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Chemical-mechanical planarization

Known as: CMP, Chemical mechanical planarisation, Chemical mechanical polish 
Chemical mechanical polishing/planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be… 
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Papers overview

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Highly Cited
2011
Highly Cited
2011
We present the successful fabrication of capacitive micromachined ultrasonic transducers (CMUTs) with an improved insulation… 
Highly Cited
2006
Highly Cited
2006
Conformal (or free form) and steep concave optics are important classes of optics that are difficult to finish using conventional… 
Highly Cited
2004
Highly Cited
2004
We demonstrate seamless direct integration of a semiconductor nanowire grown using a bottom-up approach to obtain a vertical… 
2004
2004
cFujimi Incorporated, Kagamigahara, Gifu Prefecture 509-0108, Japan Chemical mechanical polishing of copper is examined… 
Highly Cited
2003
Highly Cited
2003
A number of new fabrication techniques are developed and optimized in order to fit the requirements of contemporary… 
Highly Cited
2000
Highly Cited
2000
We describe the chemical mechanical planarization (CMP) of copper damascene structures using an IC1400 pad and four different… 
Highly Cited
2000
Highly Cited
2000
Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself… 
2000
2000
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and… 
Review
1999
Review
1999
In very deep-submicron very large scale integration (VLSI), manufacturing steps involving chemical-mechanical polishing (CMP… 
Highly Cited
1998
Highly Cited
1998
A new low-cost, high throughput method was developed for fabricating large area quantized magnetic disks (QMDs) using nanoimprint…