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Redistribution layer
A redistribution layer (RDL) is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in other locations. When an…
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Related topics
Related topics
6 relations
Input/output
Integrated circuit
List of integrated circuit packaging types
Three-dimensional integrated circuit
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Broader (1)
Semiconductor device fabrication
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
An Integration of On-Chip High-Q Inductors by Cu Redistribution Layer ( RDL ) with Bumping for InGaP / GaAs HBT MMIC
Jung-Hao Hsu
,
S. Tsai
,
+8 authors
Tao Yuan Shien
2015
Corpus ID: 168164644
InGaP/GaAs HBTs have been widely used in power amplifier (PA) design for wireless communications because of their high linearity…
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2015
2015
Redistribution layer manufacturing method and MEMS (Micro-Electro-Mechanical Systems) device manufacturing method
张振兴
2015
Corpus ID: 141073795
The invention provides a redistribution layer manufacturing method and an MEMS (Micro-Electro-Mechanical Systems) device…
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2014
2014
Laminated redistribution layer on the die
クリスティーン・サン−アン・ハウ−リッジ
,
ヨウ−ウェン・ヤウ
,
+5 authors
ダミオン・ブライアン・ガステルム
2014
Corpus ID: 139213125
Several implementations, the substrate and, with some metal layers and dielectric layers to be bonded to the substrate, a pad…
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2014
2014
Multi-level redistribution layer for the integration of multiple chips
E. Goetz
,
B. Memmler
,
W. Molzer
,
R. Mahnkopf
2014
Corpus ID: 146022406
Ein Paket mit mehreren Chips und einer gemeinsamen Umverdrahtungsschicht wird beschrieben. In einem Beispiel werden ein erster…
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2013
2013
Method for making a redistributed electronic device using a transferrable redistribution layer
리드 토마스
,
헌든 데이비드
,
던피 수잔
2013
Corpus ID: 132784265
재배치층을 갖는 전자 디바이스를 제조하는 방법은 접촉 영역(13)의 제 1 패턴을 갖는 전자 디바이스(11, 12)를 제공하는 단계, 및 임시 기판(20) 상에 재배치층(29)을 형성하는 단계를 포함한다. 재배치층(29…
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2011
2011
Height of vertical plates with inclined capillary grooves for a redistribution packing layer of packed columns
D. Dzhonova-Atanasova
,
D. Kolev
,
N. Kolev
2011
Corpus ID: 54545434
The uniform distribution of the liquid phase over the cross-section of a packed column is a major prerequisite for its effective…
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2010
2010
Redistribution layer for improving the reliability of the wafer-level package enhancements
S·凯萨尔·拉希姆
,
阿尔卡迪·萨莫伊洛夫
,
维伦·卡恩德卡尔
2010
Corpus ID: 116436075
The present invention provides an enhanced redistribution layers, redistribution layer (RDL) ball grid array pad geometry by…
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2008
2008
Semiconductor Package apparatus having redistribution layer
김형섭
,
박상욱
,
손민영
2008
Corpus ID: 116516438
The invention The present invention relates to a semiconductor packaging device having the redistribution layer, the at least one…
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2005
2005
Optimal chip-package codesign for high-performance DSP
P. Mehrotra
,
Vikram Rao
,
Thomas M. Conte
,
Paul D. Franzon
IEEE Transactions on Advanced Packaging
2005
Corpus ID: 9783688
In high-performance DSP systems, the memory bandwidth can be improved using high-density interconnect technology and appropriate…
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2003
2003
High Frequency, High Density Interconnect Using AC Coupling
P. Franzon
,
A. Kingon
,
+8 authors
R. Labennett
2003
Corpus ID: 110459792
AC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O…
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