Skip to search formSkip to main contentSkip to account menu
You are currently offline. Some features of the site may not work correctly.

Electroless nickel immersion gold

Known as: ENIG 
Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards. It consists of an electroless nickel plating… Expand
Wikipedia

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
  • W. Lai, P. Wong, +4 authors K. Yee
  • 7th International Microsystems, Packaging…
  • 2012
  • Corpus ID: 35715956
There are a number of final finishing technologies available in the market, each with different cost and performance attributes… Expand
  • figure 1
  • figure 3
  • figure 4
  • figure 5
  • figure 7
2010
2010
Electroless nickel and immersion gold (ENIG) is one of the most common final finishes used in PCBs. ENIG surfaces exhibit… Expand
  • table 1
  • table 2
  • figure 1
  • figure 2
  • table 3
2008
2008
We suggest a unique mechanism for surface defect generation causing solder joint or bonding failures in printed circuit boards… Expand
  • figure 1
  • figure 2
2008
2008
Because of their numerous functional design and ap- plication possibilities, the use of flex and rigid-flex PWBs is increasing… Expand
  • figure 2
  • figure 3
  • figure 1
  • figure 4
  • figure 5
2007
2007
This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless… Expand
  • table 1
  • figure 1
  • figure 2
  • figure 3
  • figure 5
Highly Cited
2007
Highly Cited
2007
For high density and performance of microelectronic devices, the 3-D system in package (SiP) has been considered as a superb… Expand
  • figure 2
  • figure 1
  • figure 4
  • figure 5
  • figure 3
2006
2006
Fulltext article is acessible via ASME Online (http://www.asme.org) or connect to A-Z Listing at http://mylib.unimap.edu.my/ 
2006
2006
Conventional gold (Au) wire bonding on aluminum (Al) bond pads leads to the formation of intermetallic compounds. During high… Expand
  • figure 2
  • table I
  • table III
  • table II
  • figure 3
2006
2006
Publications on the so called black pad defect, seen in electroless nickel/immersion gold (ENIG) surface finishes, often cite… Expand
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
2004
2004
This paper reports the number of experiments that were designed to study the effects of aluminum bond pad surfaces prior to… Expand
  • figure 2
  • figure 3
  • figure 5
  • figure 6