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Chemical-mechanical planarization

Known as: CMP, Chemical mechanical planarisation, Chemical mechanical polish 
Chemical mechanical polishing/planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be… Expand
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Papers overview

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Review
2013
Review
2013
For several decades, chemical mechanical polishing (CMP) has been the most widely used planarization method in integrated… Expand
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Highly Cited
2007
Highly Cited
2007
Highly Cited
2007
Design of experiments and Taguchi methods are extensively adopted as off-line quality improvement techniques in industry. However… Expand
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Highly Cited
2004
Highly Cited
2004
Harnessing the potential of single crystal inorganic nanowires for practical advanced nanoscale applications requires not only… Expand
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Highly Cited
2004
Highly Cited
2004
We demonstrate seamless direct integration of a semiconductor nanowire grown using a bottom-up approach to obtain a vertical… Expand
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Highly Cited
2003
Highly Cited
2003
Recently, a comprehensive model has been developed by Luo and Dornfeld ("Material removal mechanism in chemical mechanical… Expand
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Highly Cited
2002
Highly Cited
2002
Chemical-mechanical polishing (CMP) has emerged as the dominant dielectric planarization method due to its ability to reduce… Expand
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Highly Cited
2000
Highly Cited
2000
We describe the chemical mechanical planarization (CMP) of copper damascene structures using an IC1400 pad and four different… Expand
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Highly Cited
2000
Highly Cited
2000
The effects of kinematic variables on the nonuniformity of the wafer in chemical mechanical planarization (CMP) are investigated… Expand
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Highly Cited
1997
Highly Cited
1997
Historical perspective CMP: variables and manipulations electrochemical and mechanical concepts for CMP processes copper CMP CMP… Expand
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