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Chemical-mechanical planarization

Known as: CMP, Chemical mechanical planarisation, Chemical mechanical polish 
Chemical mechanical polishing/planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
Chemical mechanical planarization (CMP) has been widely used in the semiconductor industry to create planar surfaces with a… 
2018
2018
In semiconductor manufacturing, the chemical mechanical planarization (CMP) process produces higher thickness variability in the… 
Review
2013
Review
2013
For several decades, chemical mechanical polishing (CMP) has been the most widely used planarization method in integrated… 
Highly Cited
2007
Highly Cited
2007
Highly Cited
2007
Design of experiments and Taguchi methods are extensively adopted as off-line quality improvement techniques in industry. However… 
Highly Cited
2004
Highly Cited
2004
Harnessing the potential of single crystal inorganic nanowires for practical advanced nanoscale applications requires not only… 
Highly Cited
2003
Highly Cited
2003
Recently, a comprehensive model has been developed by Luo and Dornfeld ("Material removal mechanism in chemical mechanical… 
Highly Cited
2002
Highly Cited
2002
Chemical-mechanical polishing (CMP) has emerged as the dominant dielectric planarization method due to its ability to reduce… 
Highly Cited
2000
Highly Cited
2000
We describe the chemical mechanical planarization (CMP) of copper damascene structures using an IC1400 pad and four different… 
Highly Cited
1997
Highly Cited
1997
Historical perspective CMP: variables and manipulations electrochemical and mechanical concepts for CMP processes copper CMP CMP…