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Electroless nickel immersion gold
Known as:
ENIG
Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards. It consists of an electroless nickel plating…
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Related topics
Related topics
4 relations
Ball grid array
Hot air solder leveling
IAg
Printed circuit board
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Development of novel electroless nickel for Selective electroless nickel immersion gold applications
W. Lai
,
P. Wong
,
+4 authors
K. Yee
Impact
2012
Corpus ID: 35715956
There are a number of final finishing technologies available in the market, each with different cost and performance attributes…
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2008
2008
Electroless Nickel / Immersion Gold Process Technology for Improved Ductility of Flex and Rigid-Flex Applications
K. Johal
,
H. Roberts
,
Sven Lamprecht
,
C. Wunderlich
2008
Corpus ID: 139004914
Because of their numerous functional design and ap- plication possibilities, the use of flex and rigid-flex PWBs is increasing…
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2007
2007
The Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) Deposition
M. Arshad
,
A. Jalar
,
I. Ahmad
,
G. Omar
2007
Corpus ID: 53529932
This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless…
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2006
2006
The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
M. Arshad
,
I. Ahmad
,
A. Jalar
,
G. Omar
,
U. Hashim
2006
Corpus ID: 110005965
Fulltext article is acessible via ASME Online (http://www.asme.org) or connect to A-Z Listing at http://mylib.unimap.edu.my/
2006
2006
Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating
K. Zeng
,
R. Stierman
,
D. Abbott
,
M. Murtuza
Thermal and Thermomechanical Proceedings 10th…
2006
Corpus ID: 21537426
Publications on the so called black pad defect, seen in electroless nickel/immersion gold (ENIG) surface finishes, often cite…
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2006
2006
Optimization of gold wire bonding on electroless nickel immersion gold for high temperature applications
B. Ng
,
V. Ganesh
,
C. Lee
Electronic Packaging Technology Conference
2006
Corpus ID: 24009399
Conventional gold (Au) wire bonding on aluminum (Al) bond pads leads to the formation of intermetallic compounds. During high…
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Highly Cited
2006
Highly Cited
2006
The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating
K. Zeng
,
R. Stierman
,
D. Abbott
,
M. Murtuza
2006
Corpus ID: 16501914
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and…
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Highly Cited
2006
Highly Cited
2006
Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint
Luhua Xu
,
J. Pang
Electronic Components and Technology Conference
2006
Corpus ID: 46662785
Lead free solder joints used in surface mount packages like ball grid array (BGA) have a great impact on the reliability of the…
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Highly Cited
2005
Highly Cited
2005
Drop Impact: Fundamentals and Impact Characterisation of Solder Joints
E. Wong
,
R. Rajoo
,
Y. Mai
,
S. Sean
,
K. T. Tsai
,
L. Yap
Proceedings Electronic Components and Technology…
2005
Corpus ID: 37686623
This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact…
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2004
2004
The effects of zincation process on aluminum bond pad surfaces for electroless nickel immersion gold (ENIG) deposition
M. Arshad
,
I. Ahmad
,
A. Jalar
,
G. Omar
IEEE International Conference on Semiconductor…
2004
Corpus ID: 37581920
This paper reports the number of experiments that were designed to study the effects of aluminum bond pad surfaces prior to…
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