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Chemical-mechanical planarization

Known as: CMP, Chemical mechanical planarisation, Chemical mechanical polish 
Chemical mechanical polishing/planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be… 
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16 relations
Back end of lineCopper interconnectEtching (microfabrication)Front end of line

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2006
2006
Treatment of Chemical-Mechanical Planarization Wastes by Electrocoagulation/Electro-
A method for the treatment of chemical-mechanical planaarization wastewater that utilizes the principles of electroco- agulation… 
2005
2005
Preparation of silica nanospheres : Effect of silicon alkoxide and alcohol on silica nanospheres
Special attention has recently been paid to methods for controlling the nanospheres' size and distribution, because they exhibit… 
2005
2005
Flat, cheap, and under control [electrochemical mechanical planarization]
This paper describes Applied Material's wafer polishing technology, called electrochemical mechanical planarization (ECMP). ECMP… 
2005
2005
Modeling of dielectric erosion and copper dishing in copper chemical-mechanical polishing
  • K. Noh
  • 2005
  • Corpus ID: 136711443
2003
2003
Axiomatic system design : chemical mechanical polishing machine case study
Axiomatic design is investigated as a design methodology for large or complex system design. Particular considerations of system… 
2002
2002
Modeling of chemical mechanical polishing for shallow trench isolation
Chemical mechanical polishing (CMP) is a key process enabling shallow trench isolation (STI), which is used in current integrated… 
2001
2001
MODELING OF PATTERN DEPENDENCIES FOR MULTI-LEVEL COPPER CHEMICAL-MECHANICAL POLISHING PROCESSES
We propose an integrated contact mechanics and density-step-height model of pattern dependencies for the chemical-mechanical… 
2000
2000
USING SMART DUMMY FILL AND SELECTIVE REVERSE ETCHBACK FOR PATTERN DENSITY EQUALIZATION
The techniques of dummy fill and reverse etchback are often used prior to a chemical mechanical polishing (CMP) process to… 
2000
2000
Mechanical interactions at the interface of chemical mechanical polishing
1994
1994
Planarisation of spatial light modulator silicon backplanes using chemical-mechanical polishing