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Wire bonding

Known as: Bond wire, Bond, Wirebond 
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during… 
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Related topics

Related topics

39 relations
Alexander CoucoulasBall bondingCompliant bondingConformal coating

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2010
Highly Cited
2010
Bioinspired 3-D Tactile Sensor for Minimally Invasive Surgery
This paper reports the development of a bioinspired 3-D tactile sensor for minimally invasive surgery. Inspired by the principle… 
2009
2009
Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
PoP structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones… 
Highly Cited
2008
Highly Cited
2008
Development of 3D silicon module with TSV for system in packaging
Portable electronic products demand multifunctional module comprising digital, RF and memory functions. Through-silicon via… 
Highly Cited
2007
Highly Cited
2007
Cohesive zone modeling for structural integrity analysis of IC interconnects
Review
2007
Review
2007
Ge-on-SOI-Detector/Si-CMOS-Amplifier Receivers for High-Performance Optical-Communication Applications
In this paper, an overview and assessment of high-performance receivers based upon Ge-on-silicon-on-insulator (Ge-on-SOI… 
Highly Cited
2007
Highly Cited
2007
Reliability of Cu Wire Bonding to Al Metallization
The use of Cu wire for thermosonic ball bonding presents several advantages over Au wire. These advantages include significant… 
Highly Cited
2006
Highly Cited
2006
Evaluation of board-level reliability of electronic packages under consecutive drops
Highly Cited
2004
Highly Cited
2004
Carbon nanotube transistor operation at 2.6 Ghz
We present the first demonstration of single-walled carbon nanotube transistor operation at microwave frequencies. To measure the… 
1979
1979
Degradation mechanism of Nb 3 Sn composite wires under tensile strain at 4.2K
Bronze-processed Nb 3 Sn composite wire conductors exhibit changes in their superconducting parameters when strained in tension… 
Highly Cited
1978
Highly Cited
1978
Planar multilevel interconnection technology employing a polyimide
A planar multilevel interconnection technology, called planar metallization with polymer (PMP), has been developed, which… 
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