Wafer bonding

Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems… (More)
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Topic mentions per year

1987-2017
02040608019872017

Papers overview

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Highly Cited
2008
Highly Cited
2008
We present an improved fabrication method for capacitive micromachined ultrasonic transducers (CMUTs). Recently, a process was… (More)
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2006
2006
MEMS scanning micromirrors have been proposed to steer a modulated laser beam in order to establish secure optical links between… (More)
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2005
2005
This paper presents detailed experimental data on wafer bonding using a thin Parylene layer, and reports results on: 1) bond… (More)
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2004
2004
The morphology and bond strength of copper-bonded wafer pairs prepared under different bonding/annealing temperatures and… (More)
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2004
2004
3-D interconnects hold tremendous potential to reduce global interconnect latency and power dissipation. Moreover, it allows… (More)
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2004
2004
A wide range of MEMS applications are using different wafer bonding processes. Due to the variety of materials and due to the… (More)
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2001
2001
The microstructure morphologies and oxide distribution of copper bonded wafers were examined by means of transmission electron… (More)
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2001
2001
A technique for achieving large-scale monolithic integration of materials on a wafer has been developed. The simultaneous… (More)
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1999
1999
Wafers prepared by an HF dip without a subsequent water rinse were bonded at room temperature and annealed at temperatures up to… (More)
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1999
1999
A theory is presented which describes the initial direct wafer bonding process. The effect of surface microroughness on the… (More)
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