Contact pad

Contact pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include… (More)
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Topic mentions per year

Topic mentions per year

1975-2016
024619752016

Papers overview

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2013
2013
3D IC integration offers a new paradigm of system assembly, which enables further miniaturization and new architectures driven… (More)
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2013
2013
We have systematically analyzed the components of source/drain (S/D) resistance (RSD) in InGaAs n-MOSFETs with Ni-InGaAs metal S… (More)
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2012
2012
We report an ultrashallow metallic source/drain (S/D) contact scheme for fully self-aligned III-V NMOS with specific contact… (More)
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2012
2012
Testing of Through Silicon Via (TSV) and Micro-Bump (MB) devices by physical connection through the TSVs presents unique… (More)
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2008
2008
A method for decreasing the parasitic source and drain contact resistances in decanano-scaled CMOS devices is presented in this… (More)
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2006
2006
The construction of man-made artifacts such as cell phones and computers relies on robotic assembly lines that place, package… (More)
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2005
2005
In this paper an on-chip pad structure with minimized losses and matched impedance is presented. The pads use a metal ground… (More)
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2004
2004
We have successfully designed, fabricated, and tested contact recording sliders where most of the suspension load is supported by… (More)
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2000
2000
We numerically investigated the tracking ability and the dynamic friction force of a 2-DOF model of a tripad slider over a random… (More)
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1997
1997
We have developed a contact pad structure made by using a Ge-added anisotropic selective epitaxial Si growth technique and Si/sub… (More)
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