Chip-scale package

Known as: Chip scale package, LFCSP, WLCSP 
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging… (More)
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Topic mentions per year

Topic mentions per year

1997-2017
0204019972017

Papers overview

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2014
2014
This paper introduces a probing methodology for Integrated Fan Out Wafer Level Chip Scale Packaging (InFO WLCSP) which has the… (More)
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2013
2013
This paper describes the development of a low CTE organic Chip Scale Package (CSP) jointly by KST and IBM. Tests carried out on… (More)
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2011
2011
The requirement of Chip Scale Package (CSP) is growing popular in current 3C industries due to the increasing needs of handheld… (More)
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2010
2010
Most MEMS microphone systems on the market are packaged by conventional chip bonding and wire bonding.. A significant step… (More)
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2007
2007
In today's mobile handset market the trend is to provide high performance, low cost components with integration of functionality… (More)
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Highly Cited
2006
Highly Cited
2006
In this paper, we present a cost-effective chip-scale packaging solution for a 60-GHz industrial-scientific-medical band receiver… (More)
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2006
2006
This paper presents a novel technology for hermetic wafer-level chip size packaging (WLCSP). The ultra thin surface mountable… (More)
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Review
2004
Review
2004
It is believed that the slower-than-expected adoption of flip-chip (FC) packages is due to the lagging advancement in substrate… (More)
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2002
2002
This paper discusses the reliability testing results of a lead-free version of the micro SMD, National Semiconductor’s Wafer… (More)
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1998
1998
A viscoplastic constitutive model was used to analyze the thermally induced plastic and creep deformation and low cycle fatigue… (More)
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