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Embedded Wafer Level Ball Grid Array

Known as: EWLB 
Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial… 
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2 relations
Ball grid arrayChip-scale package

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
Non-galvanic Interconnects for Millimeter-wave Systems
Fueled by the increasing demand for higher data rates, millimeter-wave (mmW) systems emerged as a candidate that can provide… 
2017
2017
Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) Technology
FO-WLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent… 
2016
2016
Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor
Abstract The market for portable and mobile data access devices that are wirelessly connected to the cloud anytime and anywhere… 
2013
2013
“ Flipchip eWLB ( embedded Wafer Level Ball Grid Array ) Technology as Innovative 2 . 5 D Packaging Solutions
The market for portable and mobile data devices connected to a virtual cloud access point is exploding and driving increased… 
2012
2012
Wideband differential antenna in package with superstrate structure at 77GHz
This paper presents a novel antenna in package solution with superstrate structure at 77 GHz for automotive radar applications… 
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