Skip to search formSkip to main contentSkip to account menu

Direct bonding

Direct bonding describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between… 
Wikipedia (opens in a new tab)

Related topics

Related topics

4 relations
Plasma-activated bondingReactive bondingSurface activated bondingWafer bonding

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Novel integration method for III–V semiconductor devices on silicon platform
A novel integration method for III–V semiconductor devices on a Si platform was demonstrated. Thin-film InP was directly bonded… 
2014
2014
3-D Silicon-on-Insulator Integrated Circuits With NFET and PFET on Separate Layers Using Au/SiO2 Hybrid Bonding
We report the first demonstration of 3-D integrated circuits (3-D ICs) through the low-temperature (200 °C) hybrid bonding of 3… 
2013
2013
Low-Temperature Pressure-Less Silver Direct Bonding
A light-emitting diode (LED) die and a glass substrate, both of which were coated with a few-micrometers-thick silver layer, was… 
2012
2012
Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials
2012
2012
A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment
2009
2009
Design and Simulation of Silicon Waveguide Optical Circulator Employing Nonreciprocal Phase Shift
In this paper, we propose an optical circulator employing a nonreciprocal phase shift with a silicon waveguide. Two types of… 
2009
2009
Stress Adjustment and Bonding of H-Implanted 2 in. Freestanding GaN Wafer: The Concept of Double-Sided Splitting
Heterointegration of thin layers obtained from freestanding GaN wafers by the Smart-Cut process faces major challenges due to… 
2006
2006
Stable and Reliable Q-Factor in Resonant MEMS with Getter Film
The objective of this work was to show that the Q-factor of MEMS resonators can be increased and stabilized with the use of… 
2006
2006
Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration
2003
2003
Laser-based microscale patterning of biodegradable polymers for biomedical applications
In this paper, we throw light on current state of advancements in the field of biodegradable polymers and devices targeted at… 
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy (opens in a new tab), Terms of Service (opens in a new tab), and Dataset License (opens in a new tab)