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Embedded Wafer Level Ball Grid Array

Known as: EWLB 
Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
2017
2017
A general trend in automotive electronics is the development of customized products with the focus on system integration… 
2017
2017
FO-WLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent… 
2013
2013
The market for portable and mobile data devices connected to a virtual cloud access point is exploding and driving increased… 
2012
2012
Current portable electronic products are driving component packaging towards 3D packaging technologies for integrating multiple… 
2011
2011
The electromigration (EM) behavior at critical interfaces of copper redistribution layers (RDL) used in an embedded wafer level… 
2009
2009
Fan-out embedded wafer level ball grid array (eWLB) is a very promising packaging technology with many advantages in comparison… 
2006
2006
Wafer level packaging is gaining tremendous interest throughout the semiconductor industry, due to advantages in cost and…