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Embedded Wafer Level Ball Grid Array
Known as:
EWLB
Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial…
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Related topics
Related topics
2 relations
Ball grid array
Chip-scale package
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2020
2020
Fan-out wafer-level packaging as packaging technology for MEMS
H. Kuisma
,
A. Cardoso
,
T. Braun
2020
Corpus ID: 219002434
2019
2019
Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform
T. Meyer
,
S. Kroehnert
Advances in Embedded and Fan-Out Wafer-Level…
2019
Corpus ID: 145948405
2017
2017
Reliability of embedded wafer level ball grid arrays in automotive applications
Michael Novak
,
W. Grübl
,
B. Schuch
,
Peter Ossimitz
European Microelectronics and Packaging…
2017
Corpus ID: 22323393
A general trend in automotive electronics is the development of customized products with the focus on system integration…
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2017
2017
Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) Technology
S. Yoon
2017
Corpus ID: 115497470
FO-WLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent…
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2016
2016
Secured Miniaturized System-in-Package Contactless and Passive Authentication Devices Featuring NFC
N. Druml
,
Jürgen Schilling
,
+4 authors
G. Holweg
Euromicro Symposium on Digital Systems Design
2016
Corpus ID: 7837538
2013
2013
“ Flipchip eWLB ( embedded Wafer Level Ball Grid Array ) Technology as Innovative 2 . 5 D Packaging Solutions
S. Yoon
,
P. Tang
,
Yaojian Lin
2013
Corpus ID: 189759704
The market for portable and mobile data devices connected to a virtual cloud access point is exploding and driving increased…
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2012
2012
Advanced low profile PoP solution with embedded wafer level PoP (eWLB-PoP) technology
S. Yoon
,
Jose Alvin Caparas
,
Yaojian Lin
,
P. Marimuthu
IEEE 62nd Electronic Components and Technology…
2012
Corpus ID: 44746911
Current portable electronic products are driving component packaging towards 3D packaging technologies for integrating multiple…
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2011
2011
Electromigration behavior of interconnects between chip and board for embedded wafer level ball grid array (eWLB)
R. Bauer
,
A. Fischer
,
C. Birzer
,
L. Alexa
Electronic Components and Technology Conference
2011
Corpus ID: 24040172
The electromigration (EM) behavior at critical interfaces of copper redistribution layers (RDL) used in an embedded wafer level…
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2009
2009
Challenges for extra large embedded wafer level ball grid array development
J. Luan
,
Yonggang Jin
,
+4 authors
X. Baraton
Electronic Packaging Technology Conference
2009
Corpus ID: 33528608
Fan-out embedded wafer level ball grid array (eWLB) is a very promising packaging technology with many advantages in comparison…
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2006
2006
Embedded wafer level ball grid array (eWLB)
M. Brunnbauer
,
E. Furgut
,
G. Beer
,
T. Meyer
Electronic Packaging Technology Conference
2006
Corpus ID: 47432519
Wafer level packaging is gaining tremendous interest throughout the semiconductor industry, due to advantages in cost and…
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