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Embedded Wafer Level Ball Grid Array

Known as: EWLB 
Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial… 
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Related topics

Related topics

2 relations
Ball grid arrayChip-scale package

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2020
2020
Fan-out wafer-level packaging as packaging technology for MEMS
2019
2019
Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform
2017
2017
Reliability of embedded wafer level ball grid arrays in automotive applications
A general trend in automotive electronics is the development of customized products with the focus on system integration… 
2017
2017
Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) Technology
FO-WLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent… 
2016
2016
Secured Miniaturized System-in-Package Contactless and Passive Authentication Devices Featuring NFC
2015
2015
Integration Through Wafer-Level Packaging Approach
System-in-Package (SiP) concept has been adopted from a system-on-board practice when board-space is a concern. This is very… 
2013
2013
“ Flipchip eWLB ( embedded Wafer Level Ball Grid Array ) Technology as Innovative 2 . 5 D Packaging Solutions
The market for portable and mobile data devices connected to a virtual cloud access point is exploding and driving increased… 
2013
2013
High-speed packages with imperfect power and ground planes
  • Kai LiuR. Frye B. Ahn
  • IEEE 63rd Electronic Components and Technology…
  • 2013
  • Corpus ID: 924242
In this paper, power-plane and ground-plane characterization on laminate packages and on wafer-level packages are carried out… 
2012
2012
Comparative analysis of high-frequency transitions in Embedded Wafer Level BGA (eWLB) and Quad Flat no Leads (VQFN) Packages
Embedded Wafer Level Ball Grid Array (eWLB) is one of the most advantageous packaging technologies with respect to higher I/O… 
2009
2009
Challenges for extra large embedded wafer level ball grid array development
Fan-out embedded wafer level ball grid array (eWLB) is a very promising packaging technology with many advantages in comparison… 
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