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Three-dimensional integrated circuit

Known as: 3D Computer Chip, Bond, 3DS (die stacking) 
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and… 
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Related topics

Related topics

38 relations
Bandwidth (signal processing)Bus (computing)CMOSCentral processing unit

Broader (1)

Semiconductor device fabrication

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2011
2011
Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC
In this work, we propose an efficient and accurate full-chip through-silicon-via (TSV) interfacial crack analysis flow and design… 
Highly Cited
2010
Highly Cited
2010
Fine pitch chip interconnection technology for 3D integration
3D-IC packaging using through silicon via technology has been extensively developed to meet small form factor and low power… 
2010
2010
Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects
We report here on the design, fabrication and characterization of highly-integrated 3-D Optochips consisting of a Si carrier… 
2009
2009
Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
PoP structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones… 
2009
2009
Through silicon via (TSV) equalizer
Through silicon via (TSV) is a promising vertical interconnection method to achieve a 3-dimensional integrated circuit (3D IC… 
2007
2007
Scaling Three-Dimensional SOI Integrated-Circuit Technology
In this paper, we describe details of our bonding protocol for 150-mm diameter wafers, leading to a 50% increase in oxide-oxide… 
Highly Cited
2007
Highly Cited
2007
Thin-Film Encapsulated RF MEMS Switches
A wafer-level thin-film encapsulation process has been demonstrated to package radio-frequency (RF) microelectromechanical… 
2006
2006
Performance Trend in Three-Dimensional Integrated Circuits
3DICs are motivated by the expectation of better performance over their 2D counterparts; however, non-idealities threaten to… 
2004
2004
Design automation and analysis of three-dimensional integrated circuits
This dissertation concerns the design of circuits and systems for an emerging technology known as three-dimensional integration… 
1995
1995
Gigabit-rate optical-signal transmission using vertical-cavity surface-emitting lasers with large-core plastic-cladding fibers
We have demonstrated multi-gigabit-rate large-signal modulation of vertical-cavity bottom-surface-emitting lasers (VCSELs… 
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