Deep reactive-ion etching

Known as: Bosch process (microtechnology), DRIE, Bosch process 
Deep reactive-ion etching (DRIE) is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers… (More)
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Etching (microfabrication)Semiconductor device fabrication
Integrated circuitMicroelectromechanical systemsReactive-ion etchingThrough-silicon via

Papers overview

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2010
2010
Fabrication of micro / nano dual-scale structures by improved deep reactive ion etching
We present an integrated microand nanofabrication method to create micro/nano dual-scale silicon structures with a controllable… (More)
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2007
2007
Tapered Deep Reactive Ion Etching: Method and Characterization
This work presents a method for etching tapered sidewalls in silicon using deep reactive ion etching. The method is based on… (More)
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2005
2005
Deep reactive ion etching of pyrex glass using a bonded silicon wafer as an etching mask
A new dry-etching method for fabricating an anisotropic deep groove in Pyrex/sup /spl reg// glass is described. In the method, a… (More)
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2004
2004
Planarize the sidewall ripples of silicon deep reactive ion etching
In order to diminish the sidewall defects in silicon deep reactive ion etching process, depositing doped silicon dioxide and post… (More)
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2004
2004
Analysis of sidewall quality in through-wafer deep reactive-ion etching
The quality of channel sidewalls resulting from through-wafer deep reactive-ion etching is analysed using scanning electron… (More)
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2003
2003
Microfabrication of 3 D silicon MEMS structures using grayscale lithography and deep reactive ion etching
Micromachining arbitrary 3D silicon structures for micro-electromechanical systems can be accomplished using gray-scale… (More)
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2003
2003
Critical aspect ratio dependence in deep reactive ion etching of silicon
Aspect ratio dependent etching and microloading effects are two mechanisms leading to non-uniformities in the etching of silicon… (More)
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2001
2001
Deep reactive ion etching of silicon carbide
  • S. Tanakaa
  • 2001
In this article, we describe more than 100mm-deep reactive ion etching ~RIE! of silicon carbide ~SiC! in oxygen-added sulfur… (More)
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2001
2001
High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass
This paper reports a new fabrication technology of Pyrex glass with a fine pitch electrical feedthrough. Small through holes (40… (More)
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2000
2000
Deep reactive ion etching for lateral field emission devices
The authors describe the design, fabrication and testing of lateral field emission diodes utilizing the deep reactive ion etch… (More)
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