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Driving AMPA receptors into synapses by LTP and CaMKII: requirement for GluR1 and PDZ domain interaction.
To elucidate mechanisms that control and execute activity-dependent synaptic plasticity, alpha-amino-3-hydroxy-5-methyl-4-isoxazole propionate receptors (AMPA-Rs) with an electrophysiological tagExpand
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Rapid spine delivery and redistribution of AMPA receptors after synaptic NMDA receptor activation.
To monitor changes in alpha-amino-3-hydroxy-5-methyl-4-isoxazole propionate (AMPA) receptor distribution in living neurons, the AMPA receptor subunit GluR1 was tagged with green fluorescent proteinExpand
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Two-photon imaging in living brain slices.
Two-photon excitation laser scanning microscopy (TPLSM) has become the tool of choice for high-resolution fluorescence imaging in intact neural tissues. Compared with other optical techniques, TPLSMExpand
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Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications
As one of the key requirements of the no-flow underfill materials for flip-chip applications, a proper self-fluxing agent must be incorporated in the developed no-flow underfill materials to provideExpand
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Evolution of parental ITS regions of nuclear rDNA in allopolyploid Aegilops (Poaceae) species.
The genus Aegilops comprises approximately 25 diploid, tetraploid and hexaploid species, in which the genome types of all allopolyploids involve either U or D genome, or both of them. The internalExpand
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ITS regions in diploids of Aegilops (Poaceae) and their phylogenetic implications.
The nucleotide sequences of the internal transcribed spacer (ITS) of nuclear ribosomal DNA in nine diploid species representing six sections of Aegilops were determined by direct sequencing ofExpand
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Development of the wafer level compressive-flow underfill process and its required materials
This paper described a wafer-level compressive flow underfill process and its involved materials for a novel SMT transparent flip-chip technology. In this flip-chip technology, a liquid fluxableExpand
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High performance no-flow underfills for low-cost flip-chip applications: material characterization
Underfill encapsulant is critical to the reliability of the flip-chip solder joint interconnects. Novel no-flow underfill encapsulant is an attractive flip-chip encapsulant due to the simplificationExpand
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High performance no flow underfills for low-cost flip-chip applications
Underfill encapsulant is critical to the reliability of the flip-chip solder joint interconnects. No-flow underfill encapsulant is one type of underfill encapsulants and is increasingly becomingExpand
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