Front end of line

Known as: FEOL, Front-end-of-line 
The front-end-of-line (FEOL) is the first portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) are… (More)
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Papers overview

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2017
2017
By splitting the manufacturing of integrated circuits into back-end-of-line (BEOL) and front-end-of-line (FEOL) at different… (More)
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2017
2017
Article history: Received 21 May 2017 Received in revised form 11 June 2017 Accepted 20 June 2017 Available online xxxx This… (More)
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2016
2016
This paper proposes a methodology to determine a realistic time-dependent dielectric breakdown failure rate. The in-die constant… (More)
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2012
2012
In this paper, the controlled I-V (IVctrl) method is adopted for the barrier integrity characterization of TSVs at wafer level… (More)
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2012
2012
We present a simple test structure to measure C-V and I-V curves of the same nominal size FET. The structure is simple enough to… (More)
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2011
2011
We report on Front-End-Of-Line Quadrature-clocked Voltage-dependent Capacitance Measurement (QVCM), a charge based capacitance… (More)
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2009
2009
Process variation as a major concern in the current and future generations of CMOS circuits manufacturing has imposed a great… (More)
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2009
2009
We have developed a complete process module for fabricating front end of line (FEOL) through silicon vias (TSVs). In this paper… (More)
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2007
2007
Carbon is proposed as a new FEOL material with high conductivity and thermal stability for CMOS integration. Here the application… (More)
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2003
2003
A fourth material for Si-technology other than silicon, silicon oxide and nitride is introduced in FEOL processing: thermally… (More)
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