Skip to search form
Skip to main content
Skip to account menu
Semantic Scholar
Semantic Scholar's Logo
Search 238,214,895 papers from all fields of science
Search
Sign In
Create Free Account
Direct bonding
Direct bonding describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between…
Expand
Wikipedia
(opens in a new tab)
Create Alert
Alert
Related topics
Related topics
4 relations
Plasma-activated bonding
Reactive bonding
Surface activated bonding
Wafer bonding
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Integrated waveguide optical isolator
Zhang Cui
2017
Corpus ID: 113633896
This project is aimed at the integration of a polarisation-insensitive optical waveguide isolator on a Silicon-on-Insulator…
Expand
2016
2016
InP-DHBT Fabricated on High Heat Dissipation SiC Wafer Using Atomic Diffusion Bonding
M. Watanabe
,
M. Yanagisawa
,
Katsumi Uesaka
2016
Corpus ID: 88501191
1. 緒 言 スマートフォンを使用した動画視聴サービスや各種クラ ウドサービスが人々の生活に一層浸透しつつあることなど を背景に、データトラフィックは増加の一途を辿っている。 これに対応するために400 Gbit/s…
Expand
2011
2011
Effectiveness and efficiency of a customized versus conventional orthodontic bracket system
D. J. Weber
2011
Corpus ID: 16454835
DENNIS J. WEBER II: Effectiveness and Efficiency of a Customized Versus Conventional Orthodontic Bracket System (Under the…
Expand
2008
2008
Low Temperature Bonding Using In-Situ Radical Activation
T. Rogers
,
N. Aitken
2008
Corpus ID: 55465873
A tool for performing surface activation using radicals (RAD activation), followed by the subsequent, in-situ, low temperature…
Expand
2008
2008
Wafer Direct Bonding Based on UV Exposure
Cang-Hai Ma
,
Guanglan Liao
,
+4 authors
Xiao-Hui Lin
2008
Corpus ID: 139576983
Wafer direct bonding technology has extensive application and broad prospects.UV activation combined with wet chemical cleaning…
Expand
2006
2006
Progress towards a Better Be/Cu Joining for ITER First Wall in China
Chen
,
Jiming
,
+9 authors
Zengyu
2006
Corpus ID: 55154261
ITER will be constructed and has its first plasma at 2016. It will demonstrate the integration of technologies for reactors and…
Expand
2006
2006
Sequential Plasma Activated Process for Silicon Direct Bonding
M. Howladera
,
T. Sugab
,
H. Itohb
,
M. Kimc
2006
Corpus ID: 51753188
Sequential plasma activated bonding (SPAB) process consisting of oxygen reactive ion etching (RIE) and nitrogen microwave radical…
Expand
2003
2003
Direct Bonding Copper to Aluminium Nitride Substrate
Xin Xu
2003
Corpus ID: 102373994
The effects of surface oxidation on the bonding strength were investigated. The results suggested that bonding could not be…
Expand
Review
1995
Review
1995
Maxillary molar surgery: a buccal approach to the palatal root. A review of 96 clinical cases.
Cohen Sj
1995
Corpus ID: 221936503
1976
1976
Direct bonding applied to space maintenance.
Swaine Tj
,
Wright Gz
1976
Corpus ID: 138694660
Based on the conditions of this study, the following conclusions were reached: A success rate of 70 percent seems to justify…
Expand