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Contact pad
Known as:
Pad
Contact pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include…
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Related topics
Related topics
14 relations
Die (integrated circuit)
Flip chip
Footprint (electronics)
Integrated circuit
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Broader (1)
Electronic engineering
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
A novel approach for creating modular reconfigurable robots with distributed power system
A. Romanov
,
Ivan S. Mikheenko
IEEE Conference of Russian Young Researchers in…
2018
Corpus ID: 3902882
The paper considers the problem of creating power supply and data exchange subsystems for modules of a reconfigurable robot…
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2015
2015
Design and Evaluation of an Underactuated Robotic Gripper for Manipulation Associated with Disaster Response
M. Rouleau
2015
Corpus ID: 61182361
The following study focuses on the design and validation of an underactuated robotic gripper built for the Tactical Hazardous…
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2014
2014
NiB Capping of Cu landing pads for thermocompression bonding
L. England
,
D. Dictus
,
J. D. Vos
,
T. Conard
,
R. Daily
,
E. Marinissen
2014
Corpus ID: 137883440
Review
2012
Review
2012
Advances on paper-based analytical devices (µPADs) - literature review
P. Lisowski
,
P. Zarzycki
2012
Corpus ID: 42434923
Microfluidic paper-based analytical devices (µPADs) are relatively new group of analytical tools. Work principles of such devices…
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2009
2009
Pb-Free Reflow, PCB Degradation, and the Influence of Moisture Absorption
Keri O'Toole
,
Bob Esser
,
Seth A Binfield
,
C. Hillman
,
College Park
,
J. Beers
2009
Corpus ID: 52214427
Introduction The cracking and delamination of printed circuit boards (PCB) during exposure to elevated thermal exposure, such as…
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2008
2008
CONCENTRATION OF CD8+ LYMPHOCYTES ON EWOD PLATFORM FOR MONITORING ORGAN TRANSPLANT REJECTION
G. J. Shah
,
J. Veale
,
Y. Korin
,
E. Reed
,
H. Gritsch
,
Chang-Jin Kim
2008
Corpus ID: 54849147
As important developments in the effort to create a low-power portable lab-on-a-chip system, we demonstrate the concentration of…
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2008
2008
An Experimental Technique for the Study of the Mechanical Behavior of Thin Film Materials at Micro- and Nano-Scale
A. Tajik
2008
Corpus ID: 138093610
...................................................................................................................... iii…
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2007
2007
A NOVEL METHODOLOGY FOR REDUCING THE POWER SUPPLY VOLTAGE DROP AT THE CORE OF IC’S CHIPS
S. Abdel-Hafeez
2007
Corpus ID: 2073904
This paper proposed an efficient reduction method of voltage drop (IR) at the core of high density IC’s chips. The presented…
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2003
2003
Brake pads and caliper disc brake
オンガレッティ，エンリコ，バティスタ
,
サラ，パオロ
,
スコーン，ミカエル
,
ティローニ，ジョバンニ，マリオ
2003
Corpus ID: 141379553
A not vibrate, not only does not generate noise, and to provide a brake pad and a caliper for a long disc brake life. In A…
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2001
2001
Chemical and mechanical analysis on CMP polyurethane pads
Hui Lu
2001
Corpus ID: 135941140