Skip to search formSkip to main content
You are currently offline. Some features of the site may not work correctly.

Chemical-mechanical planarization

Known as: CMP, Chemical mechanical planarisation, Chemical mechanical polish 
Chemical mechanical polishing/planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be… Expand
Wikipedia

Related topics

Related topics

16 relations
Back end of lineCopper interconnectEtching (microfabrication)Front end of line
Expand

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2007
Highly Cited
2007
Microelectronic Applications of Chemical Mechanical Planarization
 
Is this relevant?
Highly Cited
2007
Highly Cited
2007
Optimization of multi-response processes using the VIKOR method
Design of experiments and Taguchi methods are extensively adopted as off-line quality improvement techniques in industry. However… Expand
  • table 1
  • table 2
  • table 3
  • figure 1
  • figure 2
Is this relevant?
Highly Cited
2003
Highly Cited
2003
Analysis and Application of Grey Relation and ANOVA in Chemical–Mechanical Polishing Process Parameters
The parameters for chemical–mechanical polishing (CMP) in an ultra-large scale integrated (ULSI) planarisation process are… Expand
  • figure 1
Is this relevant?
Highly Cited
2003
Highly Cited
2003
Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification
Recently, a comprehensive model has been developed by Luo and Dornfeld ("Material removal mechanism in chemical mechanical… Expand
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 6
Is this relevant?
Highly Cited
2003
Highly Cited
2003
Some observations on the wear of diamond tools in ultra-precision cutting of single-crystal silicon
Abstract Single-crystal silicon is not only a dominant substrate material for the fabrication of micro-electro and micro… Expand
  • figure 1
  • figure 3
  • table 1
  • figure 4
  • figure 5
Is this relevant?
Highly Cited
2002
Highly Cited
2002
Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts
Chemical-mechanical polishing (CMP) has emerged as the dominant dielectric planarization method due to its ability to reduce… Expand
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
Highly Cited
2000
Highly Cited
2000
Effects of kinematic variables on nonuniformity in chemical mechanical planarization
The effects of kinematic variables on the nonuniformity of the wafer in chemical mechanical planarization (CMP) are investigated… Expand
  • figure 1
  • figure 2
  • figure 2
  • figure 2
  • figure 3
Is this relevant?
2000
2000
Chemical Mechanical Planarization of Copper Damascene Structures
We describe the chemical mechanical planarization (CMP) of copper damascene structures using an IC1400 pad and four different… Expand
  • figure 1
  • figure 2
  • table I
  • figure 3
  • figure 4
Is this relevant?
Highly Cited
1998
Highly Cited
1998
Large area high density quantized magnetic disks fabricated using nanoimprint lithography
A new low-cost, high throughput method was developed for fabricating large area quantized magnetic disks (QMDs) using nanoimprint… Expand
  • figure 1
  • figure 3
  • figure 4
  • figure 2
  • figure 5
Is this relevant?
Highly Cited
1997
Highly Cited
1997
Chemical Mechanical Planarization of Microelectronic Materials
Historical perspective CMP: variables and manipulations electrochemical and mechanical concepts for CMP processes copper CMP CMP… Expand
  • table 1.1
  • table 13
  • table 1.4
  • figure 1.1
Is this relevant?
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy, Terms of Service, and Dataset License
ACCEPT & CONTINUE