Thermocompression bonding

Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression… (More)
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2017
2017
MEMS atomic vapor cells have a large variety of applications in atomic devices such as chip-scale atomic clocks (CSACs), atomic… (More)
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2015
2015
Thermocompression (TC) bonding is seen as the next-generation packaging technology that will enable faster and more energy… (More)
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2015
2015
High-throughput assembly technologies to form Copper (Cu) interconnections without solders at below 200°C, and pitch below 40μm… (More)
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2014
2014
Low temperature bonding technology has been a research hotspot in recent years due to its success of avoiding impurities… (More)
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2013
2013
Al–Al thermocompression bonding has been studied using test structures relevant for wafer level sealing of MEMS devices. Si… (More)
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2011
2011
In this study we successfully bonded silicon wafer substrates with metal based thermocompression technology. This technology has… (More)
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2010
2010
In this paper we report on the use of Silicon wafer to wafer bonding technology using Trough Silicon Vias (TSV) and Cu to Cu… (More)
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2008
2008
Successful direct copper thermocompression bonding was demonstrated at room temperature under ambient environment, yielding shear… (More)
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2008
2008
Thermocompression bonding of InP lasers to 4 mum thick SOI waveguides has been demonstrated. Good horizontal alignment is… (More)
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2004
2004
Thermocompression bonding joins substrates via a bonding layer. In this paper, silicon substrates were bonded using gold thin… (More)
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