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Electroless nickel immersion gold

Known as: ENIG 
Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards. It consists of an electroless nickel plating… 
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Related topics

Related topics

4 relations
Ball grid arrayHot air solder levelingIAgPrinted circuit board

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Development of novel electroless nickel for Selective electroless nickel immersion gold applications
There are a number of final finishing technologies available in the market, each with different cost and performance attributes… 
2008
2008
Electroless Nickel / Immersion Gold Process Technology for Improved Ductility of Flex and Rigid-Flex Applications
Because of their numerous functional design and ap- plication possibilities, the use of flex and rigid-flex PWBs is increasing… 
2007
2007
The Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) Deposition
This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless… 
2006
2006
The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
Fulltext article is acessible via ASME Online (http://www.asme.org) or connect to A-Z Listing at http://mylib.unimap.edu.my/ 
2006
2006
Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating
Publications on the so called black pad defect, seen in electroless nickel/immersion gold (ENIG) surface finishes, often cite… 
2006
2006
Optimization of gold wire bonding on electroless nickel immersion gold for high temperature applications
Conventional gold (Au) wire bonding on aluminum (Al) bond pads leads to the formation of intermetallic compounds. During high… 
Highly Cited
2006
Highly Cited
2006
The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and… 
Highly Cited
2006
Highly Cited
2006
Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint
Lead free solder joints used in surface mount packages like ball grid array (BGA) have a great impact on the reliability of the… 
Highly Cited
2005
Highly Cited
2005
Drop Impact: Fundamentals and Impact Characterisation of Solder Joints
This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact… 
2004
2004
The effects of zincation process on aluminum bond pad surfaces for electroless nickel immersion gold (ENIG) deposition
This paper reports the number of experiments that were designed to study the effects of aluminum bond pad surfaces prior to… 
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