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List of integrated circuit packaging types

Known as: IC package, Chip package, PAC 
Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier… Expand
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Papers overview

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Highly Cited
2016
Highly Cited
2016
Recently, Fan-out Wafer Level Packaging (FOWLP) has been emerged as a promising technology to meet the ever increasing demands of… Expand
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Highly Cited
2013
Highly Cited
2013
Epilepsy is one of the most common neurological disorders. Around 1% of the world's population is affected, and nearly 25% of the… Expand
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Highly Cited
2010
Highly Cited
2010
In this paper, a new modeling method for estimating the impedance properties in a chip-package hierarchical power distribution… Expand
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2008
2008
We observe the impact of ontology refactoring, based on detection of name patterns in the ontology structure, on the results of… Expand
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Highly Cited
2007
Highly Cited
2007
The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… Expand
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Highly Cited
2005
Highly Cited
2005
Flexible electronics are increasingly being used in a number of applications which benefit from their low profile, light weight… Expand
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Highly Cited
2004
Highly Cited
2004
The thermal characteristics of thermally conductive underfill in flip chip package was studied. To enhance the thermal… Expand
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Highly Cited
1997
Highly Cited
1997
The effect of Cu-Sn intermetallic compounds (IMC) on the fatigue failure of solder joints has been studied by means of shear… Expand
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1989
1989
  • M. Mahalingam
  • Fifth Annual IEEE Semiconductor Thermal and…
  • 1989
  • Corpus ID: 2361710
Thermal characteristics of surface mount (SM) plastic packages such as small-outline integrated circuit (SOIC) packages, plastic… Expand
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Highly Cited
1971
Highly Cited
1971
Abstract : The fabrication of a silicon carbide (SiC) junction field effect transistor (J-FET) was shown practicable. Several… Expand