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Wire bonding
Known as:
Bond wire
, Bond
, Wirebond
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Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during…
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Related topics
Related topics
39 relations
Alexander Coucoulas
Ball bonding
Compliant bonding
Conformal coating
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2010
Highly Cited
2010
Bioinspired 3-D Tactile Sensor for Minimally Invasive Surgery
Yating Hu
,
R. Katragadda
,
H. Tu
,
Q. Zheng
,
Yuefa Li
,
Yong Xu
Journal of microelectromechanical systems
2010
Corpus ID: 12923285
This paper reports the development of a bioinspired 3-D tactile sensor for minimally invasive surgery. Inspired by the principle…
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2009
2009
Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
Y. Orii
,
K. Toriyama
,
+6 authors
C. Feger
Electronic Components and Technology Conference
2009
Corpus ID: 13205813
PoP structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones…
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Highly Cited
2008
Highly Cited
2008
Development of 3D silicon module with TSV for system in packaging
N. Khan
,
V. S. Rao
,
+5 authors
L. Ebin
Electronic Components and Technology Conference
2008
Corpus ID: 40004399
Portable electronic products demand multifunctional module comprising digital, RF and memory functions. Through-silicon via…
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Highly Cited
2007
Highly Cited
2007
Cohesive zone modeling for structural integrity analysis of IC interconnects
B. V. Hal
,
R. Peerlings
,
M. Geers
,
O. Sluis
Microelectronics and reliability
2007
Corpus ID: 18817257
Review
2007
Review
2007
Ge-on-SOI-Detector/Si-CMOS-Amplifier Receivers for High-Performance Optical-Communication Applications
S. Koester
,
C. Schow
,
+4 authors
R. John
Journal of Lightwave Technology
2007
Corpus ID: 35731758
In this paper, an overview and assessment of high-performance receivers based upon Ge-on-silicon-on-insulator (Ge-on-SOI…
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Highly Cited
2007
Highly Cited
2007
Reliability of Cu Wire Bonding to Al Metallization
Luke England
,
Tom Jiang
Proceedings 57th Electronic Components and…
2007
Corpus ID: 25653584
The use of Cu wire for thermosonic ball bonding presents several advantages over Au wire. These advantages include significant…
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Highly Cited
2006
Highly Cited
2006
Evaluation of board-level reliability of electronic packages under consecutive drops
Chang-Lin Yeh
,
Y. Lai
,
C. Kao
Microelectronics and reliability
2006
Corpus ID: 206943669
Highly Cited
2004
Highly Cited
2004
Carbon nanotube transistor operation at 2.6 Ghz
Shengdong Li
,
Zhen Yu
,
S. Yen
,
W. Tang
,
P. Burke
2004
Corpus ID: 62895452
We present the first demonstration of single-walled carbon nanotube transistor operation at microwave frequencies. To measure the…
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1979
1979
Degradation mechanism of Nb 3 Sn composite wires under tensile strain at 4.2K
T. Luhman
,
M. Suenaga
,
D. Welch
,
K. Kaiho
1979
Corpus ID: 89606803
Bronze-processed Nb 3 Sn composite wire conductors exhibit changes in their superconducting parameters when strained in tension…
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Highly Cited
1978
Highly Cited
1978
Planar multilevel interconnection technology employing a polyimide
K. Mukai
,
A. Saiki
,
K. Yamanaka
,
S. Harada
,
S. Shoji
1978
Corpus ID: 61520698
A planar multilevel interconnection technology, called planar metallization with polymer (PMP), has been developed, which…
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