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Ball bonding

Known as: Bond 
Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a chip and the outside world as… 
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Related topics

Related topics

5 relations
Die (integrated circuit)System in packageTransducerWire bonding

Broader (1)

Semiconductor device fabrication

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2011
2011
Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes
2010
2010
The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor
2010
2010
Reliability of palladium coated copper wire
Alternative solutions for Au wire are high in demand as a result of increasing gold price and high demand for lower cost packages… 
2010
2010
Advanced finite element model on Copper wire ball bonding
The mechanism of wirebonding bondability for ultra thin Copper wire is described in this research. Two major analyses are… 
2009
2009
Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding
Effects of the electrical flame off (EFO) parameters on the hardness and work hardening properties of Cu free air balls (FABs… 
2006
2006
Roughness Enhanced Au Ball Bonding of Cu Substrates
Process development studies of Au ball bumping on metallographically polished Cu substrates at ambient temperature were conducted… 
2005
2005
Study of copper free air ball in thermosonic copper ball bonding
In order to meet the new requirements of higher performance and reliabilities for electronic devices, the copper wire ball… 
2005
2005
Evaluation of Bondability and Reliability of Single Crystal Copper Wire Bonding
Copper-based interconnect is an emerging trend in microelectronics packaging. Some studies have shown that copper wires may serve… 
2004
2004
Modelling of free air ball for copper wire bonding
Copper wire ball bonding has gained considerable attention due to its economic advantage, strong resistance to sweeping and… 
2003
2003
Wirebonding at higher ultrasonic frequencies: reliability and process implications
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