Skip to search formSkip to main contentSkip to account menu

Wire bonding

Known as: Bond wire, Bond, Wirebond 
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during… 
Wikipedia (opens in a new tab)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2010
Highly Cited
2010
This paper reports the development of a bioinspired 3-D tactile sensor for minimally invasive surgery. Inspired by the principle… 
2009
2009
PoP structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones… 
Highly Cited
2008
Highly Cited
2008
Portable electronic products demand multifunctional module comprising digital, RF and memory functions. Through-silicon via… 
Review
2007
Review
2007
In this paper, an overview and assessment of high-performance receivers based upon Ge-on-silicon-on-insulator (Ge-on-SOI… 
Highly Cited
2007
Highly Cited
2007
The use of Cu wire for thermosonic ball bonding presents several advantages over Au wire. These advantages include significant… 
Highly Cited
2004
Highly Cited
2004
We present the first demonstration of single-walled carbon nanotube transistor operation at microwave frequencies. To measure the… 
1979
1979
Bronze-processed Nb 3 Sn composite wire conductors exhibit changes in their superconducting parameters when strained in tension… 
Highly Cited
1978
Highly Cited
1978
A planar multilevel interconnection technology, called planar metallization with polymer (PMP), has been developed, which…