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Chemical-mechanical planarization

Known as: CMP, Chemical mechanical planarisation, Chemical mechanical polish 
Chemical mechanical polishing/planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be… 
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Related topics

Related topics

16 relations
Back end of lineCopper interconnectEtching (microfabrication)Front end of line

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2008
Highly Cited
2008
A Nanodamascene Process for Advanced Single-Electron Transistor Fabrication
A process design based on a nanowire structure is demonstrated with the fabrication of metallic single-electron transistors. The… 
Highly Cited
2006
Highly Cited
2006
Magnetorheological Jet (MR JetTM) Finishing Technology
Conformal (or free form) and steep concave optics are important classes of optics that are difficult to finish using conventional… 
Highly Cited
2004
Highly Cited
2004
Direct integration of metal oxide nanowire in vertical field-effect transistor
We demonstrate seamless direct integration of a semiconductor nanowire grown using a bottom-up approach to obtain a vertical… 
2004
2004
Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP
cFujimi Incorporated, Kagamigahara, Gifu Prefecture 509-0108, Japan Chemical mechanical polishing of copper is examined… 
Highly Cited
2003
Highly Cited
2003
High quality Nb-based tunnel junctions for high frequency and digital applications
A number of new fabrication techniques are developed and optimized in order to fit the requirements of contemporary… 
Highly Cited
2003
Highly Cited
2003
Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications
The integration of chemical vapor deposited organo-silicate glass (OSG) interlayer dielectrics (ILD) has challenged the IC… 
Highly Cited
2001
Highly Cited
2001
Three-Dimensional Chemical Mechanical Planarization Slurry Flow Model Based on Lubrication Theory
A three-dimensional chemical mechanical planarization slurry flow model based upon lubrication theory is developed, utilizing a… 
Highly Cited
2000
Highly Cited
2000
Chemical Mechanical Planarization of Copper Damascene Structures
We describe the chemical mechanical planarization (CMP) of copper damascene structures using an IC1400 pad and four different… 
Review
1999
Review
1999
Filling algorithms and analyses for layout density control
In very deep-submicron very large scale integration (VLSI), manufacturing steps involving chemical-mechanical polishing (CMP… 
1991
1991
Semi-Empirical Modelling of Si02 Chemical-Mechanical Polishing: Planarization
This paper describes process characterization techniques and key structural dependencies of chemical-mechanical polishing (CMP… 
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