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Wire bonding

Known as: Bond wire, Bond, Wirebond 
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during… 
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Related topics

Related topics

39 relations
Alexander CoucoulasBall bondingCompliant bondingConformal coating

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2008
Highly Cited
2008
Development of 3D silicon module with TSV for system in packaging
Portable electronic products demand multifunctional module comprising digital, RF and memory functions. Through-silicon via… 
Highly Cited
2007
Highly Cited
2007
The Redistributed Chip Package: A Breakthrough for Advanced Packaging
The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… 
Review
2007
Review
2007
Ge-on-SOI-Detector/Si-CMOS-Amplifier Receivers for High-Performance Optical-Communication Applications
In this paper, an overview and assessment of high-performance receivers based upon Ge-on-silicon-on-insulator (Ge-on-SOI… 
Highly Cited
2007
Highly Cited
2007
Cohesive zone modeling for structural integrity analysis of IC interconnects
Highly Cited
2006
Highly Cited
2006
Evaluation of board-level reliability of electronic packages under consecutive drops
Highly Cited
2004
Highly Cited
2004
Carbon nanotube transistor operation at 2.6 Ghz
We present the first demonstration of single-walled carbon nanotube transistor operation at microwave frequencies. To measure the… 
Highly Cited
2004
Highly Cited
2004
Symmetrical and decoupled nickel microgyroscope on insulating substrate
Highly Cited
2004
Highly Cited
2004
Micro-differential scanning calorimeter for combustible gas sensing
Highly Cited
2002
Highly Cited
2002
Technology trends toward a system-in-a-module in power electronics
Currently, assemblies of power semiconductor switches and their associated drive circuitry are available in modules. From a few… 
1979
1979
Degradation mechanism of Nb 3 Sn composite wires under tensile strain at 4.2K
Bronze-processed Nb 3 Sn composite wire conductors exhibit changes in their superconducting parameters when strained in tension… 
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