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Wafer testing

Known as: Wafer prober, Wafer sort 
Wafer testing is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all… 
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Related topics

Related topics

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Back end of lineBond characterizationCPU cacheChip-scale package

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
A versatile flicker noise measurement system and its applications in CMOS process
A versatile multi-amplifier flicker noise measurement system with various programmable configurations was developed for accurate… 
2014
2014
Quasi-single mode VCSELs for longer-reach multimode fiber optical interconnects
Longer-reach (>300 m) optical interconnects are needed as datacenters grow ever larger. Today the reach of 850 nm VCSEL-based… 
2014
2014
Effective testing for wafer reject minimization by terahertz analysis and sub-surface imaging
This paper outlines applications of terahertz spectrometry, terahertz reflectometry and sub-surface imaging for effective… 
2012
2012
Wafer drying equipment
The present invention relates to a wafer drying apparatus. More particularly, the present invention relates to a wafer drying… 
2011
2011
Experimental determination of aberration in lithographic lens by aerial image
In this paper, we propose a method named as AMAI-PCA to extract aberration levels using aerial image measurements and present its… 
2008
2008
Wafer Sort and aligned using the same equipment
Wafer alignment method comprising the steps of: using the camera to recognize the image of the wafer notch and secured to the… 
2006
2006
Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity
Overall equipment efficiency (OEE) is an index that is widely used to measure equipment performance for semiconductor… 
2005
2005
Final results from the APV25 production wafer testing
The APV25 is the front end readout chip for the CMS silicon microstrip tracker. Approximately 75,000 chips are required and the… 
2004
2004
The challenge of testing RFID integrated circuits
  • D. Murfett
  • Proceedings. DELTA . Second IEEE International…
  • 2004
  • Corpus ID: 35250566
RFID integrated circuits often involve many of the most leading edge production technologies available today. The complexities… 
1990
1990
Improving wafer sort yields with radius-tip probes
  • S. Schleifer
  • Proceedings. International Test Conference
  • 1990
  • Corpus ID: 28472009
Probe-tip shape and patch-wiring are two principal probe-card factors that affect wafer yields and wafer sort probing consistency… 
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