Flip chip

Known as: Chip connection, FCLGA, Flip-chip 
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as… (More)
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Papers overview

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2007
2007
We have studied the effect of thickness of Cu under bump metallization (UBM) from 5 mum, 10 mum to 50 mum on electromigration… (More)
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Highly Cited
2006
Highly Cited
2006
The article consists of a Powerpoint presentation on electromigration and thermo migration in flip chip solder joints. The areas… (More)
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2006
2006
  • Chih Hao Chen
  • 2006 8th International Conference on Solid-State…
  • 2006
With the portable devices becoming smaller and more compact in size, flip-chip technology has been adopted for fine-pitch… (More)
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2006
2006
Flip chip technology is a key driver for new complex system architectures and high-density packaging, e.g. sensor or pixel… (More)
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2006
2006
Organic flip chip BGA has been quickly adopted as the mainstream package solution for high speed, high density and high power… (More)
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2005
2005
The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific… (More)
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2005
2005
Nitride-based flip-chip indium-tin-oxide (ITO) light-emitting diodes (LEDs) were successfully fabricated. It was found that the… (More)
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2005
2005
A particularly critical issue in this regard is module packaging, i.e., the way to assemble and connect several monolithic… (More)
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1998
1998
A novel Inpa-Red (IR) optical probing technique which provides fast and direct access to difision ( p n junction) nodes directly… (More)
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1998
1998
Electromagnetic simulations and measurement data of flip-chip transitions are presented. First-order effects are identified and… (More)
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