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Three-dimensional integrated circuit

Known as: 3D Computer Chip, Bond, 3DS (die stacking) 
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2011
2011
In this work, we propose an efficient and accurate full-chip through-silicon-via (TSV) interfacial crack analysis flow and design… 
Highly Cited
2011
Highly Cited
2011
Handling and shipping thin wafers (≦200μm) through all the semiconductor fabrication and packaging assembly processes are very… 
Highly Cited
2010
Highly Cited
2010
3D-IC packaging using through silicon via technology has been extensively developed to meet small form factor and low power… 
Highly Cited
2009
Highly Cited
2009
Developments of ultra fine pitch and high density solder microbumps and assembly process for low cost 3D stacking technologies… 
2009
2009
PoP structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones… 
2007
2007
In this paper, we describe details of our bonding protocol for 150-mm diameter wafers, leading to a 50% increase in oxide-oxide… 
Highly Cited
2007
Highly Cited
2007
Two RF techniques are combined with capacitive coupling interconnect to form ultra-wide-bandwidth impulse interconnect and RF… 
2006
2006
3DICs are motivated by the expectation of better performance over their 2D counterparts; however, non-idealities threaten to… 
2004
2004
This dissertation concerns the design of circuits and systems for an emerging technology known as three-dimensional integration… 
1995
1995
We have demonstrated multi-gigabit-rate large-signal modulation of vertical-cavity bottom-surface-emitting lasers (VCSELs…