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Hot air solder leveling

Known as: HAL, HASL 
HASL or hot air solder leveling is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
One lead free solder candidate, Sn-Ag-Cu305 (Sn96.5/Ag3.0/Cu0.5), has come into widespread use as a replacement for traditional… 
2009
2009
The reliability of microelectronics components and assemblies it should be considered as expression of solder joints… 
2007
2007
The electronics industry, in recent years, has been focusing primarily on product miniaturization and lead-free assembly. The… 
2006
2006
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit… 
2005
2005
Aldehyde oxidase (EC 1.2.3.1), a cytosolic enzyme containing FAD, molybdenum and iron-sulphur cluster, is a member of non… 
2005
2005
The many challenges with 0201 assembly can be attributed to the solder paste volume, pad design, aperture design, board finish… 
Highly Cited
2002
Highly Cited
2002
A hybrid anaerobic solid-liquid (HASL) bioreactor is an enhanced two-phase anaerobic system, that consists of a solid waste… 
1993
1993
The characterization and optimization of a new Hot Air Sokkr-Leveling (HASL) System in the Printed Wiring Board Fabrication Area… 
1984
1984
A novel analytical model of MOS digital networks, which is based on a modified Thevenin equivalent, is described. The model can… 
1965
1965
Report documenting the measuring of strontium-90 levels contained in the bones of children and adults of various age brackets…