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Plasma ashing
Known as:
Ash (disambiguation)
In semiconductor manufacturing plasma ashing is the process of removing the photoresist (light sensitive coating) from an etched wafer. Using a…
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Related topics
Related topics
5 relations
Dry etching
Etching (microfabrication)
Plasma cleaning
Semiconductor
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
High-order Proximity Preserving Information Network Hashing
Defu Lian
,
Kai Zheng
,
+4 authors
Xing Xie
Knowledge Discovery and Data Mining
2018
Corpus ID: 50776806
Information network embedding is an effective way for efficient graph analytics. However, it still faces with computational…
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2018
2018
Cross-modal hashing based on category structure preserving
Fei Dong
,
Xiushan Nie
,
Xingbo Liu
,
Leilei Geng
,
Qian Wang
Journal of Visual Communication and Image…
2018
Corpus ID: 54479260
2015
2015
Investigations into the air heater ash deposit formation in large scale pulverised coal fired boiler
H. Vuthaluru
,
D. French
2015
Corpus ID: 1092585
2014
2014
Effects of plasma and vacuum-ultraviolet exposure on the mechanical properties of low-k porous organosilicate glass
X. Guo
,
J. Jakes
,
S. Banna
,
Y. Nishi
,
J. Shohet
2014
Corpus ID: 18331714
The effects of plasma exposure and vacuum-ultraviolet (VUV) irradiation on the mechanical properties of low-k porous…
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2014
2014
Organic matter removal for the analysis of carbon and oxygen isotope compositions of siderite
Oanez Lebeau
,
V. Busigny
,
C. Chaduteau
,
M. Ader
2014
Corpus ID: 95222452
2010
2010
Minimization of plasma ashing damage to OSG low-k dielectrics
H. Shi
,
H. Huang
,
+5 authors
D. Kyser
IEEE International Interconnect Technology…
2010
Corpus ID: 33210212
This paper investigated the plasma ashing damage to patterned porous low k structures with the objective to minimize the plasma…
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2006
2006
Heat, moisture and chemical resistance on low dielectric constant (low-k) film using Diethoxymethylsilane (DEMS) prepared by plasma enhanced chemical vapor deposition
Yi-Lung Cheng
,
Ying-Lang Wang
,
J. Lan
,
Gwo-Jen Hwang
,
M. O'Neil
,
Chia-Fu Chen
2006
Corpus ID: 56383442
2005
2005
Effects of Oxygen Plasma Ashing on Barrier Dielectric SiCN Film
C. W. Chen
,
T. Chang
,
Po-Tsun Liu
,
T. Tsai
,
T. Tseng
2005
Corpus ID: 98840002
Effects of oxygen plasma ashing on barrier dielectric SiCN films have been studied for various ashing conditions. According to X…
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2004
2004
Condensation of silanol groups in porous methylsilsesquioxane films using Supercritical CO/sub 2/ and alcohol cosolvents
Bo Xie
,
A. Muscat
IEEE transactions on semiconductor manufacturing
2004
Corpus ID: 13305033
Fourier transform infrared (FTIR) spectroscopy, goniometry, and electrical measurements were used to investigate the effect of…
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1995
1995
Large area radio frequency plasma for microelectronics processing
Z. Yu
,
D. Shaw
,
P. Gonzales
,
G. Collins
1995
Corpus ID: 46074190
Radio‐frequency (rf) inductively coupled planar plasma (ICP) provides a better way to generate spatially confined high density…
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