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Plasma-activated bonding
Known as:
Plasma activated bonding
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main…
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Related topics
Related topics
9 relations
Bond characterization
Chemical-mechanical planarization
Direct bonding
Indium tin oxide
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Broader (1)
Wafer bonding
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits
L. Bai
,
Takehiko Kikuchi
,
+4 authors
S. Arai
2018
Corpus ID: 164983994
2017
2017
Room-temperature Continuous-wave Operation of GaInAsP/SOI Hybrid Laser Fabricated by N2 Plasma Activated Bonding
Y. Hayashi
,
侑介 林.
,
+13 authors
滋久 荒井
2017
Corpus ID: 139625399
2017
2017
Study of III-V/Si Hybrid Photonic Active Devices using Plasma Activated Bonding ; プラズマ活性化接合を用いた III-V/Siハイブリッド光アクティブデバイスの研究
Yuusuke Hayashi
,
You-Jie Lin
2017
Corpus ID: 139961837
2016
2016
Improvement in Lasing Characteristics of A GaInAsP/SOI Hybrid Laser Fabricated by N2 Plasma Activated Bonding
Y. Hayashi
,
Junichi Suzuki
,
+5 authors
S. Arai
2016
Corpus ID: 136013184
2013
2013
igh temperature micro-glassblowing process demonstrated on fused quartz and LE TSG
Senkal
,
M. J. Ahamed
,
A. Trusov
,
A. Shkel
2013
Corpus ID: 41158982
We report, for the first time, a MEMS fabrication process for building atomically smooth, symmetric 3D wineglass and spherical…
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2010
2010
Sequentially Plasma Activated Bonding for Wafer Scale Nano-Integration
G. Kibria
2010
Corpus ID: 136898810
Sequentially plasma activated bonding (SP AB) of silicon wafers has been investigated to facilitate chemical free, room…
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2006
2006
Sequential Plasma Activated Process for Silicon Direct Bonding
M. Howladera
,
T. Sugab
,
H. Itohb
,
M. Kimc
2006
Corpus ID: 51753188
Sequential plasma activated bonding (SPAB) process consisting of oxygen reactive ion etching (RIE) and nitrogen microwave radical…
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2003
2003
Towards a microscopic understanding of plasma activated bonding
M. Poulsen
,
A. Egebjerg
,
+4 authors
F. Jensen
2003
Corpus ID: 100221280
Oxygen plasma activated bonding of silicon wafers at room temperature has been investigated systematically. The influence of…
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Review
2002
Review
2002
Fully Integrated Plasma-Activated Bonding (PAB) for High Volume SOI Substrate Manufacturing Process
J. Sullivan
,
P. Ong
2002
Corpus ID: 173172701
The quality, availability, and pricing of SOI wafers will determine the speed of their adoption as starting substrates for…
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