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Reflow soldering
Known as:
Reflow solder
, Reflow
, Reflowing
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Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several…
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Related topics
Related topics
20 relations
Bead probe technology
Contact pad
Die (integrated circuit)
Hot air solder leveling
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2009
Highly Cited
2009
Adsorption kinetics and thermodynamics of malachite green dye unto acid
2009
Corpus ID: 1647355
A carbonaceous adsorbent prepared from an indigenous waste by acid treatment was tested for its efficiency in removing Malachite…
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Review
2006
Review
2006
Optimisation of Lead Free Solders Reflow Profile
A. Pietrikova
,
L. Livovsky
,
J. Urbančík
,
R. Bučko
Information Security Solutions Europe
2006
Corpus ID: 31116844
The solder reflow profile is one of the key variables in the manufacturing process that significantly impacts product yield. In…
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Highly Cited
2003
Highly Cited
2003
Effect of 0.5 wt % Cu in Sn-3.5%ag solder on the interfacial reaction with Au/Ni metallization
M. Alam
,
Y. Chan
,
K. Tu
2003
Corpus ID: 97083111
The work presented here focuses on the role of 0.5 wt % Cu in the interfacial reaction between the molten Sn−3.5%Ag solder and…
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Highly Cited
2002
Highly Cited
2002
Gα12 and Gα13 Interact with Ser/Thr Protein Phosphatase Type 5 and Stimulate Its Phosphatase Activity
Y. Yamaguchi
,
H. Katoh
,
K. Mori
,
M. Negishi
Current Biology
2002
Corpus ID: 11485795
Highly Cited
2001
Highly Cited
2001
Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish
C. M. Liu
,
C. Ho
,
W. Chen
,
C. Kao
2001
Corpus ID: 97461092
The reaction between the eutectic Sn-3.5Ag solder and the Au/Ni surface finish during reflow as well as during isothermal aging…
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Highly Cited
2001
Highly Cited
2001
Supporting Context Changes for Plastic User Interfaces: A Process and a Mechanism
Gaëlle Calvary
,
J. Coutaz
,
David Thevenin
BCS HCI/IHM
2001
Corpus ID: 13837760
Mobility coupled with the development of a wide variety of access devices has engendered new requirements for HCI such as the…
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Highly Cited
2000
Highly Cited
2000
A Designed β‐Hairpin Containing a Natural Hydrophobic Cluster
J. Espinosa
,
S. Gellman
2000
Corpus ID: 17065174
b-Sheets are a very common substructure in folded proteins, [1] and intermolecular sheet-type interactions play a crucial role in…
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Highly Cited
1997
Highly Cited
1997
Nonorthogonal tight-binding molecular-dynamics scheme for silicon with improved transferability
M. Menon
,
K. Subbaswamy
1997
Corpus ID: 1564387
Department of Physics and Astronomy, University of Kentucky, Lexington, Kentucky 40506~Received 9 September 1996!A previously…
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Review
1989
Review
1989
Knowledge Programming in Loops: Report on an Experimental Course
M. Stefik
,
D. Bobrow
,
S. Mittal
,
L. Conway
The AI Magazine
1989
Corpus ID: 2712977
Early this year fifty people took an experimental course at Xerox PARC on knowledge programming in Loops During the course, they…
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1974
1974
Singularities of elastic stresses and of harmonic functions at conical notches or inclusions
Z. Bažant
,
L. Keer
1974
Corpus ID: 11159886
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