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Three-dimensional integrated circuit
Known as:
3D Computer Chip
, Bond
, 3DS (die stacking)
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In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and…
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Related topics
Related topics
38 relations
Bandwidth (signal processing)
Bus (computing)
CMOS
Central processing unit
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Broader (1)
Semiconductor device fabrication
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Advancing the thermal stability of 3D-IC's using logi-thermal simulation
G. Nagy
,
P. Horváth
,
L. Pohl
,
A. Poppe
International Workshop on Thermal Investigations…
2014
Corpus ID: 6765167
Highly Cited
2010
Highly Cited
2010
Fine pitch chip interconnection technology for 3D integration
Jihwan. Hwang
,
Jongyeon Kim
,
W. Kwon
,
U. Kang
,
T. Cho
,
Sayoon Kang
Electronic Components and Technology Conference
2010
Corpus ID: 20454949
3D-IC packaging using through silicon via technology has been extensively developed to meet small form factor and low power…
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2009
2009
Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
Y. Orii
,
K. Toriyama
,
+6 authors
C. Feger
Electronic Components and Technology Conference
2009
Corpus ID: 13205813
PoP structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones…
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2007
2007
Scaling Three-Dimensional SOI Integrated-Circuit Technology
C.K. Chen
,
K. Warner
,
+5 authors
C. Keast
IEEE International SOI Conference
2007
Corpus ID: 22282635
In this paper, we describe details of our bonding protocol for 150-mm diameter wafers, leading to a 50% increase in oxide-oxide…
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2006
2006
Performance Trend in Three-Dimensional Integrated Circuits
Hao Hua
,
C. Mineo
,
K. Schoienfliess
,
A. Sule
,
S. Melamed
,
W. R. Davis
International Interconnect Technology Conference
2006
Corpus ID: 17377371
3DICs are motivated by the expectation of better performance over their 2D counterparts; however, non-idealities threaten to…
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2004
2004
Design automation and analysis of three-dimensional integrated circuits
Shamik Das
2004
Corpus ID: 2867133
This dissertation concerns the design of circuits and systems for an emerging technology known as three-dimensional integration…
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2004
2004
Back-end compatibility of bonding and thinning processes for a wafer-level 3D interconnect technology platform
S. Pozder
,
J. Lu
,
+6 authors
R. Gutmann
Proceedings of the IEEE International…
2004
Corpus ID: 45078403
A previously proposed wafer-level 3D IC technology platform has been extensively evaluated for compatibility with conventional IC…
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2003
2003
Effect of autoclave test on anisotropic conductive joints
C. W. Tan
,
Y. Chan
,
N. H. Yeung
Microelectronics and reliability
2003
Corpus ID: 15549772
1996
1996
In situ observation of the self-alignment during FC-bonding under vacuum with and without H2
J. Kuhmann
,
D. Pech
IEEE Photonics Technology Letters
1996
Corpus ID: 41165545
With an in situ observation during flip-chip bonding under vacuum conditions, we demonstrate in this letter that accurate passive…
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1995
1995
Gigabit-rate optical-signal transmission using vertical-cavity surface-emitting lasers with large-core plastic-cladding fibers
H. Kosaka
,
K. Dutta
,
K. Kurihara
,
Y. Sugimoto
,
K. Kasahara
IEEE Photonics Technology Letters
1995
Corpus ID: 9566718
We have demonstrated multi-gigabit-rate large-signal modulation of vertical-cavity bottom-surface-emitting lasers (VCSELs…
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