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Compliant bonding

Compliant bonding is used to connect gold wires to electrical components such as integrated circuit "chips". It was invented by Alexander Coucoulas… 
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Related topics

Related topics

5 relations
Alexander CoucoulasIntegrated circuitThermocompression bondingThermosonic bonding

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Predicted thermal stresses in a TSV design
Physically meaningful and easy-to-use analytical predictive stress models are developed for a through-silicon-via (TSV) design… 
2015
2015
Analytical stress modeling for TSVs in 3D packaging
Physically meaningful and easy-to-use analytical solutions are obtained, using analytical modeling and theory-of-elasticity… 
2014
2014
Apparatus having a compliant bonding structure
2013
2013
Surface compliant bonding properties of low-temperature wafer bonding using sub-micron Au particles
Compression deformation property, which is directly related to an ability of surface compliant bonding and hermetic sealing, of… 
1974
1974
Development of a compliant bonding capability for beam lead devices
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