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Chemical-mechanical planarization
Known as:
CMP
, Chemical mechanical planarisation
, Chemical mechanical polish
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Chemical mechanical polishing/planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be…
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Related topics
Related topics
16 relations
Back end of line
Copper interconnect
Etching (microfabrication)
Front end of line
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2008
Highly Cited
2008
A Nanodamascene Process for Advanced Single-Electron Transistor Fabrication
C. Dubuc
,
J. Beauvais
,
D. Drouin
IEEE transactions on nanotechnology
2008
Corpus ID: 35334936
A process design based on a nanowire structure is demonstrated with the fabrication of metallic single-electron transistors. The…
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Highly Cited
2006
Highly Cited
2006
Magnetorheological Jet (MR JetTM) Finishing Technology
W. Kordonski
,
A. Shorey
,
M. Tricard
2006
Corpus ID: 14852031
Conformal (or free form) and steep concave optics are important classes of optics that are difficult to finish using conventional…
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Highly Cited
2004
Highly Cited
2004
Direct integration of metal oxide nanowire in vertical field-effect transistor
P. Nguyen
,
H. Ng
,
+4 authors
M. Meyyappan
2004
Corpus ID: 17810994
We demonstrate seamless direct integration of a semiconductor nanowire grown using a bottom-up approach to obtain a vertical…
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2004
2004
Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP
Z. Li
,
L. Borucki
,
I. Koshiyama
,
A. Philipossian
2004
Corpus ID: 54650929
cFujimi Incorporated, Kagamigahara, Gifu Prefecture 509-0108, Japan Chemical mechanical polishing of copper is examined…
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Highly Cited
2003
Highly Cited
2003
High quality Nb-based tunnel junctions for high frequency and digital applications
P. Dmitriev
,
I. Lapitskaya
,
+5 authors
V. Koshelets
2003
Corpus ID: 59390528
A number of new fabrication techniques are developed and optimized in order to fit the requirements of contemporary…
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Highly Cited
2003
Highly Cited
2003
Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications
J. Vella
,
I. Adhihetty
,
K. Junker
,
A. Volinsky
2003
Corpus ID: 41441631
The integration of chemical vapor deposited organo-silicate glass (OSG) interlayer dielectrics (ILD) has challenged the IC…
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Highly Cited
2001
Highly Cited
2001
Three-Dimensional Chemical Mechanical Planarization Slurry Flow Model Based on Lubrication Theory
D. Thakurta
,
C. Borst
,
D. Schwendeman
,
R. Gutmann
,
W. Gill
2001
Corpus ID: 13251749
A three-dimensional chemical mechanical planarization slurry flow model based upon lubrication theory is developed, utilizing a…
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Highly Cited
2000
Highly Cited
2000
Chemical Mechanical Planarization of Copper Damascene Structures
P. Wrschka
,
J. Hernández
,
G. Oehrlein
,
J. King
2000
Corpus ID: 36178008
We describe the chemical mechanical planarization (CMP) of copper damascene structures using an IC1400 pad and four different…
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Review
1999
Review
1999
Filling algorithms and analyses for layout density control
A. Kahng
,
G. Robins
,
Anish Singh
,
A. Zelikovsky
IEEE Trans. Comput. Aided Des. Integr. Circuits…
1999
Corpus ID: 2860316
In very deep-submicron very large scale integration (VLSI), manufacturing steps involving chemical-mechanical polishing (CMP…
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1991
1991
Semi-Empirical Modelling of Si02 Chemical-Mechanical Polishing: Planarization
P. Burke
1991
Corpus ID: 136419191
This paper describes process characterization techniques and key structural dependencies of chemical-mechanical polishing (CMP…
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