Skip to search formSkip to main contentSkip to account menu

Flip chip

Known as: Chip connection, FCLGA, Flip-chip 
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as… 
Wikipedia (opens in a new tab)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
In previous work, novel maskless bumping and no‐flow underfill technologies for three‐dimensional (3D) integrated circuit (IC… 
Highly Cited
2007
Highly Cited
2007
A wafer-level thin-film encapsulation process has been demonstrated to package radio-frequency (RF) microelectromechanical… 
Highly Cited
2005
Highly Cited
2005
Nitride-based flip-chip indium-tin-oxide (ITO) light-emitting diodes (LEDs) were successfully fabricated. It was found that the… 
2005
2005
Digital noise in mixed-signal circuits is characterized using a scalable macromodel for substrate noise coupling. The noise… 
Highly Cited
2005
Highly Cited
2005
Minimizing device side die stresses is especially important when multiple copper/low-k interconnect redistribution layers are… 
Highly Cited
2003
Highly Cited
2003
The work presented here focuses on the role of 0.5 wt % Cu in the interfacial reaction between the molten Sn−3.5%Ag solder and… 
2001
2001
This study investigates the wettability of several lead-free solders, including Sn, Sn−Ag, and Sn−Bi, on electroless Ni (EN) with… 
1997
1997
In this paper, a 60 GHz MICs with flip-chip assembled pseudomorphic-HEMT is demonstrated. With electromagnetic field analysis…