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Chemical-mechanical planarization

Known as: CMP, Chemical mechanical planarisation, Chemical mechanical polish 
Chemical mechanical polishing/planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be… Expand
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Related topics

16 relations
Back end of lineCopper interconnectEtching (microfabrication)Front end of line
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Review
2013
Review
2013
Chemical mechanical polishing: Theory and experiment
For several decades, chemical mechanical polishing (CMP) has been the most widely used planarization method in integrated… Expand
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Highly Cited
2007
Highly Cited
2007
Microelectronic Applications of Chemical Mechanical Planarization
Highly Cited
2007
Highly Cited
2007
Optimization of multi-response processes using the VIKOR method
Design of experiments and Taguchi methods are extensively adopted as off-line quality improvement techniques in industry. However… Expand
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Highly Cited
2004
Highly Cited
2004
Single Crystal Nanowire Vertical Surround-Gate Field-Effect Transistor
Harnessing the potential of single crystal inorganic nanowires for practical advanced nanoscale applications requires not only… Expand
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Highly Cited
2004
Highly Cited
2004
Direct integration of metal oxide nanowire in vertical field-effect transistor
We demonstrate seamless direct integration of a semiconductor nanowire grown using a bottom-up approach to obtain a vertical… Expand
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Highly Cited
2003
Highly Cited
2003
Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification
Recently, a comprehensive model has been developed by Luo and Dornfeld ("Material removal mechanism in chemical mechanical… Expand
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Highly Cited
2002
Highly Cited
2002
Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts
Chemical-mechanical polishing (CMP) has emerged as the dominant dielectric planarization method due to its ability to reduce… Expand
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Highly Cited
2000
Highly Cited
2000
Chemical Mechanical Planarization of Copper Damascene Structures
We describe the chemical mechanical planarization (CMP) of copper damascene structures using an IC1400 pad and four different… Expand
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Highly Cited
2000
Highly Cited
2000
Effects of kinematic variables on nonuniformity in chemical mechanical planarization
The effects of kinematic variables on the nonuniformity of the wafer in chemical mechanical planarization (CMP) are investigated… Expand
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Highly Cited
1997
Highly Cited
1997
Chemical Mechanical Planarization of Microelectronic Materials
Historical perspective CMP: variables and manipulations electrochemical and mechanical concepts for CMP processes copper CMP CMP… Expand
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