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Chip-scale package
Known as:
Wafer level chip scale package
, Chip scale package
, LFCSP
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A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging…
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Related topics
Related topics
9 relations
Ball grid array
Die (integrated circuit)
Embedded Wafer Level Ball Grid Array
Flip chip
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2009
2009
First autonomous wireless sensor node powered by a vacuum-packaged piezoelectric MEMS energy harvester
R. Elfrink
,
Valer Pop
,
+9 authors
R. V. Schaijk
International Electron Devices Meeting
2009
Corpus ID: 34707550
This paper describes the experimental characterization of piezoelectric harvesters with different dimensions. We present a record…
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2007
2007
Empirical correlation between package-level ball impact test and board-level drop reliability
Chang-Lin Yeh
,
Y. Lai
,
Hsiao-Chuan Chang
,
Tsan-Hsien Chen
Microelectronics and reliability
2007
Corpus ID: 29875213
2007
2007
Chip Scale Package Design for Thermal Performance in Mobile Handsets
Cher Bai
,
M. Veatch
Proceedings 57th Electronic Components and…
2007
Corpus ID: 25946103
In today's mobile handset market the trend is to provide high performance, low cost components with integration of functionality…
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Highly Cited
2006
Highly Cited
2006
Evaluation of board-level reliability of electronic packages under consecutive drops
Chang-Lin Yeh
,
Y. Lai
,
C. Kao
Microelectronics and reliability
2006
Corpus ID: 206943669
2004
2004
Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish
Xingjia Huang
,
S. Lee
,
Ming Li
,
W.T. Chen
IEEE transactions on electronics packaging…
2004
Corpus ID: 47572733
In this paper, the effect of gold amount on the gold embrittlement of solder balls in wafer-level chip-scale package (WLCSP) CSP…
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2004
2004
Chip scale packaging of a MEMS accelerometer
L. Felton
,
N. Hablutzel
,
W.A. Webster
,
K.P. Harney
Proceedings. 54th Electronic Components and…
2004
Corpus ID: 9045946
Accelerometers fabricated with MEMS technology are widely used in automotive crash detection and vehicle dynamic control systems…
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2001
2001
Chip Scale Package Assembly Reliability
R. Ghaffarian
2001
Corpus ID: 59757638
Emerging chip scale packages (CSPs) and miniature versions of ball grid arrays (BGAs), are competing with bare die flip chip…
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Highly Cited
1999
Highly Cited
1999
Chip scale package (CSP) : design, materials, processes, reliability, and applications
J. Lau
,
S. Lee
1999
Corpus ID: 106719500
Part I: Flip Chip and Wire Bond for CSP. Solder-Bumped Flip Chip and Wire-Bonding Chip on CSP Substrate. Part II: Customized…
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1999
1999
Chip-scale packaging of a gyroscope using wafer bonding
D. Sparks
,
D. Slaughter
,
+5 authors
T. Vas
1999
Corpus ID: 113991404
The chip-scale packaging of a micromachined gyroscope is discussed. The angular rate sensor requires the micropackaging of…
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Highly Cited
1998
Highly Cited
1998
Chip scale package (CSP) solder joint reliability and modeling
M. Amagai
2nd IEMT/IMC Symposium (IEEE Cat. No.98EX225)
1998
Corpus ID: 23751548
A viscoplastic constitutive model was used to analyze the thermally induced plastic and creep deformation and low cycle fatigue…
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