List of integrated circuit packaging types
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Recently, Fan-out Wafer Level Packaging (FOWLP) has been emerged as a promising technology to meet the ever increasing demands of… Expand Epilepsy is one of the most common neurological disorders. Around 1% of the world's population is affected, and nearly 25% of the… Expand In this paper, a new modeling method for estimating the impedance properties in a chip-package hierarchical power distribution… Expand We observe the impact of ontology refactoring, based on detection of name patterns in the ontology structure, on the results of… Expand The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… Expand Flexible electronics are increasingly being used in a number of applications which benefit from their low profile, light weight… Expand The thermal characteristics of thermally conductive underfill in flip chip package was studied. To enhance the thermal… Expand The effect of Cu-Sn intermetallic compounds (IMC) on the fatigue failure of solder joints has been studied by means of shear… Expand Thermal characteristics of surface mount (SM) plastic packages such as small-outline integrated circuit (SOIC) packages, plastic… Expand Abstract : The fabrication of a silicon carbide (SiC) junction field effect transistor (J-FET) was shown practicable. Several… Expand