Electroless nickel immersion gold

Known as: ENIG 
Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards. It consists of an electroless nickel plating… (More)
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2012
2012
There are a number of final finishing technologies available in the market, each with different cost and performance attributes… (More)
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2011
2011
Electronic equipment has changed to have higher performance with minimized in size. This trend required to electronic devices… (More)
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2010
2010
Electroless nickel and immersion gold (ENIG) is one of the most common final finishes used in PCBs. ENIG surfaces exhibit… (More)
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2009
2009
0026-2714/$ see front matter 2009 Elsevier Ltd. A doi:10.1016/j.microrel.2008.12.016 * Corresponding author. Tel.: +86 10… (More)
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2007
2007
This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless… (More)
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2006
2006
Conventional gold (Au) wire bonding on aluminum (Al) bond pads leads to the formation of intermetallic compounds. During high… (More)
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2006
2006
Publications on the so called black pad defect, seen in electroless nickel/immersion gold (ENIG) surface finishes, often cite… (More)
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2006
2006
This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump… (More)
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2004
2004
This paper reports the number of experiments that were designed to study the effects of aluminum bond pad surfaces prior to… (More)
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2004
2004
Electroless nickel and immersion gold (ENIG) plating is one of the common pad metallurgical surface finish for area array… (More)
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