Skip to search formSkip to main contentSkip to account menu
You are currently offline. Some features of the site may not work correctly.

Electroless nickel immersion gold

Known as: ENIG 
Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards. It consists of an electroless nickel plating… Expand
Wikipedia

Related topics

Related topics

4 relations
Ball grid arrayHot air solder levelingIAgPrinted circuit board

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Development of novel electroless nickel for Selective electroless nickel immersion gold applications
  • W. Lai, P. Wong, +4 authors K. Yee
  • 7th International Microsystems, Packaging…
  • 2012
    • Corpus ID: 35715956
There are a number of final finishing technologies available in the market, each with different cost and performance attributes… Expand
  • figure 1
  • figure 3
  • figure 4
  • figure 5
  • figure 7
2010
2010
Development of novel immersion gold for electroless nickel immersion gold process (ENIG) in PCB applications
Electroless nickel and immersion gold (ENIG) is one of the most common final finishes used in PCBs. ENIG surfaces exhibit… Expand
  • table 1
  • table 2
  • figure 1
  • figure 2
  • table 3
2008
2008
Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process
We suggest a unique mechanism for surface defect generation causing solder joint or bonding failures in printed circuit boards… Expand
  • figure 1
  • figure 2
2008
2008
Electroless Nickel / Immersion Gold Process Technology for Improved Ductility of Flex and Rigid-Flex Applications
Because of their numerous functional design and ap- plication possibilities, the use of flex and rigid-flex PWBs is increasing… Expand
  • figure 2
  • figure 3
  • figure 1
  • figure 4
  • figure 5
2007
2007
The Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) Deposition
This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless… Expand
  • table 1
  • figure 1
  • figure 2
  • figure 3
  • figure 5
Highly Cited
2007
Highly Cited
2007
Development and Evaluation of 3-D SiP with Vertically Interconnected Through Silicon Vias (TSV)
For high density and performance of microelectronic devices, the 3-D system in package (SiP) has been considered as a superb… Expand
  • figure 2
  • figure 1
  • figure 4
  • figure 5
  • figure 3
2006
2006
The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
Fulltext article is acessible via ASME Online (http://www.asme.org) or connect to A-Z Listing at http://mylib.unimap.edu.my/ 
2006
2006
Optimization of gold wire bonding on electroless nickel immersion gold for high temperature applications
Conventional gold (Au) wire bonding on aluminum (Al) bond pads leads to the formation of intermetallic compounds. During high… Expand
  • figure 2
  • table I
  • table III
  • table II
  • figure 3
2006
2006
Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating
Publications on the so called black pad defect, seen in electroless nickel/immersion gold (ENIG) surface finishes, often cite… Expand
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
2004
2004
The effects of zincation process on aluminum bond pad surfaces for electroless nickel immersion gold (ENIG) deposition
This paper reports the number of experiments that were designed to study the effects of aluminum bond pad surfaces prior to… Expand
  • figure 2
  • figure 3
  • figure 5
  • figure 6
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy, Terms of Service, and Dataset License
ACCEPT & CONTINUE