Skip to search form
Skip to main content
Skip to account menu
Semantic Scholar
Semantic Scholar's Logo
Search 230,528,817 papers from all fields of science
Search
Sign In
Create Free Account
Ball bonding
Known as:
Bond
Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a chip and the outside world as…
Expand
Wikipedia
(opens in a new tab)
Create Alert
Alert
Related topics
Related topics
5 relations
Die (integrated circuit)
System in package
Transducer
Wire bonding
Broader (1)
Semiconductor device fabrication
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2011
2011
Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes
L. England
,
S. Eng
,
C. Liew
,
Hock Heng Lim
Microelectronics and reliability
2011
Corpus ID: 26434763
2010
2010
The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor
H. Gaul
,
Aashish Shah
,
M. Mayer
,
Y. Zhou
,
M. Schneider-Ramelow
,
H. Reichl
2010
Corpus ID: 55435729
2010
2010
Advanced finite element model on Copper wire ball bonding
H. Hsu
,
Hong-Shen Chang
,
S. Tsao
,
S. Fu
International Electronics Manufacturing…
2010
Corpus ID: 30347305
The mechanism of wirebonding bondability for ultra thin Copper wire is described in this research. Two major analyses are…
Expand
2010
2010
Ultrasonic friction power during thermosonic Au and Cu ball bonding
A. Shah
,
M. Mayer
,
I. Qin
,
C. Huynh
,
Y. Zhou
,
M. Meyer
2010
Corpus ID: 56167416
The ultrasonic friction power during thermosonic ball bonding with Au and Cu wires, both 25 µm in diameter, is derived with an…
Expand
2010
2010
Thermosonic ball bonding : a study of bonding mechanism and interfacial evolution
Hui Xu
2010
Corpus ID: 136922736
Thermosonic ball bonding is a key technology in electrical interconnections between an integrated circuit and an external…
Expand
2009
2009
Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding
B. Chylak
,
Jamin Ling
,
H. Clauberg
,
T. Thieme
2009
Corpus ID: 15598101
Copper wire bonding has huge cost advantages over gold wire bonding. As a result, low pin count, heavy wire applications have…
Expand
2009
2009
Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding
A. Shah
,
M. Mayer
,
Y. Zhou
,
J. Persic
,
J. Moon
Electronic Packaging Technology Conference
2009
Corpus ID: 22570187
Ball bonding processes are optimized on Al pads with a 25.4 µm diameter Cu wire to obtain maximum average shear strengths of at…
Expand
Highly Cited
2007
Highly Cited
2007
Reliability of Cu Wire Bonding to Al Metallization
Luke England
,
Tom Jiang
Proceedings 57th Electronic Components and…
2007
Corpus ID: 25653584
The use of Cu wire for thermosonic ball bonding presents several advantages over Au wire. These advantages include significant…
Expand
2006
2006
Roughness Enhanced Au Ball Bonding of Cu Substrates
N. Noolu
,
I. Lum
,
Y. Zhou
IEEE transactions on components and packaging…
2006
Corpus ID: 29569101
Process development studies of Au ball bumping on metallographically polished Cu substrates at ambient temperature were conducted…
Expand
2005
2005
High temperature storage (HTS) performance of copper ball bonding wires
Saraswati
,
E. Theint
,
+5 authors
C. Breach
Electronic Packaging Technology Conference
2005
Corpus ID: 9887804
Even in a fully annealed state, copper is a naturally harder material than gold. The hardness of copper, and its greater tendency…
Expand
By clicking accept or continuing to use the site, you agree to the terms outlined in our
Privacy Policy
(opens in a new tab)
,
Terms of Service
(opens in a new tab)
, and
Dataset License
(opens in a new tab)
ACCEPT & CONTINUE