Three-dimensional integrated circuit

Known as: 3D Computer Chip, Bond, 3DS (die stacking) 
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and… (More)
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Papers overview

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Highly Cited
2010
Highly Cited
2010
Three-dimensional (3D) interconnection technology offers several electrical advantages, including reduced signal delay, reduced… (More)
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Highly Cited
2009
Highly Cited
2009
Three-dimensional integrated circuit (3D IC) is emerging as an attractive option for overcoming the barriers in interconnect… (More)
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Highly Cited
2009
Highly Cited
2009
The Network-on-Chip (NoC) paradigm has emerged as a revolutionary methodology for integrating a very high number of intellectual… (More)
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2007
2007
Thermal effects on different tiers of wafer-scale three dimensional (3D) integrated circuits were examined. The temperature was… (More)
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Review
2006
Review
2006
integrated circuits A. W. Topol D. C. La Tulipe, Jr. L. Shi D. J. Frank K. Bernstein S. E. Steen A. Kumar G. U. Singco A. M… (More)
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2006
2006
  • TVVT CV I CVDelay THDD
  • 2006
3DICs are motivated by the expectation of better performance over their 2D counterparts; however, nonidealities threaten to… (More)
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Highly Cited
2005
Highly Cited
2005
A 1024/spl times/1024 integrated image sensor with 8 /spl mu/m pixels, is developed with 3D fabrication in 150 mm wafer… (More)
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2004
2004
Three-dimensional (3D) stacked integrated circuits (ICs) can significantly improve circuit performance and offer the promise of… (More)
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Highly Cited
2000
Highly Cited
2000
In this paper, the wire (interconnect)-length distribution of three-dimensional (3-D) integrated circuits (ICs) is derived using… (More)
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Highly Cited
1986
Highly Cited
1986
Recent advances in fabrication technology have rendered imminent the fabrication of multilayer (i.e., three-dimensional) chips… (More)
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