Ball bonding

Known as: Bond 
Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a chip and the outside world as… (More)
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Papers overview

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2010
2010
The ultrasonic friction power during thermosonic ball bonding with Au and Cu wires, both 25 μm in diameter, is derived with an… (More)
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2010
2010
The mechanism of wirebonding bondability for ultra thin Copper wire is described in this research. Two major analyses are… (More)
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2009
2009
Thermosonic ball bonding processes on test chips with Al metallized bonding pads are optimized with one Au and two Cu wire types… (More)
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2008
2008
Ball bonding processes on test chips with Al metallized bonding pads are optimized with one Au and two Cu wire types, all 25 mum… (More)
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2008
2008
Copper ball bonding has gained more and more popularity compared to gold ball bonding due to its better electrical conductivity… (More)
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2005
2005
Even in a fully annealed state, copper is a naturally harder material than gold. The hardness of copper, and its greater tendency… (More)
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2005
2005
The bonding procedure of copper wire ball bonding on an aluminum-metallized silicon substrate was investigated in this paper. The… (More)
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Highly Cited
2003
Highly Cited
2003
Copper wire bonding is an alternative interconnection technology that serves as a viable, and cost saving alternative to gold… (More)
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2000
2000
A novel ball bond process optimization method based on a thermal signal from an integrated aluminum microsensor is reported. The… (More)
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1999
1999
A model of friction during thermosonic ball bonding is reported. It is based on recent ultrasonic stress measurements during ball… (More)
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