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Bond characterization
The water bond characterization is based on different methods and tests. Considered a high importance of the water are the successful bonded waters…
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Related topics
Related topics
5 relations
Plasma-activated bonding
Reactive bonding
Wafer bonding
Wafer testing
Broader (1)
Semiconductor device fabrication
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
Surface morphology and bond characterization of nanocrystalline diamonds grown on tungsten carbide via hot fi lament chemical vapor deposition
E. Hamzah
,
T. M. Yong
,
M. Yajid
2013
Corpus ID: 55272554
Nanocrystalline diamonds (NCDs) were deposited on chemically prepared tungsten carbide substrates via hot filament chemical vapor…
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2012
2012
A Built-In Characterization Technique for 1-Bit/Stage Pipelined ADC
Yuan-Hsi Chou
,
J.-L. Huang
,
X.-L. Huang
IEEE 21st Asian Test Symposium
2012
Corpus ID: 32840634
In this paper, we present, for the 1-bit/stage pipelined ADC, a self-characterization technique that quantifies the per-stage…
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2012
2012
EELS chemical bond characterization of process induced damages in low-k dielectric films
Yongkai Zhou
,
Jie Zhu
,
+5 authors
Juan Boon Tan
19th IEEE International Symposium on the Physical…
2012
Corpus ID: 15273941
EELS chemical bond analysis has been used to characterize etching process induced plasma damages in low-k SiCOH materials. EELS…
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2011
2011
Bond behavior between glulam and GFRP's using pullout bending tests
M. Jorge
,
J. Sena-Cruz
,
J. Branco
,
J. Barros
,
Gláucia Daufré
2011
Corpus ID: 54921105
To evaluate the bond behavior between glulam and GFRP rods using the near-surface mounted (NSM) strengthening technique, an…
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2008
2008
SHCC repair overlays for RC: Interfacial bond characterization and modelling
Van Zijl Gpag
,
Stander Hj
2008
Corpus ID: 135667964
Bonded overlays are increasingly used in concrete and reinforced concrete repair and rehabilitation applications. Fibre…
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2007
2007
Concrete-steel bond characterization of RC structural elements built with smooth plain reinforcement bars
C. Fernandes
,
H. Varum
,
A. Costa
2007
Corpus ID: 55258538
Poor bond conditions often lead to damage and ultimately to collapse of reinforced concrete structures under seismic loading…
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2007
2007
A pullout test for the near surface mounted CFRP-concrete bond characterization
J. Sena-Cruz
,
J. Barros
2007
Corpus ID: 67818862
To characterize the bond behavior between concrete and CFRP strips, a pullout test is proposed. The developed test setup was used…
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2001
2001
In situ ultrasonic stress microsensor for second bond characterization
J. Schwizer
,
M. Mayer
,
O. Brand
,
H. Baltes
2001
Corpus ID: 114789572
To investigate the thermosonic wire bonding process; an integrated piezoresistive microsensor has been developed, optimized for…
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2001
2001
Bond Characterization of the 3-D Framework Structure of the Copper(
Wen
,
Yuh-Sheng
2001
Corpus ID: 93285765
The crystal of qudra-aquabis(isonicotinato-N)copper(Ⅱ),Cu[(NC5H4COO)]2 . 4H2O was synthesized via hydrothermal method. Single…
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1992
1992
STRUCTURE AND BOND CHARACTERIZATION OF THE NANOMETER-SIZED AMORPHOUS SILICON NITRIDE SOLID
Zhang Lide
,
Wang Tao
1992
Corpus ID: 101325384
The nanometer-sized silicon nitride solids(NANO-SNS),heated-treated atdifferent conditions,were systematically studied in terms…
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