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Hot air solder leveling
Known as:
HAL
, HASL
HASL or hot air solder leveling is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder…
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Related topics
Related topics
4 relations
Electroless nickel immersion gold
Printed circuit board
Reflow soldering
Wave soldering
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Sn–Cu–Ni Soldering Process Optimization Using Multivariate Analysis
Chien-Yi Huang
,
Hui-Hua Huang
,
Kuo-Ching Ying
IEEE Transactions on Components, Packaging, and…
2012
Corpus ID: 31281958
One lead free solder candidate, Sn-Ag-Cu305 (Sn96.5/Ag3.0/Cu0.5), has come into widespread use as a replacement for traditional…
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2009
2009
4 P soldering model for solder joints quality assessment
P. Svasta
,
I. Plotog
,
T. Cucu
,
A. Vasile
,
A. Marin
Information Security Solutions Europe
2009
Corpus ID: 26269080
The reliability of microelectronics components and assemblies it should be considered as expression of solder joints…
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2007
2007
Influence of PCB Surface Finish and Thermal and Temperature/Humidity Aging on the Performance of a Novel Anisotropic Conductive Adhesive for Lead-free Surface Mount Assembly
S. Ramkumar
,
K. Srihari
Proceedings 57th Electronic Components and…
2007
Corpus ID: 24545465
The electronics industry, in recent years, has been focusing primarily on product miniaturization and lead-free assembly. The…
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2006
2006
Hot Air Solder Leveling in the Lead-free Era
K. Sweatman
2006
Corpus ID: 107396498
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit…
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2005
2005
MOLECULAR MODELLING OF HUMAN ALDEHYDE OXIDASE AND IDENTIFICATION OF THE KEY INTERACTIONS IN THE ENZYME-SUBSTRATE COMPLEX
S. Dastmalchi
,
Maryam Hamzeh-Mivehrod
2005
Corpus ID: 56027158
Aldehyde oxidase (EC 1.2.3.1), a cytosolic enzyme containing FAD, molybdenum and iron-sulphur cluster, is a member of non…
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2005
2005
Lead-free 0201 assembly and reliability
S. Ramkumar
,
R. Newasekar
,
R. Ghaffarian
Proceedings. International Symposium on Advanced…
2005
Corpus ID: 23527873
The many challenges with 0201 assembly can be attributed to the solder paste volume, pad design, aperture design, board finish…
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Highly Cited
2002
Highly Cited
2002
A hybrid anaerobic solid-liquid bioreactor for food waste digestion
Hai-Lou Xu
,
Jing-Yuan Wang
,
Tay Joo-Hwa
Biotechnology Letters
2002
Corpus ID: 34891183
A hybrid anaerobic solid-liquid (HASL) bioreactor is an enhanced two-phase anaerobic system, that consists of a solid waste…
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1993
1993
Characterization and optimization of a Hot Air Solder-Leveling System
R. Penniston
,
D. Stockdale
1993
Corpus ID: 135936822
The characterization and optimization of a new Hot Air Sokkr-Leveling (HASL) System in the Printed Wiring Board Fabrication Area…
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1984
1984
An MOS Digital Network Model on a Modified Thevenin Equivalent for Logic Simulation
Tsuyoshi Takahashi
,
Satoshi Kojima
,
O. Yamashiro
,
Kazuhiko Eguchi
,
H. Fukuda
Design Automation Conference, Proceedings
1984
Corpus ID: 17478312
A novel analytical model of MOS digital networks, which is based on a modified Thevenin equivalent, is described. The model can…
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1965
1965
The HASL Bone Program 1961-1964
J. Rivera
,
J. Harley
1965
Corpus ID: 129807916
Report documenting the measuring of strontium-90 levels contained in the bones of children and adults of various age brackets…
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