Through-silicon via

Known as: Through silicon via 
In electronic engineering, a through-silicon via (TSV) is a vertical electrical connection (via) passing completely through a silicon wafer or die… (More)
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Topic mentions per year

Topic mentions per year

2006-2016
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Papers overview

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2011
2011
The effects of through-silicon via (TSV) depletion are analyzed based on the frequency- and time-domain measurements in this… (More)
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2011
2011
Through-silicon via (TSV) is an important enabler for future 3-D integration of integrated circuits. TSV typically contains a… (More)
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2010
2010
Three different shielding structures for noise coupling suppression between through silicon vias (TSVs) are proposed in this… (More)
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2009
2009
Through silicon via (TSV) is a promising vertical interconnection method to achieve a 3-dimensional integrated circuit (3D IC… (More)
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2009
2009
Though silicon vias filled by pulse reversal current, and influences of frequency of pulse current and reverse current density… (More)
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2009
2009
Various holes in through-silicon via (TSV) technologies are analyzed and realized by Inductively Coupled Plasma (ICP) process… (More)
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2008
2008
Increasing demands for electronic devices with superior performance and functionality while reducing their sizes and weight has… (More)
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2008
2008
The highest integration density of microsystems can be obtained using a 3D-stacking approach, where each layer of the stack is… (More)
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2008
2008
3D integration is a rapidly growing topic in the semiconductor industry that encompasses different types of technologies. The… (More)
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Highly Cited
2006
Highly Cited
2006
Through silicon via and 3D wafer/chip stacking technology is thought to be the essential technology of the next generation high… (More)
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