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Flip chip

Known as: Chip connection, FCLGA, Flip-chip 
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2011
2011
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
3D integration, using fine-pitch and high density vertical interconnects (TSVs), has been drawing considerable interest due to… 
Highly Cited
2007
Highly Cited
2007
Direct Metallization of Gold Nanoparticles on a Polystyrene Bead Surface using Cationic Gold Ligands
Gold nanoparticles are formed to cover the surface of sulfonated-polystyrene (PS) beads by the in-situ ion-exchange and chemical… 
Highly Cited
2006
Highly Cited
2006
Lateral power MOSFET for megahertz-frequency, high-density DC/DC converters
DC/DC converters to power future CPU cores mandate low-voltage power metal-oxide semiconductor field-effect transistors (MOSFETs… 
2005
2005
Simulation and measurement of supply and substrate noise in mixed-signal ICs
Digital noise in mixed-signal circuits is characterized using a scalable macromodel for substrate noise coupling. The noise… 
Highly Cited
2005
Highly Cited
2005
Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad
The most frequent failure of wireless, handheld, and movable consumer electronic products is an accidental drop to the ground… 
Highly Cited
2005
Highly Cited
2005
Die stress characterization in flip chip on laminate assemblies
Minimizing device side die stresses is especially important when multiple copper/low-k interconnect redistribution layers are… 
Highly Cited
1998
Highly Cited
1998
High performance no-flow underfills for low-cost flip-chip applications: material characterization
Underfill encapsulant is critical to the reliability of the flip-chip solder joint interconnects. Novel no-flow underfill… 
1997
1997
60 GHz flip-chip assembled MIC design considering chip-substrate effect
In this paper, a 60 GHz MICs with flip-chip assembled pseudomorphic-HEMT is demonstrated. With electromagnetic field analysis… 
1994
1994
Optoelectronic time-of-flight design and the demonstration of an all-optical, stored program, digital computer
The recent demonstration of an all-optical, stored-program, digital computer by our group focused on high-speed optoelectronic… 
1992
1992
Flip-chip bonding optimizes opto-ICs
The development of fabrication techniques for optical components and hybrid assemblies based on flip-chip bonding is outlined. It… 
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