Redistribution layer

A redistribution layer (RDL) is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in other locations. When an… (More)
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2016
2016
An enhanced redistribution layer architecture has been developed in which the Cu wires are directly covered with a double layer… (More)
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2012
2012
This paper presents a 77-GHz band high-power CMOS amplifier module. In an effort to integrate MMIC with low-loss passive circuits… (More)
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2012
2012
Due to the advantage of flip-chip design in power distribution but controversial peripheral IO placement in lower design cost… (More)
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2012
2012
A new copper metallization process is proposed that fabricates a redistribution layer on GaAs MMICs (monolithic microwave… (More)
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2011
2011
RDL process becomes more and more important with through Si interposer (TSI) application in 3D packaging. RDL line/space needs to… (More)
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2010
2010
In this paper, an embedded wafer level package with Cu through mold via (TMV) interconnects was developed for package on package… (More)
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2009
2009
The use of redistribution layers to connect I/O circuit to the I/O pad is introduced and the electrical performance of a… (More)
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2009
2009
We investigate experimentally the relevance of Warr’s neutrality theorem (1983). In our test treatments we implement an… (More)
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2005
2005
A novel via-first, back-end-of-the-line (BEOL) compatible, monolithic wafer-level three-dimensional (3D) integration technology… (More)
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1997
1997
Electrical characterization of flip-chip redistribution layer and detailed study of the associated ohmic drop, simultaneous… (More)
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