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Wire bonding
Known as:
Bond wire
, Bond
, Wirebond
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Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during…
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Related topics
Related topics
39 relations
Alexander Coucoulas
Ball bonding
Compliant bonding
Conformal coating
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2006
2006
Simulation and analysis for typical package assembly manufacture
Y. Liu
,
S. Irving
,
D. Desbiens
,
T. Luk
International Conference on Thermal, Mechanial…
2006
Corpus ID: 12101978
The manufacturing process for package assembly is a key to assuring the reliability and quality of the semiconductor products…
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2006
2006
Theoretical and experimental analysis of an off-chip microgripper
J. Fraser
,
T. Hubbard
,
M. Kujath
Canadian journal of electrical and computer…
2006
Corpus ID: 17281067
This paper describes the design of a single-crystal-silicon off-chip electrothermal microgripper for use in micro-assembly and…
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Review
2004
Review
2004
Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology
W. Landers
,
D. Edelstein
,
+24 authors
J. Wright
Proceedings of the IEEE International…
2004
Corpus ID: 42329323
A summary of chip-to-package interaction (CPI) evaluations for a 90 nm PECVD low k technology will be discussed. This review will…
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2004
2004
Megapixel wavefront correctors
T. Bifano
,
P. Bierden
,
Hao Zhu
,
S. Cornelissen
,
Jin Hong Kim
SPIE Astronomical Telescopes + Instrumentation
2004
Corpus ID: 37575130
Optical-quality microelectromechanical deformable mirrors (DMs) and spatial light modulators (SLMs) are described. With such…
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2001
2001
Application of Al/PI composite bumps to COG bonding process
J. Jeng
,
T.-E. Hsieh
2001
Corpus ID: 55972181
This work demonstrates the probing, testability and applicability of Al/PI (aluminum/polyimide) composite bumps to the chip on…
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2000
2000
Power pin testing: making the test coverage complete
F. D. de Jong
,
Ben Kup
,
Rodger Schuttert
Proceedings International Test Conference (IEEE…
2000
Corpus ID: 6030716
Most modern ICs have multiple power and ground pins. It becomes necessary that all these pins are indeed connected to the board…
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2000
2000
Technological aspects of development of pixel and strip detectors based on CdTe and CdZnTe
V. Gostilo
,
V. Ivanov
,
+5 authors
K. Valpas
IEEE Nuclear Science Symposium Conference Record
2000
Corpus ID: 73732735
Results on development of technologies for CdZnTe and CdTe crystal processing, photolithography, contact pad manufacture and…
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1995
1995
The Ultrasonic Wedge Bonding Mechanism: Two Theories Converge
L. Levine
1995
Corpus ID: 35492255
The basis for our understanding of the ultrasonic bonding mechanism was first presented by B. Langenecker . This paper will…
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1989
1989
An integrated free space optical bus
A. Dickinson
,
Michael E. Prise
Proceedings IEEE International Conference on…
1989
Corpus ID: 54584460
As integrated circuit linewidths are reduced, single-chip system functionality and speed increase. Conventional electronic chip…
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Highly Cited
1978
Highly Cited
1978
Planar multilevel interconnection technology employing a polyimide
K. Mukai
,
A. Saiki
,
K. Yamanaka
,
S. Harada
,
S. Shoji
1978
Corpus ID: 61520698
A planar multilevel interconnection technology, called planar metallization with polymer (PMP), has been developed, which…
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