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Flip chip

Known as: Chip connection, FCLGA, Flip-chip 
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as… 
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Related topics

Related topics

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AMD 580 chipset seriesAlexander CoucoulasBall grid arrayBumpless Build-up Layer

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2007
Highly Cited
2007
Thin-Film Encapsulated RF MEMS Switches
A wafer-level thin-film encapsulation process has been demonstrated to package radio-frequency (RF) microelectromechanical… 
Highly Cited
2007
Highly Cited
2007
Direct Metallization of Gold Nanoparticles on a Polystyrene Bead Surface using Cationic Gold Ligands
Gold nanoparticles are formed to cover the surface of sulfonated-polystyrene (PS) beads by the in-situ ion-exchange and chemical… 
Highly Cited
2006
Highly Cited
2006
Lateral power MOSFET for megahertz-frequency, high-density DC/DC converters
DC/DC converters to power future CPU cores mandate low-voltage power metal-oxide semiconductor field-effect transistors (MOSFETs… 
2005
2005
Simulation and measurement of supply and substrate noise in mixed-signal ICs
Digital noise in mixed-signal circuits is characterized using a scalable macromodel for substrate noise coupling. The noise… 
Highly Cited
2005
Highly Cited
2005
Die stress characterization in flip chip on laminate assemblies
Minimizing device side die stresses is especially important when multiple copper/low-k interconnect redistribution layers are… 
Highly Cited
2005
Highly Cited
2005
Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad
The most frequent failure of wireless, handheld, and movable consumer electronic products is an accidental drop to the ground… 
Review
2004
Review
2004
Residual stresses in microelectronics induced by thermoset packaging materials during cure
Highly Cited
2003
Highly Cited
2003
Effect of 0.5 wt % Cu in Sn-3.5%ag solder on the interfacial reaction with Au/Ni metallization
The work presented here focuses on the role of 0.5 wt % Cu in the interfacial reaction between the molten Sn−3.5%Ag solder and… 
2001
2001
Wettability of electroless Ni in the under bump metallurgy with lead free solder
This study investigates the wettability of several lead-free solders, including Sn, Sn−Ag, and Sn−Bi, on electroless Ni (EN) with… 
1997
1997
60 GHz flip-chip assembled MIC design considering chip-substrate effect
In this paper, a 60 GHz MICs with flip-chip assembled pseudomorphic-HEMT is demonstrated. With electromagnetic field analysis… 
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