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Contact pad
Known as:
Pad
Contact pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include…
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Related topics
Related topics
14 relations
Die (integrated circuit)
Flip chip
Footprint (electronics)
Integrated circuit
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Broader (1)
Electronic engineering
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Scalable Row/Column Addressing of Silicon Photonic MEMS Switches
N. Quack
,
T. J. Seok
,
Sangyoon Han
,
R. Muller
,
Ming C. Wu
IEEE Photonics Technology Letters
2016
Corpus ID: 20993686
In this letter, we demonstrate a scalable addressing scheme for silicon photonic MEMS switches. For a crossbar architecture…
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2009
2009
State dependent properties of rail pads
S. Kaewunruen
,
A. Remennikov
2009
Corpus ID: 54768990
A rail pad is one of the main components in ballasted railway track systems. It is inserted between the rail and the sleeper to…
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2009
2009
EMC-aware design on a microcontroller for automotive applications
Patrice Joubert Doriol
,
Y. Villavicencio
,
C. Forzan
,
Mario Rotigni
,
Giovanni Graziosi
,
D. Pandini
Design, Automation & Test in Europe Conference…
2009
Corpus ID: 1570248
In modern digital ICs, the increasing demand for performance and throughput requires operating frequencies of hundreds of…
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2008
2008
Fabrication and testing of a novel all-diamond neural probe for chemical detection and electrical sensing applications
H. Chan
,
D.M. Aslant
,
S.H. Wang
,
G. M. Swain
,
K. Wise
IEEE 21st International Conference on Micro…
2008
Corpus ID: 16084563
Fabrication and testing of all-diamond probes for neural applications is reported for the first time. Instead of commonly used…
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2006
2006
Isolation of MEMS devices from package stresses by use of compliant metal interposers
T. Marinis
,
J. W. Soucy
,
D. S. Hanson
Electronic Components and Technology Conference
2006
Corpus ID: 44478020
Many classes of MEMS devices, such as those with resonant structures, capacitive readouts, and diaphragm elements, are sensitive…
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2005
2005
Applications of laser peening to titanium alloys
D. Sokol
,
A. Clauer
,
J. L. Dulaney
,
D. Lahrman
2005
Corpus ID: 113401731
Laser peening is a production process to produce compressive residual stresses in Titanium to increase fatigue and fretting…
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2005
2005
The contact conductance on a molecular wire
S. Stojković
,
C. Joachim
,
L. Grill
,
F. Moresco
2005
Corpus ID: 51990530
2005
2005
On the use of the Choquet integral with fuzzy numbers in Multiple Criteria Decision Aiding
P. Meyer
,
M. Roubens
EUSFLAT Conf.
2005
Corpus ID: 2430200
This paper presents a multiple criteria decision aiding approach in order to build a ranking on a set of alternatives. The…
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Highly Cited
2004
Highly Cited
2004
Carbon nanotube transistor operation at 2.6 Ghz
Shengdong Li
,
Zhen Yu
,
S. Yen
,
W. Tang
,
P. Burke
2004
Corpus ID: 62895452
We present the first demonstration of single-walled carbon nanotube transistor operation at microwave frequencies. To measure the…
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2003
2003
TLP systems with combined 50- and 500-/spl Omega/ impedance probes and Kelvin probes
E. Grund
,
R. Gauthier
IEEE transactions on electronics packaging…
2003
Corpus ID: 41769954
Transmission line pulse (TLP) systems are mainly classified by their impedance, such as a 50- or 500-/spl Omega/ current source…
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