• Publications
  • Influence
Adhesive wafer bonding
Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits,Expand
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Conducting laboratory experiments over the Internet
We report on an interactive on-line laboratory for remote education called Automated Internet Measurement Laboratory (AIM-Lab), which utilizes the Internet and the World Wide Web. AIM-Lab allowsExpand
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  • Open Access
3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems
  • Jian-Qiang Lu
  • Computer Science, Engineering
  • Proceedings of the IEEE
  • 27 February 2009
Three-dimensional (3-D) hyperintegration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components to form highly integratedExpand
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  • Open Access
Three-Dimensional Coaxial Through-Silicon-Via (TSV) Design
Being one of the most attractive 3-D integration solutions, through-silicon-vias (TSVs) electrically connect multiple strata of integrated circuits and/or devices in a vertical fashion. This paperExpand
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Validation of quantitative susceptibility mapping with Perls' iron staining for subcortical gray matter
Quantitative susceptibility mapping (QSM) measures bulk susceptibilities in the brain, which can arise from many sources. In iron-rich subcortical gray matter (GM), non-heme iron is a dominantExpand
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3D Power Delivery for Microprocessors and High-Performance ASICs
Conventional power delivery methods for microprocessors and high-performance ASICs have fundamental limitations in meeting the power requirements of future IC technologies due to large interconnectExpand
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Architecture design exploration of three-dimensional (3D) integrated DRAM
Motivated by increasingly promising three-dimensional (3D) integration technologies, this paper reports an architecture design of 3D integrated dynamic RAM (DRAM). To accommodate the potentiallyExpand
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Handbook of Wafer Bonding
TECHNOLOGIES A. Adhesive and Anodic Bonding Glass Frit Wafer Bonding Wafer Bonding Using Spin-On Glass as Bonding Material Polymer Adhesive Wafer Bonding Anodic Bonding B. Direct Wafer Bonding DirectExpand
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Through-Silicon-Via Fabrication Technologies, Passives Extraction, and Electrical Modeling for 3-D Integration/Packaging
Major advances have been made in the processing technologies of through-silicon-vias (TSVs) because TSV is an essential element for both wafer-level 3-D integration and packaging-based 3-DExpand
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Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network
Through-strata-via (TSV) is regarded as a critical component in 3D integration that extends Moore's Law. This paper reports on TSV crosstalk performance under high speed operations using a 3DExpand
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