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Direct bonding

Direct bonding describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between… Expand
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Papers overview

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Highly Cited
2014
Highly Cited
2014
Spectrolab has demonstrated a 2.2/1.7/1.4/1.05/0.73 eV 5J cell with an efficiency of 37.8% under 1 sun AM1.5G spectrum and 35.1… Expand
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Review
2012
Review
2012
Abstract 3D integration provides a promising solution to achieve system level integration with high function density, small form… Expand
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Highly Cited
2011
Highly Cited
2011
An evanescently coupled, hybrid III-V/Silicon Fabry-Pérot laser based on adhesive divinyl siloxane-benzocyclobutene (DVS-BCB… Expand
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Review
2010
Review
2010
Enhanced transmission speeds, lower power consumption, better performance, and smaller form factors are reported as advantages in… Expand
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Highly Cited
2006
Highly Cited
2006
A new method for thermally bonding poly(methyl methacrylate) (PMMA) substrates has been demonstrated. PMMA substrates are first… Expand
Highly Cited
2006
Highly Cited
2006
In this paper, we demonstrate the feasibility of ultrahigh-density bumpless interconnect by realizing the ultrafine pitch bonding… Expand
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Highly Cited
2003
Highly Cited
2003
Thin copper (Cu) films of 80 nm thickness deposited on a diffusion barrier layered 8 in. silicon wafers were directly bonded at… Expand
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Highly Cited
2003
Highly Cited
2003
Introduces a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding… Expand
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Review
1999
Review
1999
Abstract It is a well-known phenomenon that two solids with sufficiently flat surfaces can stick to each other when brought into… Expand
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Highly Cited
1999
Highly Cited
1999
Abstract The aim of this work is to perform such a chemical modification of the implant that in vivo conditions on its surface… Expand
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