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Printed circuit board
Known as:
Power plane
, CCA
, Printed circuit board design
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A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features…
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Related topics
Related topics
50 relations
AlSiC
Altium Designer
CAD data exchange
Chamfer
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2015
Highly Cited
2015
Large area compression molding for Fan-out Panel Level Packing
T. Braun
,
S. Raatz
,
+7 authors
K. Lang
Electronic Components and Technology Conference
2015
Corpus ID: 37420003
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this…
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Highly Cited
2013
Highly Cited
2013
Understanding the effect of PCB layout on circuit performance in a high frequency gallium nitride based point of load converter
D. Reusch
,
J. Strydom
Applied Power Electronics Conference
2013
Corpus ID: 47558221
The introduction of enhancement mode gallium nitride based power devices such as the eGaN®FET offers the potential to achieve…
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Highly Cited
2013
Highly Cited
2013
Realistic case studies of wireless structural control
Bo Li
,
Zhuoxiong Sun
,
+5 authors
Billie F. Spencer
International Conference on Cyber-Physical…
2013
Corpus ID: 11030917
Wireless Structural Control (WSC) systems can play a crucial role in protecting civil infrastructure in the event of earthquakes…
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Highly Cited
2012
Highly Cited
2012
Cooperative Assembly of Hydrogen-Bonded Diblock Copolythiophene/Fullerene Blends for Photovoltaic Devices with Well-Defined Morphologies and Enhanced Stability
Ying Lin
,
J. Lim
,
Qingshuo Wei
,
S. Mannsfeld
,
A. Briseno
,
J. Watkins
2012
Corpus ID: 10441155
We report the cooperative self-assembly of functionalized fullerenes and all conjugated block copolymers (BCPs) containing…
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Highly Cited
2006
Highly Cited
2006
Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions
Toni T. Mattila
,
Pekka Marjamäki
,
J. Kivilahti
IEEE transactions on components and packaging…
2006
Corpus ID: 25384854
Failure modes and mechanisms under mechanical shock loading were studied by employing the statistical and fractographic research…
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Highly Cited
2005
Highly Cited
2005
Drop Impact: Fundamentals and Impact Characterisation of Solder Joints
E. Wong
,
R. Rajoo
,
Y. Mai
,
S. Sean
,
K. T. Tsai
,
L. Yap
Proceedings Electronic Components and Technology…
2005
Corpus ID: 37686623
This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact…
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Highly Cited
2004
Highly Cited
2004
Theoretical considerations in the optimization of surface waves on a planar structure
Samir F. Mahmoud
,
Y. Antar
,
Hany F. Hammad
,
A. Freundorfer
IEEE Transactions on Antennas and Propagation
2004
Corpus ID: 26192144
The problem of optimum excitation of surface waves on a grounded dielectric slab by means of slots in the ground plane is…
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1998
1998
Segmentation of Printed Circuit Board Images into Basic Patterns
Madhav Moganti
,
F. Erçal
Computer Vision and Image Understanding
1998
Corpus ID: 43740517
Abstract Segmentation is the first and foremost step in the inspection of the printed circuit boards . In this paper a new…
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Highly Cited
1979
Highly Cited
1979
Conductive Anodic Filaments in Reinforced Polymeric Dielectrics: Formation and Prevention
D. J. Lando
,
J. Mitchell
,
T. Welsher
IEEE International Reliability Physics Symposium
1979
Corpus ID: 24475275
The purpose of this paper is to report on a mode of failure observed during the life testing of epoxy-glass printed-circuit…
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Highly Cited
1973
Highly Cited
1973
How Big Should a Printed Circuit Board Be?
I. Sutherland
,
D. Oestreicher
IEEE transactions on computers
1973
Corpus ID: 41473867
This correspondence outlines a theory for choosing printed circuit board dimensions in order to avoid crowding of printed wiring…
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