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Glass frit bonding

Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer… 
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Papers overview

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2019
2019
In the thermo-compressive, silicon-to-silicon wafer bonding process, due to the residual stresses, the wafer warps, thus… 
2015
2015
Salah satu produksi furniture PT. Homeware International Indonesia yang terbaru adalah saniteryware khususnya toilet jongkok… 
2012
2012
Provided is a method for preparing iron tailing into ceramic frit glaze. The method for preparing iron tailing into ceramic frit… 
2010
2010
The wafer level hermetic packaging is a method of sealing micro-devices containing movable parts with a capping wafer in vacuum… 
2009
2009
  • Csp Lt
  • 2009
  • Corpus ID: 138675352
Glass frit is a kind of sealing material for MEMS device.The bonding process of Si and glass for MEMS device at low-temperature… 
1999
1999
The Defense Waste Processing Facility (DWPF) is currently producing radioactive canisters containing vitrified high-level waste… 
1999
1999
This article describes the construction and performance of a restrictor . heater for interfacing an ion mobility detector IMD to… 
1984
1984
High-level radioactive waste at the Savannah River Plant will be incorporated in borosilicate glass for permanent disposal. The… 
1953
1953
IN an attempt to assess the possibility of controlling gramineaceous stem borers by systemic and seed-dressing insecticides, the… 
1939
1939
Both Young's modulus and the modulus of rupture of eight types of enamel frit were determined under constant conditions of t…