Chang-Lin Yeh

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We propose in this paper the support excitation scheme for analyzing transient structural responses of electronic components subjected to JEDEC board-level drop test conditions. Equations of motion of the board-level test vehicle are derived based on coordinate transformations that translate the input acceleration pulse into the effective support excitation(More)
We present in this paper a submodeling analysis procedure capable of solving transient mechanical responses of boardlevel electronic packages subjected to drop impact loads, involving large deformations and nonlinear elastoplastic constitutive relationships for the solder alloy. This paper is focused on the verification of this submodeling analysis(More)