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System in package
Known as:
System-in-a-package
, System-in-package
, System in Packacge
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A system in package (SiP) or system-in-a-package is a number of integrated circuits enclosed in a single module (package). The SiP performs all or…
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Related topics
Related topics
28 relations
Apple mobile application processors
Ball bonding
Central processing unit
Chip carrier
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
Characterization of Low Temperature Sintered Ferrite Laminates for High Frequency Point-of-Load (POL) Converters
Wenli Zhang
,
Mingkai Mu
,
Dongbin Hou
,
Yipeng Su
,
Qiang Li
,
F. Lee
IEEE transactions on magnetics
2013
Corpus ID: 10045205
Low profile magnetic components and associated integration techniques are desired for design and fabrication of highly integrated…
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2012
2012
Information Analysis Infrastructure for Diagnosis
V. Hahanov
,
W. Gharibi
,
E. Litvinova
,
S. Chumachenko
arXiv.org
2012
Corpus ID: 13140372
A high-speed multiprocessor architecture for brain-like analyzing information represented in analytic, graph- and table forms of…
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2012
2012
A SIP-SHIM6-based solution providing interdomain service continuity in IMS-based networks
Amel Achour
,
K. Haddadou
,
B. Kervella
,
G. Pujolle
IEEE Communications Magazine
2012
Corpus ID: 5754915
Nowadays, wireless networks are largely deployed, and the number of smart phones has boomed, as well as data transfer via mobile…
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2010
2010
SIP-Based QoS Management Framework for IMS Multimedia Services
Umber Iqbal
,
Y. Javed
,
S. Rehman
,
Asia Khanum
2010
Corpus ID: 212595474
IP Multimedia subsystems are true integration of multimedia services over converged networks to increase the productivity and…
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2009
2009
Capacitive-Sensor Interface With High Accuracy and Stability
R. Nojdelov
,
S. Nihtianov
IEEE Transactions on Instrumentation and…
2009
Corpus ID: 23175719
This paper presents a capacitive-sensor interface with high accuracy and excellent stability. The range of the measured…
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2008
2008
Multilayer Organic Multichip Module Implementing Hybrid Microelectromechanical Systems
Morgan J. Chen
,
A. Pham
,
+4 authors
John Maciel
IEEE transactions on microwave theory and…
2008
Corpus ID: 6685798
We present the design and development of an organic package that is compatible with fully released RF microelectromechanical…
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2008
2008
Wireless Dosimeter: System-on-Chip Versus System-in-Package for Biomedical and Space Applications
A. Shamim
,
M. Arsalan
,
L. Roy
,
M. Shams
,
N. G. Tarr
IEEE Transactions on Circuits and Systems - II…
2008
Corpus ID: 206653528
A new floating-gate (FG) MOSFET based wireless dosimeter system-in-package (SiP) is presented. This miniature and completely…
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2007
2007
A SIP-Based Seamless-Handoff (S-SIP) Scheme for Heterogeneous Mobile Networks
Jie Zhang
,
Henry C. B. Chan
,
Victor C. M. Leung
IEEE Wireless Communications and Networking…
2007
Corpus ID: 1367164
One of the prominent goals of next-generation mobile communication systems is to support seamless roaming of users across…
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Highly Cited
2006
Highly Cited
2006
Electrostatic Energy Harvester and Li-Ion Charger Circuit for Micro-Scale Applications
Erick O. Torres
,
G. Rincón-Mora
49th IEEE International Midwest Symposium on…
2006
Corpus ID: 8606316
Modern portable micro-systems like biomedical implants and ad-hoc wireless transceiver micro-sensors continue to integrate more…
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2005
2005
QUBiC4plus: a cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RF-system-in-package environment
P. Deixler
,
T. Letavic
,
+19 authors
J. Slotboom
Proceedings of the Bipolar/BiCMOS Circuits and…
2005
Corpus ID: 22075927
QUBiC4plus is a RF-BiCMOS production technology tailored for 'silicon-based' RF-SiP. The device menu includes 3 varactor styles…
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