Direct bonding

Direct bonding describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between… (More)
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2017
2017
  • 2017
57 ABSTRACT Disclosed is a method of bonding metals to substrates such as ceramics or metals. A bonding agent forms a eutectic… (More)
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2014
2014
3-inch 4H-SiC wafer direct bonding has been achieved by the modified surface activated bonding (SAB) method without any chemical… (More)
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2013
2013
A light-emitting diode (LED) die and a glass substrate, both of which were coated with a few-micrometers-thick silver layer, was… (More)
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2011
2011
Cu-Cu bonding provides advantages such as cost effective process, fine pitch, and low resistance to advanced 3D IC technology… (More)
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2010
2010
3D technology will be the next step for the development of microelectronic devices. Vertical interconnection is one of the… (More)
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2010
2010
In this paper, we discuss the requirements of direct bonding and show how it can provide photonic electronic integrated circuits… (More)
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2008
2008
In 3D integration circuits, metal bonding is a key stage for stacking wafers. In this contribution, the direct Cu/Cu bonding at… (More)
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2006
2006
In this paper, the novel and low cost method for silicon-silicon bonding is introduced in detail. This direct silicon bonding… (More)
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1997
1997
Wafers with 1 μm LPCVD silicon-rich nitride layers have been successfully direct bonded to silicon-rich nitride and boron-doped… (More)
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1995
1995
Direct bonding of organic polymeric materials can be realized when their surfaces are prepared in such a way that they are clean… (More)
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