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List of integrated circuit packaging types

Known as: IC package, Chip package, PAC 
Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier… 
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Papers overview

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Highly Cited
2016
Highly Cited
2016
Recently, Fan-out Wafer Level Packaging (FOWLP) has been emerged as a promising technology to meet the ever increasing demands of… 
Highly Cited
2013
Highly Cited
2013
Epilepsy is one of the most common neurological disorders. Around 1% of the world's population is affected, and nearly 25% of the… 
Highly Cited
2010
Highly Cited
2010
In this paper, a new modeling method for estimating the impedance properties in a chip-package hierarchical power distribution… 
2008
2008
We observe the impact of ontology refactoring, based on detection of name patterns in the ontology structure, on the results of… 
Highly Cited
2007
Highly Cited
2007
The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… 
Highly Cited
2005
Highly Cited
2005
Flexible electronics are increasingly being used in a number of applications which benefit from their low profile, light weight… 
Highly Cited
2004
Highly Cited
1997
Highly Cited
1997
The effect of Cu-Sn intermetallic compounds (IMC) on the fatigue failure of solder joints has been studied by means of shear… 
1991
1991
  • C. Svensson, J. Yuan
  • ., IEEE International Sympoisum on Circuits and…
  • 1991
  • Corpus ID: 58118883
Communication circuits between chips through transmission lines are demonstrated. In standard packages, a single-output 75- Omega… 
Highly Cited
1971
Highly Cited
1971
Abstract : The fabrication of a silicon carbide (SiC) junction field effect transistor (J-FET) was shown practicable. Several…