Wire bonding

Known as: Bond wire, Bond, Wirebond 
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

1968-2017
010020019682017

Related topics

Related topics

38 relations
Ball bondingCompliant bondingConformal coatingContact pad
(More)

Related mentions per year

Related mentions per year

1936-2019
19401960198020002020
Wire bonding
Die (integrated circuit)
Semiconductor
Integrated circuit
Semiconductor device fabrication
Printed circuit board

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2013
Highly Cited
2013
In Situ Diagnostics and Prognostics of Wire Bonding Faults in IGBT Modules for Electric Vehicle Drives
This paper presents a diagnostic and prognostic condition monitoring method for insulated-gate bipolar transistor (IGBT) power… (More)
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2013
2013
Copper Wire Bonding Concerns and Best Practices
Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of… (More)
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2012
2012
Silver alloy wire bonding
In semiconductor packaging, wire bonding is the main technology for electrical connections between chip and leadframe or… (More)
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2011
2011
Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding
The interfacial microstructures of the Cu-wire bonding to an Al pad are investigated first by using an X-ray microdiffractometer… (More)
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2011
2011
Dynamics Features of Cu-Wire Bonding During Overhang Bonding Process
Cu-wire overhang bonding process is investigated first by a high-speed camera system. It was found that the greater impact… (More)
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2010
2010
Wire bonding with Pd-coated copper wire
The last three years have seen an aggressive implementation of fine-pitch copper wire bonding in face of ever-increasing gold… (More)
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2009
2009
Fine pitch copper wire bonding — Why now?
Fine pitch Cu wire bonding is at the cusp of becoming main stream. Many challenges had to be overcome when making the transition… (More)
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2008
2008
Wire bonding power interconnection
This paper describes recent developments in the finite element modeling of wire bonding interconnection, extending its capability… (More)
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2007
2007
Reliability of Cu Wire Bonding to Al Metallization
The use of Cu wire for thermosonic ball bonding presents several advantages over Au wire. These advantages include significant… (More)
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1999
1999
ESD protection under wire bonding pads
We have developed a configuration for diode-based electrostatic discharge structures that can be reliably placed under the metal… (More)
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