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System in package

Known as: System-in-a-package, System-in-package, System in Packacge 
A system in package (SiP) or system-in-a-package is a number of integrated circuits enclosed in a single module (package). The SiP performs all or… 
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Related topics

Related topics

28 relations
Apple mobile application processorsBall bondingCentral processing unitChip carrier

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Information Analysis Infrastructure for Diagnosis
A high-speed multiprocessor architecture for brain-like analyzing information represented in analytic, graph- and table forms of… 
2012
2012
Design Flow for High Switching Frequency and Large-Bandwidth Analog DC/DC Step-Down Converters for a Polar Transmitter
System-on-chip requirements for energy management push both technology and design of voltage regulators to their limits… 
2010
2010
SIP-Based QoS Management Framework for IMS Multimedia Services
IP Multimedia subsystems are true integration of multimedia services over converged networks to increase the productivity and… 
2009
2009
Capacitive-Sensor Interface With High Accuracy and Stability
This paper presents a capacitive-sensor interface with high accuracy and excellent stability. The range of the measured… 
2008
2008
Multilayer Organic Multichip Module Implementing Hybrid Microelectromechanical Systems
We present the design and development of an organic package that is compatible with fully released RF microelectromechanical… 
Highly Cited
2008
Highly Cited
2008
Development of 3D silicon module with TSV for system in packaging
Portable electronic products demand multifunctional module comprising digital, RF and memory functions. Through-silicon via… 
2007
2007
A SIP-Based Seamless-Handoff (S-SIP) Scheme for Heterogeneous Mobile Networks
One of the prominent goals of next-generation mobile communication systems is to support seamless roaming of users across… 
Highly Cited
2006
Highly Cited
2006
Electrostatic Energy Harvester and Li-Ion Charger Circuit for Micro-Scale Applications
Modern portable micro-systems like biomedical implants and ad-hoc wireless transceiver micro-sensors continue to integrate more… 
2006
2006
A Novel Methodology for Defining the Boundaries of Geometrical Discontinuities in Electronic Packages
For efficient RF/microwave modeling, measurement and design of signal paths in electronic packages (e.g., from chip to chip or… 
2003
2003
The system-in-package approach
With consumers demanding smaller devices but increased functionality and operators clamouring for higher bandwidth, the pressure… 
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