Electroless nickel immersion gold
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There are a number of final finishing technologies available in the market, each with different cost and performance attributes… Expand Electroless nickel and immersion gold (ENIG) is one of the most common final finishes used in PCBs. ENIG surfaces exhibit… Expand We suggest a unique mechanism for surface defect generation causing solder joint or bonding failures in printed circuit boards… Expand Because of their numerous functional design and ap- plication possibilities, the use of flex and rigid-flex PWBs is increasing… Expand This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless… Expand For high density and performance of microelectronic devices, the 3-D system in package (SiP) has been considered as a superb… Expand
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Conventional gold (Au) wire bonding on aluminum (Al) bond pads leads to the formation of intermetallic compounds. During high… Expand Publications on the so called black pad defect, seen in electroless nickel/immersion gold (ENIG) surface finishes, often cite… Expand This paper reports the number of experiments that were designed to study the effects of aluminum bond pad surfaces prior to… Expand