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Wafer bonding

Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems… Expand
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
This paper presents a novel approach to face-to-face wafer-to-wafer (W2W) bonding using SiCN-to-SiCN dielectric bonding, in… Expand
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Highly Cited
2016
Highly Cited
2016
The highest solar cell conversion efficiencies are achieved with four-junction devices under concentrated sunlight illumination… Expand
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Highly Cited
2013
Highly Cited
2013
Heterogeneous integration of III-V semiconductor materials on a silicon-on-insulator (SOI) platform has recently emerged as one… Expand
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2012
2012
The design, fabrication, and performance of a micromachined 2-D wind sensor are presented. The sensor operates based on the… Expand
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Highly Cited
2011
Highly Cited
2011
We present the successful fabrication of capacitive micromachined ultrasonic transducers (CMUTs) with an improved insulation… Expand
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Highly Cited
2006
Highly Cited
2006
A three-dimensional (3-D) integration technology has been developed for the fabrication of a new 3-D shared-memory test chip… Expand
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Highly Cited
2003
Highly Cited
2003
Introduces a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding… Expand
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Highly Cited
2001
Highly Cited
2001
  • R. F. WoHenbuttel
  • 2001
  • Corpus ID: 32288666
Micromechanical smart sensor and actuator systems of high complexity bemme commercially viable when realized as a multi-wafer… Expand
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Highly Cited
1998
Highly Cited
1998
Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in… Expand
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Highly Cited
1998
Highly Cited
1998
When mirror-polished, flat, and clean wafers of almost any material are brought into contact at room temperature, they are… Expand
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