Three-dimensional integrated circuit

Known as: 3D Computer Chip, Bond, 3DS (die stacking) 
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and… (More)
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Related topics

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38 relations
Bandwidth (signal processing)Bus (computing)CMOSCentral processing unit
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Broader (1)

Semiconductor device fabrication

Papers overview

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Highly Cited
2010
Highly Cited
2010
Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits
Three-dimensional (3D) interconnection technology offers several electrical advantages, including reduced signal delay, reduced… (More)
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Highly Cited
2009
Highly Cited
2009
System-level cost analysis and design exploration for three-dimensional integrated circuits (3D ICs)
Three-dimensional integrated circuit (3D IC) is emerging as an attractive option for overcoming the barriers in interconnect… (More)
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Highly Cited
2009
Highly Cited
2009
Networks-on-Chip in a Three-Dimensional Environment: A Performance Evaluation
The Network-on-Chip (NoC) paradigm has emerged as a revolutionary methodology for integrating a very high number of intellectual… (More)
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2007
2007
Thermal Effects of Three Dimensional Integrated Circuit Stacks
Thermal effects on different tiers of wafer-scale three dimensional (3D) integrated circuits were examined. The temperature was… (More)
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Review
2006
Review
2006
Three-dimensional integrated circuits
integrated circuits A. W. Topol D. C. La Tulipe, Jr. L. Shi D. J. Frank K. Bernstein S. E. Steen A. Kumar G. U. Singco A. M… (More)
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2006
2006
Performance Trend in Three-Dimensional Integrated Circuits
  • TVVT CV I CVDelay THDD
  • 2006
3DICs are motivated by the expectation of better performance over their 2D counterparts; however, nonidealities threaten to… (More)
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Highly Cited
2005
Highly Cited
2005
Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology
A 1024/spl times/1024 integrated image sensor with 8 /spl mu/m pixels, is developed with 3D fabrication in 150 mm wafer… (More)
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2004
2004
Fast, automated thermal simulation of three-dimensional integrated circuits
Three-dimensional (3D) stacked integrated circuits (ICs) can significantly improve circuit performance and offer the promise of… (More)
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Highly Cited
2000
Highly Cited
2000
System-level performance evaluation of three-dimensional integrated circuits
In this paper, the wire (interconnect)-length distribution of three-dimensional (3-D) integrated circuits (ICs) is derived using… (More)
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Highly Cited
1986
Highly Cited
1986
Three-Dimensional Circuit Layouts
Recent advances in fabrication technology have rendered imminent the fabrication of multilayer (i.e., three-dimensional) chips… (More)
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