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Electroless nickel immersion gold

Known as: ENIG 
Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards. It consists of an electroless nickel plating… Expand
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Papers overview

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2012
2012
  • W. Lai, P. Wong, +4 authors K. Yee
  • 7th International Microsystems, Packaging…
  • 2012
  • Corpus ID: 35715956
There are a number of final finishing technologies available in the market, each with different cost and performance attributes… Expand
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2010
2010
Electroless nickel and immersion gold (ENIG) is one of the most common final finishes used in PCBs. ENIG surfaces exhibit… Expand
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2008
2008
We suggest a unique mechanism for surface defect generation causing solder joint or bonding failures in printed circuit boards… Expand
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2008
2008
Because of their numerous functional design and ap- plication possibilities, the use of flex and rigid-flex PWBs is increasing… Expand
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2007
2007
This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless… Expand
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2006
2006
Fulltext article is acessible via ASME Online (http://www.asme.org) or connect to A-Z Listing at http://mylib.unimap.edu.my/ 
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2006
2006
Conventional gold (Au) wire bonding on aluminum (Al) bond pads leads to the formation of intermetallic compounds. During high… Expand
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2006
2006
Publications on the so called black pad defect, seen in electroless nickel/immersion gold (ENIG) surface finishes, often cite… Expand
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Highly Cited
2006
Highly Cited
2006
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and… Expand
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2004
2004
Electroless nickel and immersion gold (ENIG) plating is one of the common pad metallurgical surface finish for area array… Expand
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