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Chip-scale package

Known as: Wafer level chip scale package, Chip scale package, LFCSP 
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging… Expand
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Papers overview

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2012
2012
Chip scale package (CSP) technology offers promising solutions to package power device due to its relatively good thermal… Expand
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2009
2009
This paper describes the experimental characterization of piezoelectric harvesters with different dimensions. We present a record… Expand
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2009
2009
Wafer level chip scale packaging (WL-CSP) based on redistribution is the key technology which is evolving to system in package… Expand
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Highly Cited
2006
Highly Cited
2006
In this paper, we present a cost-effective chip-scale packaging solution for a 60-GHz industrial-scientific-medical band receiver… Expand
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2004
2004
When lead-free solder alloys mix with lead-free component and board metallizations during reflow soldering, the solder… Expand
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2004
2004
Accelerometers fabricated with MEMS technology are widely used in automotive crash detection and vehicle dynamic control systems… Expand
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2002
2002
Wafer-level chip-scale packaged RF filters use thin-film bulk acoustic resonator technology. The 1/spl times/1mm/sup 2/ high-Q… Expand
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2001
2001
Emerging chip scale packages (CSPs) and miniature versions of ball grid arrays (BGAs), are competing with bare die flip chip… Expand
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2000
2000
Abstract Availability of board solder joint reliability information is critical to the wider implementation of chip scale… Expand
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1999
1999
Part I: Flip Chip and Wire Bond for CSP. Solder-Bumped Flip Chip and Wire-Bonding Chip on CSP Substrate. Part II: Customized… Expand
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