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Adhesive bonding
Adhesive bonding (also referred to as gluing or glue bonding) describes a water bonding technique with applying an intermediate layer to connect…
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Related topics
Related topics
2 relations
Reactive bonding
Wafer bonding
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Silicon-Based Monolithic Planar Micro Thermoelectric Generator Using Bonding Technology
K. Ziouche
,
Zheng Yuan
,
P. Lejeune
,
T. Lasri
,
D. Leclercq
,
Z. Bougrioua
Journal of microelectromechanical systems
2017
Corpus ID: 6603169
A technology of planar micro thermoelectric generators (<inline-formula> <tex-math notation="LaTeX">$\mu {\mathrm{ T}}{\mathrm{ E…
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2013
2013
Research of liquid contaminants influence on adhesive bond strength applied in agricultural machine construction
M. Müller
2013
Corpus ID: 55261767
An adhesive bonding technology is a prospective bonding technology of diverse materials. Namely the research in the sphere of the…
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Highly Cited
2012
Highly Cited
2012
Surface Preparation Techniques for Adhesive Bonding
R. Wegman
,
J. Twisk
2012
Corpus ID: 136832597
"Surface Preparation Techniques for Adhesive Bonding" is an essential guide for materials scientists, mechanical engineers…
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Review
2011
Review
2011
Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review
Sang Hwui Lee
,
Kuan-Neng Chen
,
James J.-Q. Lu
Journal of microelectromechanical systems
2011
Corpus ID: 15512836
This paper presents a review of the wafer-to-wafer alignment used for 3-D integration. This technology is an important…
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2006
2006
Impregnation of Southern Pine Wood and Strands With Low Molecular Weight Phenol-Formaldehyde Resins for Stabilization of Oriented Strandboard
H. Wan
,
Moon G. Kim
2006
Corpus ID: 55566163
Low molecular weight phenol-formaldehyde (PF) resins were impregnated into southern pine wood using a vacuum/pressure method and…
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Highly Cited
2005
Highly Cited
2005
Stamp-and-stick room-temperature bonding technique for microdevices
S. Satyanarayana
,
R. Karnik
,
A. Majumdar
Journal of microelectromechanical systems
2005
Corpus ID: 7245151
Multilayer MEMS and microfluidic designs using diverse materials demand separate fabrication of device components followed by…
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Highly Cited
2003
Highly Cited
2003
Adhesive wafer bonding for MEMS applications
V. Dragoi
,
T. Glinsner
,
G. Mittendorfer
,
B. Wieder
,
P. Lindner
SPIE Microtechnologies
2003
Corpus ID: 122034001
Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature…
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Highly Cited
2000
Highly Cited
2000
Impact perforation resistance of laminated and assembled composite plates
Dahsin Liu
,
B. Raju
,
X. Dang
2000
Corpus ID: 54800809
1994
1994
Adhesive bonding of pultruded fiber-reinforced plastic to wood
D. Gardner
,
J. Davalos
,
U. Munipalle
1994
Corpus ID: 138989278
Although glued-laminated timber (glulam) beams are used extensively in construction, their application to large-scale structures…
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Highly Cited
1982
Highly Cited
1982
Handbook of Adhesive Bonding
G. Agoston
1982
Corpus ID: 191338174
From the combination of knowledge and actions, someone can improve their skill and ability. It will lead them to live and work…
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