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Flip chip

Known as: Chip connection, FCLGA, Flip-chip 
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as… 
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AMD 580 chipset seriesAlexander CoucoulasBall grid arrayBumpless Build-up Layer

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
Optimization of Material and Process for Fine Pitch LVSoP Technology
For the formation of solder bumps with a fine pitch of 130 μm on a printed circuit board substrate, low‐volume solder on pad… 
2011
2011
Godson-3B: A 1GHz 40W 8-core 128GFLOPS processor in 65nm CMOS
As the latest product of Godson processor series, the Godson-3B processor is an 8-core high-performance general-purpose processor… 
2008
2008
External DDR2-constrained NOC-based 24-processors MPSOC design and implementation on single FPGA
Network on chip (NOC) has been proposed for the connection substrate of multiprocessor system on chip (SoC) due to limited… 
2005
2005
High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability
For high performance computer system applications, there are limitations for reliably and cost effectively attaching high I/O… 
2004
2004
Megapixel wavefront correctors
Optical-quality microelectromechanical deformable mirrors (DMs) and spatial light modulators (SLMs) are described. With such… 
2004
2004
Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package
Flip Chip Ball Grid Array (FCBGA) package has been introduced in recent years to address the needs in the microelectronic… 
2000
2000
A 3-10-GHz GaN-based flip-chip integrated broad-band power amplifier
In this paper, we report the latest progress of a GaN-based broad-band power amplifier using AlGaN/GaN high electron mobility… 
Review
2000
Review
2000
A Mechanism-Based Methodology for Processor Package Reliability Assessments
Until recently, processor packages have been certified using a stress-based certification strategy. This approach, while easy to… 
1999
1999
Measurement of Backside Flip Chip Die Stresses using Piezoresistive Test Die
Die cracking is a major failure mode observed during flip chip on laminate assembly or during subsequent package thermal cycling… 
1992
1992
Flip-chip bonding optimizes opto-ICs
The development of fabrication techniques for optical components and hybrid assemblies based on flip-chip bonding is outlined. It…