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Direct bonding
Direct bonding describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between…
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Related topics
Related topics
4 relations
Plasma-activated bonding
Reactive bonding
Surface activated bonding
Wafer bonding
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Monolithic Integration of InP Wire and $\mbox{SiO}_x$ Waveguides on Si Platform
H. Nishi
,
K. Takeda
,
+4 authors
T. Yamamoto
IEEE Photonics Journal
2015
Corpus ID: 32323230
We report a low-loss InP wire waveguide monolithically integrated with an SiOx waveguide on an Si platform. By means of directly…
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2012
2012
Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials
Chenxi Wang
,
T. Suga
Microelectronics and reliability
2012
Corpus ID: 41048286
2012
2012
A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment
Qianwen Chen
,
Dingyou Zhang
,
+6 authors
Jian-Qiang Lu
2012
Corpus ID: 53451478
2009
2009
Stress Adjustment and Bonding of H-Implanted 2 in. Freestanding GaN Wafer: The Concept of Double-Sided Splitting
O. Moutanabbir
,
S. Senz
,
+5 authors
U. Gösele
2009
Corpus ID: 59502757
Heterointegration of thin layers obtained from freestanding GaN wafers by the Smart-Cut process faces major challenges due to…
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2006
2006
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration
B. Charlet
,
L. Cioccio
,
+6 authors
L. Magagni
2006
Corpus ID: 15771464
2005
2005
Strained Silicon on Insulator (SSOI) by Wafer Bonding
Silke Christiansen
,
R. Singh
,
+5 authors
B. Dietrich
International SiGe Technology and Device Meeting
2005
Corpus ID: 21274421
2005
2005
Cyclo-Olefin polymer direct bonding using low temperature plasma activation bonding
J. Mizuno
,
S. Farrens
,
+6 authors
S. Shoji
International Conference on MEMS, NANO, and Smart…
2005
Corpus ID: 20093505
Low temperature direct bonding method of Cyclo-Olefin Polymer (COP) plates (20mm /spl times/ 40 mm /spl times/ 2.0 mm) has been…
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1997
1997
Glass direct bonding technology for hermetic seal package
D. Ando
,
K. Oishi
,
T. Nakamura
,
S. Umeda
Proceedings IEEE The Tenth Annual International…
1997
Corpus ID: 53697291
A new SMD type hermetic seal package using glass wafers has been developed for SAW (surface acoustic wave) resonators. This…
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1986
1986
1800V bipolar-mode MOSFETs: A first application of silicon wafer direct bonding (SDB) technique to a power device
A. Nakagawa
,
K. Watanabe
,
Y. Yamaguchi
,
H. Ohashi
,
K. Furukawa
International Electron Devices Meeting
1986
Corpus ID: 19758084
1800v and 1700v non-latch-up Bipolar-Mode MOSFETs have been developed, based on Silicon Wafer Direct Bonding (SDB) technique: a…
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1976
1976
Direct bonding applied to space maintenance.
Swaine Tj
,
Wright Gz
1976
Corpus ID: 138694660
Based on the conditions of this study, the following conclusions were reached: A success rate of 70 percent seems to justify…
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