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Wafer testing

Known as: Wafer prober, Wafer sort 
Wafer testing is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all… 
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Related topics

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Back end of lineBond characterizationCPU cacheChip-scale package

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
Recent advances in fault isolation for semiconductor industry
In semiconductor companies, failure analysis (FA) activities play a major role in all many areas. FA is deeply involved in new… 
2013
2013
Reactivation of Spares for Off-Chip Memory Repair After Die Stacking in a 3-D IC With TSVs
Memory, especially DRAM, is one of the candidates to be considered in three-dimensional integrated circuit (3-D IC), and in… 
2012
2012
Exploring a solar photovoltaic-based energy solution for green manufacturing industry
A large amount of electricity is required to support the operation of large manufacturing facilities. Integrating renewable… 
2012
2012
Testing of Copper Pillar Bumps for Wafer Sort
Using a copper pillar interconnect in flip chip packaging provides a lead-free solution that is more reliable, and also scalable… 
2012
2012
Gain Measurement of Embedded On-Chip Antennas in mmW/THz Range
A method for gain measurement of embedded on-chip antennas in mmW/THz range is presented. In this method, the radiation pattern… 
2009
2009
High precision on-wafer backend capacitor mismatch measurements using a benchtop semiconductor characterization system
This paper discusses a sophisticated backend capacitor mismatch characterization technique based on direct capacitance… 
2006
2006
A non-volatile embedded memory for high temperature automotive and high-retention applications
A highly reliable and scalable non-volatile embedded memory cell and technology is described. This embedded technology operates… 
2006
2006
Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity
Overall equipment efficiency (OEE) is an index that is widely used to measure equipment performance for semiconductor… 
2002
2002
Defect printability analysis study using virtual stepper system in a production environment
In this paper the simulation of wafer images for Attenuated Phase Shift Masks (ATTPSM) and repaired binary masks are performed by… 
1998
1998
Double-fused 1.5 µm vertical cavity lasers with record high To of 132 K at room temperature
The authors report record high temperature performance of a novel long wavelength vertical cavity laser using an electron barrier… 
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