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Flip chip

Known as: Chip connection, FCLGA, Flip-chip 
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as… 
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Related topics

Related topics

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AMD 580 chipset seriesAlexander CoucoulasBall grid arrayBumpless Build-up Layer

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Novel Bumping and Underfill Technologies for 3D IC Integration
In previous work, novel maskless bumping and no‐flow underfill technologies for three‐dimensional (3D) integrated circuit (IC… 
Highly Cited
2007
Highly Cited
2007
Thin-Film Encapsulated RF MEMS Switches
A wafer-level thin-film encapsulation process has been demonstrated to package radio-frequency (RF) microelectromechanical… 
Highly Cited
2005
Highly Cited
2005
Nitride-based flip-chip ITO LEDs
Nitride-based flip-chip indium-tin-oxide (ITO) light-emitting diodes (LEDs) were successfully fabricated. It was found that the… 
2005
2005
Simulation and measurement of supply and substrate noise in mixed-signal ICs
Digital noise in mixed-signal circuits is characterized using a scalable macromodel for substrate noise coupling. The noise… 
Highly Cited
2005
Highly Cited
2005
Die stress characterization in flip chip on laminate assemblies
Minimizing device side die stresses is especially important when multiple copper/low-k interconnect redistribution layers are… 
Highly Cited
2004
Highly Cited
2004
Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications
Review
2004
Review
2004
Residual stresses in microelectronics induced by thermoset packaging materials during cure
Highly Cited
2003
Highly Cited
2003
Effect of 0.5 wt % Cu in Sn-3.5%ag solder on the interfacial reaction with Au/Ni metallization
The work presented here focuses on the role of 0.5 wt % Cu in the interfacial reaction between the molten Sn−3.5%Ag solder and… 
2001
2001
Wettability of electroless Ni in the under bump metallurgy with lead free solder
This study investigates the wettability of several lead-free solders, including Sn, Sn−Ag, and Sn−Bi, on electroless Ni (EN) with… 
1997
1997
60 GHz flip-chip assembled MIC design considering chip-substrate effect
In this paper, a 60 GHz MICs with flip-chip assembled pseudomorphic-HEMT is demonstrated. With electromagnetic field analysis… 
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