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Wafer bonding

Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems… 
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Related topics

Related topics

17 relations
Adhesive bondingAnodic bondingBond characterizationDirect bonding

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2017
Highly Cited
2017
Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology
This paper presents a novel approach to face-to-face wafer-to-wafer (W2W) bonding using SiCN-to-SiCN dielectric bonding, in… 
Highly Cited
2015
Highly Cited
2015
Wafer-Bonded GaInP/GaAs//Si Solar Cells With 30% Efficiency Under Concentrated Sunlight
Highly efficient III-V/Si triple-junction solar cells were realized by a fabrication process based on direct wafer bonding: Ga0… 
Review
2014
Review
2014
Integrated Magneto-Optical Materials and Isolators: A Review
Many novel materials and device designs have been proposed as photonic analogs to electrical diodes over the last four decades… 
Highly Cited
2011
Highly Cited
2011
Fabrication of Capacitive Micromachined Ultrasonic Transducers via Local Oxidation and Direct Wafer Bonding
We present the successful fabrication of capacitive micromachined ultrasonic transducers (CMUTs) with an improved insulation… 
Highly Cited
2005
Highly Cited
2005
Stamp-and-stick room-temperature bonding technique for microdevices
Multilayer MEMS and microfluidic designs using diverse materials demand separate fabrication of device components followed by… 
Highly Cited
2004
Highly Cited
2004
Fabrication of Size-Controllable Nanofluidic Channels by Nanoimprinting and Its Application for DNA Stretching
We report a new approach to greatly simplify the fabrication of nanofluidic channels with well-controlled dimensions. It is… 
Review
1999
Review
1999
Wafer direct bonding: tailoring adhesion between brittle materials
Highly Cited
1997
Highly Cited
1997
Back-gated CMOS on SOIAS for dynamic threshold voltage control
The simultaneous reduction of power supply and threshold voltages for low-power design without suffering performance losses will… 
Highly Cited
1994
Highly Cited
1994
Hydrophobic silicon wafer bonding
Wafers prepared by an HF dip without a subsequent water rinse were bonded at room temperature and annealed at temperatures up to… 
Highly Cited
1990
Highly Cited
1990
Semiconductor wafer bonding
▪ Abstract When mirror-polished, flat, and clean wafers of almost any material are brought into contact at room temperature, they… 
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