Skip to search formSkip to main contentSkip to account menu

Through-silicon via

Known as: TSV, Through silicon via, Through-silicon via (TSV) 
In electronic engineering, a through-silicon via (TSV) is a vertical electrical connection (via) passing completely through a silicon wafer or die… 
Wikipedia (opens in a new tab)

Related topics

Related topics

16 relations
Back-illuminated sensorDeep reactive-ion etchingDie (integrated circuit)Electrical connection

Broader (1)

Semiconductor device fabrication

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2016
Highly Cited
2016
InFO (Wafer Level Integrated Fan-Out) Technology
A powerful integrated fan-out (InFO) wafer level system integration (WLSI) technology has been developed to integrate application… 
Highly Cited
2014
Highly Cited
2014
25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV
Increasing demand for higher-bandwidth DRAM drive TSV technology development. With the capacity of fine-pitch wide I/O [1], DRAM… 
Highly Cited
2011
Highly Cited
2011
Reliability challenges in 3D IC packaging technology
Highly Cited
2011
Highly Cited
2011
A 1.2V 12.8GB/s 2Gb mobile Wide-I/O DRAM with 4×128 I/Os using TSV-based stacking
Mobile DRAM is widely employed in portable electronic devices due to its feature of low power consumption. Recently, as the… 
Highly Cited
2011
Highly Cited
2011
A 1.2 V 12.8 GB/s 2 Gb Mobile Wide-I/O DRAM With 4 $\times$ 128 I/Os Using TSV Based Stacking
A 1.2 V 1 Gb mobile SDRAM, having 4 channels with 512 DQ pins has been developed with 50 nm technology. It exhibits 330.6 mW read… 
Highly Cited
2010
Highly Cited
2010
Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs
Three-dimensional ICs provide a promising option to build high-performance compact SoCs by stacking one or more chips vertically… 
Highly Cited
2009
Highly Cited
2009
Thermal management of 3D IC integration with TSV (through silicon via)
Thermal performances of 3D stacked TSV (through silicon via) chips filled with copper are investigated based on heat-transfer CFD… 
Highly Cited
2009
Highly Cited
2009
High-Density Through Silicon Vias for 3-D LSIs
High density through silicon via (TSV) is a key in fabricating three-dimensional (3-D) large-scale integration (LSI). We have… 
2009
2009
Through silicon via (TSV) equalizer
Through silicon via (TSV) is a promising vertical interconnection method to achieve a 3-dimensional integrated circuit (3D IC… 
Review
2008
Review
2008
Three-dimensional silicon integration
Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs), thinned silicon, and silicon-to… 
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy (opens in a new tab), Terms of Service (opens in a new tab), and Dataset License (opens in a new tab)