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Flip chip

Known as: Chip connection, FCLGA, Flip-chip 
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as… 
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Related topics

Related topics

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AMD 580 chipset seriesAlexander CoucoulasBall grid arrayBumpless Build-up Layer

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices
This paper presents a three-dimensional (3-D) wire bondless power module using silicon carbide (SiC) power devices. Commercially… 
Highly Cited
2013
Highly Cited
2013
360 PPI Flip-Chip Mounted Active Matrix Addressable Light Emitting Diode on Silicon (LEDoS) Micro-Displays
In this paper, we describe the design and fabrication of 360 PPI flip-chip mounted active matrix (AM) addressable light emitting… 
Highly Cited
2011
Highly Cited
2011
Reliability challenges in 3D IC packaging technology
Highly Cited
2009
Highly Cited
2009
Monolithic LED Microdisplay on Active Matrix Substrate Using Flip-Chip Technology
A monolithic high-resolution (individual pixel size 300times300 mum2) active matrix (AM) programmed 8times8 micro-LED array was… 
Highly Cited
2009
Highly Cited
2009
A Single–Chip 10-Band WCDMA/HSDPA 4-Band GSM/EDGE SAW-less CMOS Receiver With DigRF 3G Interface and ${+}$90 dBm IIP2
This paper describes the design and performance of a 90 nm CMOS SAW-less receiver with DigRF interface that supports 10 WCDMA… 
Highly Cited
2008
Highly Cited
2008
60-GHz Patch Antennas and Arrays on LTCC With Embedded-Cavity Substrates
The design is presented of aperture-coupled microstrip line-fed patch antennas (ACMPAs) and 4times4 planar arrays on Ferro A6-S… 
Review
2004
Review
2004
Recent advances in flip-chip underfill: materials, process, and reliability
In order to enhance the reliability of a flip-chip on organic board package, underfill is usually used to redistribute the… 
Highly Cited
2004
Highly Cited
2004
Investigation of thermomechanical behaviors of flip chip BGA packages during manufacturing process and thermal cycling
The purpose of this study is to investigate the thermomechanical behaviors of flip chip ball grid array packages during reflow… 
Review
2000
Review
2000
Solder joint fatigue models: review and applicability to chip scale packages
Highly Cited
1996
Highly Cited
1996
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Reliability testing and data analysis failure analysis and root cause identification design for reliability solder joint… 
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