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Thermocompression bonding

Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression… 
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Related topics

Related topics

12 relations
CMOSChemical-mechanical planarizationCompliant bondingCopper interconnect

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Modeling, design and demonstration of low-temperature, low-pressure and high-throughput thermocompression bonding of copper interconnections without solders
High-throughput assembly technologies to form Copper (Cu) interconnections without solders at below 200°C, and pitch below 40μm… 
2012
2012
2.5D Micromachined 240 GHz Cavity-Backed Coplanar Waveguide to Rectangular Waveguide Transition
A novel cavity-backed coplanar waveguide (CBCPW) to rectangular waveguide transition having a 2.5D geometry compatible with… 
2010
2010
Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding
We report recent advances in tool and process hardening of a first of its kind 300 mm wafer-to-wafer (WtW) preprocessing… 
Highly Cited
2010
Highly Cited
2010
Fine pitch chip interconnection technology for 3D integration
3D-IC packaging using through silicon via technology has been extensively developed to meet small form factor and low power… 
2009
2009
Back-Action Evading Measurements of Nanomechanical Motion Approaching Quantum Limits
Title of dissertation: BACK-ACTION EVADING MEASUREMENTS OF NANOMECHANICAL MOTION APPROACHING QUANTUM LIMITS Jared B. Hertzberg… 
2008
2008
Low Temperature Copper-Copper Thermocompression Bonding
Successful direct copper thermocompression bonding was demonstrated at room temperature under ambient environment, yielding shear… 
2007
2007
Self-assembled monolayers for reduced temperature direct metal thermocompression bonding
A reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression bonding is observed by coating a… 
2005
2005
Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging
Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging Gil-Soo Park… 
Highly Cited
2003
Highly Cited
2003
Ultra-high-density interconnection technology of three-dimensional packaging
Highly Cited
2002
Highly Cited
2002
Fabrication of wafer-level thermocompression bonds
Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding. The fabrication… 
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