Anodic bonding

Anodic bonding is a wafer bonding process to seal glass to either silicon or metal without introducing an intermediate layer; it is commonly used to… (More)
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2012
2012
This paper provides a method for the anodic bonding of SOI and glass wafers, and it explains the bonding mechanism with an… (More)
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2011
2011
A wafer-level processing technology that is used to precisely fabricate regular arrays of deep cavities in a Pyrex 7740 glass… (More)
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2005
2005
The presented work deals with the study of the electro-mechanical phenomena during the anodic bonding process between glass and… (More)
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2004
2004
  • V. G. Kutchoukova, F. Laugerea, W. van der Vlista, L. Pakulaa, Y. Garinib, A. Bosschea
  • 2004
In this work, we present a technology for fabrication of nanochannels created in glass with which bio-analysis can be performed… (More)
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2003
2003
Wafer bonding techniques are key technologies for MEMS devices fabrication. Anodic bonding is a very mature technique used for… (More)
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2003
2003
This paper presents a study on the feasibility of packaging monolithically integrated MEMS by anodic bonding. We measured the… (More)
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2003
2003
In this work, we present a technology for fabrication of nanochannels created in glass with which bio-analysis can be performed… (More)
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2003
2003
In this communication, we report on metal to glass anodic bonding for Microsystems packaging. Bonded Pyrex-Foturan/Metal double… (More)
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2000
2000
Anodic bonding between Si-based and glass substrates has been characterized in detail. The effects of magnitude of the applied… (More)
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2000
2000
In this study, we report a pulsed-voltage technique that is commonly employed in the electroplating industry to achieve a more… (More)
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