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Chip-scale package
Known as:
Wafer level chip scale package
, Chip scale package
, LFCSP
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A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging…
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Related topics
Related topics
9 relations
Ball grid array
Die (integrated circuit)
Embedded Wafer Level Ball Grid Array
Flip chip
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2009
2009
First autonomous wireless sensor node powered by a vacuum-packaged piezoelectric MEMS energy harvester
R. Elfrink
,
Valer Pop
,
+9 authors
R. V. Schaijk
International Electron Devices Meeting
2009
Corpus ID: 34707550
This paper describes the experimental characterization of piezoelectric harvesters with different dimensions. We present a record…
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2007
2007
Empirical correlation between package-level ball impact test and board-level drop reliability
Chang-Lin Yeh
,
Y. Lai
,
Hsiao-Chuan Chang
,
Tsan-Hsien Chen
Microelectronics and reliability
2007
Corpus ID: 29875213
2007
2007
Transient Submodeling Analysis for Board-Level Drop Tests of Electronic Packages
Tsung-Yueh Tsai
,
Chang-Lin Yeh
,
Y. Lai
,
Rong-Sheng Chen
IEEE transactions on electronics packaging…
2007
Corpus ID: 8124270
We present in this paper a submodeling analysis procedure capable of solving transient mechanical responses of board-level…
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2007
2007
Chip Scale Package Design for Thermal Performance in Mobile Handsets
Cher Bai
,
M. Veatch
Proceedings 57th Electronic Components and…
2007
Corpus ID: 25946103
In today's mobile handset market the trend is to provide high performance, low cost components with integration of functionality…
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Highly Cited
2006
Highly Cited
2006
Evaluation of board-level reliability of electronic packages under consecutive drops
Chang-Lin Yeh
,
Y. Lai
,
C. Kao
Microelectronics and reliability
2006
Corpus ID: 206943669
2006
2006
Reliability of chip scale packages under mechanical shock loading
T. Mattila
,
P. Marjamaki
,
L. Nguyen
,
J. Kivilahti
Electronic Components and Technology Conference
2006
Corpus ID: 15410015
The reliability of different chip scale packages (CSPs) were studied under mechanical shock loading. The tests were carried out…
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2004
2004
Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish
Xingjia Huang
,
S. Lee
,
Ming Li
,
W.T. Chen
IEEE transactions on electronics packaging…
2004
Corpus ID: 47572733
In this paper, the effect of gold amount on the gold embrittlement of solder balls in wafer-level chip-scale package (WLCSP) CSP…
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2004
2004
Transient analysis of board-level drop response of lead-free chip-scale packages with experimental verifications
Chang-Lin Yeh
,
Y. Lai
Electronic Packaging Technology Conference
2004
Corpus ID: 31199800
Through the support excitation scheme, transient structural responses of a board-level chip-scale package subjected to the JEDEC…
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2000
2000
Reliability of composite solder bumps produced by an in-situ process
Jong-Hyun Lee
,
Daejin Park
,
J. Moon
,
Yong-Ho Lee
,
D. Shin
,
Yong-Seog Kim
2000
Corpus ID: 94799608
In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu6Sn5 dispersoids…
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1999
1999
Chip-scale packaging of a gyroscope using wafer bonding
D. Sparks
,
D. Slaughter
,
+5 authors
T. Vas
1999
Corpus ID: 113991404
The chip-scale packaging of a micromachined gyroscope is discussed. The angular rate sensor requires the micropackaging of…
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