Roughness Enhanced Au Ball Bonding of Cu Substrates

  title={Roughness Enhanced Au Ball Bonding of Cu Substrates},
  author={N. J. Noolu and I. Lum and Yunshun Zhou},
  journal={IEEE Transactions on Components and Packaging Technologies},
Process development studies of Au ball bumping on metallographically polished Cu substrates at ambient temperature were conducted by investigating the effect of process parameters on the ball bond shear force and the extent of bonding. These studies were performed on substrates polished with 0.06-mum or 1-mum abrasive solutions so as to assess the effect of… CONTINUE READING