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Bumpless Build-up Layer

Known as: BBUL 
Bumpless Build-up Layer or BBUL is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder… 
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Central processing unitFlip chip

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
Including an integrated heat spreader bumpless build-up layer package
Examples include die package, the package may include a die having a microelectronic die surface, side surfaces and a die surface… 
2013
2013
Van press die of bumpless build-up layer (bbul) for - Package interface
Embodiments of the present disclosure, the plurality of integrated circuit (IC) package assembly, are directed to a plurality of… 
2012
2012
Bumpless build-up layer package warpage reduction
Geotinde the present disclosure is directed toward a microelectronic package and a manufacturing field, in which a… 
2012
2012
Intégration d'un dispositif secondaire dans des boîtiers de dispositifs microélectroniques sans cœur
La presente invention concerne le domaine de la fabrication de boitiers de dispositifs microelectroniques et, plus… 
2012
2012
The method of forming a microelectronic device package and
The present disclosure relates to the field of micro-fabrication of microelectronic device package, and more particularly… 
2011
2011
Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
A method of forming a microelectronic packaging structure and is related to the structure described is formed thereby. The method… 
2011
2011
Bumpless build-up layer package design with an interposer
The present disclosure relates to the field of integrated circuit package design and, more particularly, to packages using a… 
2011
2011
Interposer having a bumpless build-up layer package design
The present disclosure relates to integrated circuit packaging design, and more particularly, to the use of bumpless build-up… 
2009
2009
Package on package using a bump-less build up layer under (BBUL) -Bausteins
An apparatus comprising: a microelectronic chip, an inactive surface has an active face parallel to the active area and at least… 
2001
2001
Internet2 upgrades backbone
27 already inhaled all the spores into his lungs. Therefore, they told him to continue taking the antibiotics. Largely because… 
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