Chang-Lin Yeh

Learn More
—We present in this paper a submodeling analysis procedure capable of solving transient mechanical responses of board-level electronic packages subjected to drop impact loads, involving large deformations and nonlinear elastoplastic constitutive relationships for the solder alloy. This paper is focused on the verification of this submodeling analysis(More)
Numerical studies of transient fracturing of a package-level solder joint subjected to displacement-controlled impact loads are presented in this study. The explicit three-dimensional finite element analysis is incorporated with contact, fracturing and fragmentation mechanisms to predict transient structural responses and failure modes of the solder joint.(More)