List of integrated circuit packaging types

Known as: IC package, Chip package, PAC 
Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier… (More)
Wikipedia

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
This paper presents a methodology for scalable modeling of IC packages by lumped element equivalent circuits. The response… (More)
Is this relevant?
2012
2012
The increasingly complex packaging used in modern workstations and servers transmits a complicated set of mechanical loads to the… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 6
  • figure 4
Is this relevant?
2011
2011
Most DRAM interfaces such as GDDR5 and DDR3 use parallel single-ended signaling due to pin-count restriction and backward… (More)
Is this relevant?
2010
2010
In this paper, a new modeling method for estimating the impedance properties in a chip-package hierarchical power distribution… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2008
2008
Since the shortened wiring length between devices and chips in stacked IC package can reduce the signal delayed effects and… (More)
  • figure 2
  • table 1
  • table 2
  • figure 1
  • figure 5
Is this relevant?
Highly Cited
2007
Highly Cited
2007
The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… (More)
  • figure 2
  • figure 1
  • table 1
  • figure 3
  • figure 4
Is this relevant?
2007
2007
The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… (More)
  • figure 1
  • figure 2
  • table I
  • figure 4
  • figure 7
Is this relevant?
Highly Cited
2005
Highly Cited
2005
Flexible electronics are increasingly being used in a number of applications which benefit from their low profile, light weight… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2004
2004
The thermal characteristics of thermally conductive underfill in flip chip package was studied. To enhance the thermal… (More)
  • table 1
  • figure 5
  • figure 8
  • figure 10
  • figure 12
Is this relevant?
2001
2001
Solder reliability has been an issue with many fine-pitch, areaarray packages because of the large thermal expansion (CTE… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 6
  • figure 13
Is this relevant?