Skip to search formSkip to main contentSkip to account menu

Embedded Wafer Level Ball Grid Array

Known as: EWLB 
Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial… 
Wikipedia (opens in a new tab)

Related topics

Related topics

2 relations
Ball grid arrayChip-scale package

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2020
2020
Fan-out wafer-level packaging as packaging technology for MEMS
2019
2019
Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform
2017
2017
Reliability of embedded wafer level ball grid arrays in automotive applications
A general trend in automotive electronics is the development of customized products with the focus on system integration… 
2017
2017
Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) Technology
FO-WLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent… 
2016
2016
Secured Miniaturized System-in-Package Contactless and Passive Authentication Devices Featuring NFC
2015
2015
Novel embedded Z line (EZL) vertical interconnect technology for eWLB
In this paper, we present the novel embedded Z line (EZL) interconnection technology, which allows fabricating vertical contacts… 
2013
2013
“ Flipchip eWLB ( embedded Wafer Level Ball Grid Array ) Technology as Innovative 2 . 5 D Packaging Solutions
The market for portable and mobile data devices connected to a virtual cloud access point is exploding and driving increased… 
2012
2012
Comparative analysis of high-frequency transitions in Embedded Wafer Level BGA (eWLB) and Quad Flat no Leads (VQFN) Packages
Embedded Wafer Level Ball Grid Array (eWLB) is one of the most advantageous packaging technologies with respect to higher I/O… 
2011
2011
A 5.9-to-7.8 GHz VCO in 65 nm CMOS using high-Q inductor in an embedded Wafer Level BGA package
We present a 5.9-to-7.8 GHz voltage-controlled oscillator (VCO) fabricated in a 65 nm CMOS technology and assembled in a chip… 
2009
2009
Challenges for extra large embedded wafer level ball grid array development
Fan-out embedded wafer level ball grid array (eWLB) is a very promising packaging technology with many advantages in comparison… 
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy (opens in a new tab), Terms of Service (opens in a new tab), and Dataset License (opens in a new tab)