Electroless nickel immersion gold

Known as: ENIG 
Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards. It consists of an electroless nickel plating… (More)
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4 relations
Ball grid arrayHot air solder levelingIAgPrinted circuit board

Papers overview

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2012
2012
Development of novel electroless nickel for Selective electroless nickel immersion gold applications
There are a number of final finishing technologies available in the market, each with different cost and performance attributes… (More)
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2011
2011
Electroless nickel/Immersion gold process on Aluminum alloy electrodes
Electronic equipment has changed to have higher performance with minimized in size. This trend required to electronic devices… (More)
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2010
2010
Development of novel immersion gold for electroless nickel immersion gold process (ENIG) in PCB applications
Electroless nickel and immersion gold (ENIG) is one of the most common final finishes used in PCBs. ENIG surfaces exhibit… (More)
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2009
2009
Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders
0026-2714/$ see front matter 2009 Elsevier Ltd. A doi:10.1016/j.microrel.2008.12.016 * Corresponding author. Tel.: +86 10… (More)
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2007
2007
The Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) Deposition
This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless… (More)
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2006
2006
Optimization of gold wire bonding on electroless nickel immersion gold for high temperature applications
Conventional gold (Au) wire bonding on aluminum (Al) bond pads leads to the formation of intermetallic compounds. During high… (More)
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2006
2006
Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating
Publications on the so called black pad defect, seen in electroless nickel/immersion gold (ENIG) surface finishes, often cite… (More)
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2006
2006
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump… (More)
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2004
2004
The effects of zincation process on aluminum bond pad surfaces for electroless nickel immersion gold (ENIG) deposition
This paper reports the number of experiments that were designed to study the effects of aluminum bond pad surfaces prior to… (More)
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2004
2004
Discoloration related failure mechanism and its root cause in electroless nickel immersion gold (ENIG) pad metallurgical surface finish
Electroless nickel and immersion gold (ENIG) plating is one of the common pad metallurgical surface finish for area array… (More)
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