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Embedded Wafer Level Ball Grid Array

Known as: EWLB 
Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial… 
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Ball grid arrayChip-scale package

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2020
2020
Fan-out wafer-level packaging as packaging technology for MEMS
2019
2019
Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform
2017
2017
Reliability of embedded wafer level ball grid arrays in automotive applications
A general trend in automotive electronics is the development of customized products with the focus on system integration… 
2017
2017
Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) Technology
FO-WLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent… 
2016
2016
Secured Miniaturized System-in-Package Contactless and Passive Authentication Devices Featuring NFC
2013
2013
“ Flipchip eWLB ( embedded Wafer Level Ball Grid Array ) Technology as Innovative 2 . 5 D Packaging Solutions
The market for portable and mobile data devices connected to a virtual cloud access point is exploding and driving increased… 
2012
2012
Advanced low profile PoP solution with embedded wafer level PoP (eWLB-PoP) technology
Current portable electronic products are driving component packaging towards 3D packaging technologies for integrating multiple… 
2011
2011
Electromigration behavior of interconnects between chip and board for embedded wafer level ball grid array (eWLB)
The electromigration (EM) behavior at critical interfaces of copper redistribution layers (RDL) used in an embedded wafer level… 
2009
2009
Challenges for extra large embedded wafer level ball grid array development
Fan-out embedded wafer level ball grid array (eWLB) is a very promising packaging technology with many advantages in comparison… 
2006
2006
Embedded wafer level ball grid array (eWLB)
Wafer level packaging is gaining tremendous interest throughout the semiconductor industry, due to advantages in cost and… 
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