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Thermocompression bonding

Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression… 
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Related topics

Related topics

12 relations
CMOSChemical-mechanical planarizationCompliant bondingCopper interconnect

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Modeling, design and demonstration of low-temperature, low-pressure and high-throughput thermocompression bonding of copper interconnections without solders
High-throughput assembly technologies to form Copper (Cu) interconnections without solders at below 200°C, and pitch below 40μm… 
2015
2015
Impact of SiO2 on Al–Al thermocompression wafer bonding
Al–Al thermocompression bonding suitable for wafer level sealing of MEMS devices has been investigated. This paper presents a… 
2012
2012
2.5D Micromachined 240 GHz Cavity-Backed Coplanar Waveguide to Rectangular Waveguide Transition
A novel cavity-backed coplanar waveguide (CBCPW) to rectangular waveguide transition having a 2.5D geometry compatible with… 
Highly Cited
2010
Highly Cited
2010
Fine pitch chip interconnection technology for 3D integration
3D-IC packaging using through silicon via technology has been extensively developed to meet small form factor and low power… 
2010
2010
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermocompression bonding
In this paper we report on the use of Silicon wafer to wafer bonding technology using Trough Silicon Vias (TSV) and Cu to Cu… 
2010
2010
Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding
We report recent advances in tool and process hardening of a first of its kind 300 mm wafer-to-wafer (WtW) preprocessing… 
2009
2009
Back-Action Evading Measurements of Nanomechanical Motion Approaching Quantum Limits
Title of dissertation: BACK-ACTION EVADING MEASUREMENTS OF NANOMECHANICAL MOTION APPROACHING QUANTUM LIMITS Jared B. Hertzberg… 
2008
2008
Low Temperature Copper-Copper Thermocompression Bonding
Successful direct copper thermocompression bonding was demonstrated at room temperature under ambient environment, yielding shear… 
2007
2007
Self-assembled monolayers for reduced temperature direct metal thermocompression bonding
A reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression bonding is observed by coating a… 
2007
2007
Investigation of Fine Pitch Chip on Glass with Au-Sn Thermocompression Bonding
Au-Sn thermocompression interconnect technique using nonconductive film (NCF) is proposed to solve the insulation problem between… 
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