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Direct bonding

Direct bonding describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between… Expand
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Papers overview

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Highly Cited
2014
Highly Cited
2014
Spectrolab has demonstrated a 2.2/1.7/1.4/1.05/0.73 eV 5J cell with an efficiency of 37.8% under 1 sun AM1.5G spectrum and 35.1… Expand
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2012
2012
The role of chiral counterions in gold-catalyzed asymmetric intramolecular hydroamination/hydroalkoxylation reactions of allenes… Expand
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Highly Cited
2011
Highly Cited
2011
An evanescently coupled, hybrid III-V/Silicon Fabry-Pérot laser based on adhesive divinyl siloxane-benzocyclobutene (DVS-BCB… Expand
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2010
2010
3D technology will be the next step for the development of microelectronic devices. Vertical interconnection is one of the… Expand
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Highly Cited
2006
Highly Cited
2006
A new method for thermally bonding poly(methyl methacrylate) (PMMA) substrates has been demonstrated. PMMA substrates are first… Expand
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Highly Cited
2006
Highly Cited
2006
In this paper, we demonstrate the feasibility of ultrahigh-density bumpless interconnect by realizing the ultrafine pitch bonding… Expand
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Highly Cited
2003
Highly Cited
2003
Thin copper (Cu) films of 80 nm thickness deposited on a diffusion barrier layered 8 in. silicon wafers were directly bonded at… Expand
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Highly Cited
2003
Highly Cited
2003
Introduces a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding… Expand
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2003
2003
In this paper, we throw light on current state of advancements in the field of biodegradable polymers and devices targeted at… Expand
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Highly Cited
1999
Highly Cited
1999
Abstract The aim of this work is to perform such a chemical modification of the implant that in vivo conditions on its surface… Expand
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