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System in package
Known as:
System-in-a-package
, System-in-package
, System in Packacge
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A system in package (SiP) or system-in-a-package is a number of integrated circuits enclosed in a single module (package). The SiP performs all or…
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28 relations
Apple mobile application processors
Ball bonding
Central processing unit
Chip carrier
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Biosignal acquisition system for prosthesis control and rehabilitation monitoring
V. Klinger
2015
Corpus ID: 58559807
Simulation, modelling and verification are powerful methods in computer aided therapy, rehabilitation monitoring, identification…
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2012
2012
Information Analysis Infrastructure for Diagnosis
V. Hahanov
,
W. Gharibi
,
E. Litvinova
,
S. Chumachenko
arXiv.org
2012
Corpus ID: 13140372
A high-speed multiprocessor architecture for brain-like analyzing information represented in analytic, graph- and table forms of…
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2012
2012
A SIP-SHIM6-based solution providing interdomain service continuity in IMS-based networks
Amel Achour
,
K. Haddadou
,
B. Kervella
,
G. Pujolle
IEEE Communications Magazine
2012
Corpus ID: 5754915
Nowadays, wireless networks are largely deployed, and the number of smart phones has boomed, as well as data transfer via mobile…
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2011
2011
Smart and Intelligent Optoelectronic Sensor Systems: OEM Design Approach
S. Yurish
2011
Corpus ID: 56088587
Light-to-frequency converters are widely used in various optoelectronic sensor systems. However, a further frequency-to-digital…
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2010
2010
SIP-Based QoS Management Framework for IMS Multimedia Services
Umber Iqbal
,
Younas Javed
,
S. Rehman
,
Asia Khanum
2010
Corpus ID: 212595474
IP Multimedia subsystems are true integration of multimedia services over converged networks to increase the productivity and…
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2009
2009
WORKING CONCEPT OF A TOUCH SENSOR ON THE ARRAYS
R. Dahiya
,
M. Valle
,
G. Metta
,
L. Lorenzelli
2009
Corpus ID: 21715036
This work presents the development of tactile sensing arrays, inspired by cutaneous sensing in humans, for the fingertips of a…
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Review
2008
Review
2008
Energy-Harvesting System-in-Package Microsystem 1
Erick O. Torres
,
G. Rincón-Mora
2008
Corpus ID: 17549623
As microscale devices, such as wireless microsensors and noninvasive biomedical implants, continue to shrink and incorporate more…
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2008
2008
Multilayer Organic Multichip Module Implementing Hybrid Microelectromechanical Systems
Morgan J. Chen
,
A. Pham
,
+4 authors
John J. Maciel
IEEE transactions on microwave theory and…
2008
Corpus ID: 6685798
We present the design and development of an organic package that is compatible with fully released RF microelectromechanical…
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2007
2007
A Multi-agent Context-aware Service Platform in a Smart Space
W. Jih
,
Jane Yung-jen Hsu
,
Tsu-Chang Lee
,
Li-lu Chen
2007
Corpus ID: 17467816
Ubiquitous computing technology plays a key role for providing context information and makes context-aware services can be…
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2007
2007
DRY FILM PACKAGE FOR SYSTEM IN PACKAGE MOLDING PROCESS
S. Jager
,
C. D. Nooijer
,
M. V. Kleef
2007
Corpus ID: 110332380
The stability of packages to protect a MEMS device against molding conditions is simulated and experimentally verified. A Finite…
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