishige Yamada
,
P. Nguyen
,
Yi P. Chen
,
M. Meyyappan
2004
Corpus ID: 18315211
Harnessing the potential of single crystal inorganic nanowires for practical advanced nanoscale applications requires not only…
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Highly Cited
2003
Highly Cited
2003
Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification
Jianfeng Luo
,
D. Dornfeld
2003
Corpus ID: 15289545
Recently, a comprehensive model has been developed by Luo and Dornfeld ("Material removal mechanism in chemical mechanical…
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Highly Cited
2002
Highly Cited
2002
Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts
D. Ouma
,
D. Boning
,
+4 authors
A. Crevasse
2002
Corpus ID: 15990457
Chemical-mechanical polishing (CMP) has emerged as the dominant dielectric planarization method due to its ability to reduce…
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Highly Cited
2000
Highly Cited
2000
Chemical Mechanical Planarization of Copper Damascene Structures
P. Wrschka
,
J. Hernández
,
G. Oehrlein
,
J. King
2000
Corpus ID: 36178008
We describe the chemical mechanical planarization (CMP) of copper damascene structures using an IC1400 pad and four different…
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Highly Cited
1997
Highly Cited
1997
Chemical Mechanical Planarization of Microelectronic Materials
J. Steigerwald
,
S. Murarka
,
R. Gutmann
1997
Corpus ID: 111234371
Historical perspective CMP: variables and manipulations electrochemical and mechanical concepts for CMP processes copper CMP CMP…
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