Wire bonding

Known as: Bond wire, Bond, Wirebond 
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during… (More)
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Topic mentions per year

Topic mentions per year

1968-2017
010020019682017

Papers overview

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Highly Cited
2013
Highly Cited
2013
This paper presents a diagnostic and prognostic condition monitoring method for insulated-gate bipolar transistor (IGBT) power… (More)
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2013
2013
Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of… (More)
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2012
2012
In semiconductor packaging, wire bonding is the main technology for electrical connections between chip and leadframe or… (More)
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2011
2011
The interfacial microstructures of the Cu-wire bonding to an Al pad are investigated first by using an X-ray microdiffractometer… (More)
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2011
2011
Cu-wire overhang bonding process is investigated first by a high-speed camera system. It was found that the greater impact… (More)
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2010
2010
The last three years have seen an aggressive implementation of fine-pitch copper wire bonding in face of ever-increasing gold… (More)
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2009
2009
Fine pitch Cu wire bonding is at the cusp of becoming main stream. Many challenges had to be overcome when making the transition… (More)
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2008
2008
This paper describes recent developments in the finite element modeling of wire bonding interconnection, extending its capability… (More)
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2007
2007
The use of Cu wire for thermosonic ball bonding presents several advantages over Au wire. These advantages include significant… (More)
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1999
1999
We have developed a configuration for diode-based electrostatic discharge structures that can be reliably placed under the metal… (More)
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