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Electroless nickel immersion gold
Known as:
ENIG
Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards. It consists of an electroless nickel plating…
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Related topics
4 relations
Ball grid array
Hot air solder leveling
IAg
Printed circuit board
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint
Junghwan Bang
,
Dong-Yurl Yu
,
Young-Ho Ko
,
Jeong-Won Yoon
,
Chang-Woo Lee
2016
Corpus ID: 138641391
Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting…
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2013
2013
Veiligheid in een laatmoderne cultuur
M. Schuilenburg
,
R. Swaaningen
2013
Corpus ID: 194106978
De afgelopen jaren is Nederland overspoeld door een ware tsunami aan nieuwe wetten en maatregelen om criminaliteit en overlast te…
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2011
2011
Mensenrechten in het Romeinse Recht
J. Giltaij
2011
Corpus ID: 191288215
textabstractDe vraagstelling van dit proefschrift kan aldus worden geformuleerd: ‘bestonden er in het klassieke Romeinse recht…
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2010
2010
INVESTIGATION OF THE ELECTROLESS NICKEL PLATED SiC PARTICLES IN METAL MATRIX COMPOSITES
J. Pázmán
,
J. Tóth
,
Z. Gácsi
2010
Corpus ID: 56365316
Electroless nickel (EN) plating was used to coat SiC particles, using three different pre-treatment methods (acidic pre-treatment…
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2009
2009
Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Thermocompression Gold Stud Bump Flip-Chip Attachment
E. Dodson
,
G. Clatterbaugh
2009
Corpus ID: 41579964
Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as…
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2008
2008
Electroless nickel/immersion gold and the effect of temperature on it
Lei Jun-xi
2008
Corpus ID: 139051144
The electroless nickel/immersion gold process flow and process control were introduced and the influence of temperature on…
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2006
2006
The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
M. Arshad
,
I. Ahmad
,
A. Jalar
,
G. Omar
,
U. Hashim
2006
Corpus ID: 110005965
Fulltext article is acessible via ASME Online (http://www.asme.org) or connect to A-Z Listing at http://mylib.unimap.edu.my/
2002
2002
Electroless nickel immersion gold and Black Pad
M. Walsh
2002
Corpus ID: 138488579
1957
1957
The Pycnogonid family Austrodecidae
J. Stock
1957
Corpus ID: 190708931
DE PYCNOGONIDEN- FAMILIE AUSTRODECIDAE Toen mij, in 1954, uit Oslo een verzameling Pycnogonida van de „Norwegian Scientific…
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1946
1946
De kunstmatige nier
Willem Johan Kolff
1946
Corpus ID: 193329128
Een patient, lijdende aan een ernstige acute renale uraemie sterft, indien men er niet in slaagt de afbraakproducten der…
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