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Front end of line

Known as: FEOL, Front-end-of-line 
The front-end-of-line (FEOL) is the first portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) are… Expand
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Papers overview

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2017
2017
By splitting the manufacturing of integrated circuits into back-end-of-line (BEOL) and front-end-of-line (FEOL) at different… Expand
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Highly Cited
2015
Highly Cited
2015
The threats of reverse-engineering, IP piracy, and hardware Trojan insertion in the semiconductor supply chain are greater today… Expand
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2014
2014
Split fabrication, the process of splitting an IC into an untrusted and trusted tier, facilitates access to the most advanced… Expand
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2013
2013
In this work we evaluate the impact of TSV processing and proximity on transistor performance and reliability by monitoring key… Expand
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Highly Cited
2012
Highly Cited
2012
An integrated voltage regulator (IVR) is presented that uses custom fabricated thin-film magnetic power inductors. The inductors… Expand
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Highly Cited
2010
Highly Cited
2010
As scaling becomes increasingly difficult, 3D integration has emerged as a viable alternative to achieve the requisite bandwidth… Expand
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2009
2009
Through Silicon Via (TSV) is a very attractive solution for 3D stacking. Currently the main technique in industrial TSV processes… Expand
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Highly Cited
2008
Highly Cited
2008
We report for the first time the demonstration of 3D integrated circuits obtained by die-to-die stacking using Cu Through Silicon… Expand
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2007
2007
Carbon is proposed as a new FEOL material with high conductivity and thermal stability for CMOS integration. Here the application… Expand
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Highly Cited
2006
Highly Cited
2006
DIAGNOSIX is a comprehensive fault diagnosis methodology for characterizing failures in digital ICs. Using limited layout… Expand
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