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WLP-S-10

National Institutes of Health

Papers overview

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2019
2019
Even though CMOS-based power amplifiers (PAs) provide reductions in size and cost for wireless local area network (WLAN… 
2016
2016
The measurement of formant frequencies of vowels is among the most common measurements in speech studies, but measurements are… 
2016
2016
In this paper, an efficient higher order complex frequency shifted (CFS) perfectly matched layer (PML) derived from a stretched… 
2016
2016
We present an efficient implementation of the unconditionally stable finite-difference time-domain (FDTD) algorithm based on the… 
2015
2015
A theoretical analysis of numerical dispersion in the high-order finite-difference time-domain (FDTD) method with weighted… 
2014
2014
Warpage issue of wafer level package (WLP) has caught the attention of WLP industry. This paper aims at the warpage… 
2012
2012
기존의 LED 패키지가 갖는 온도에 따른 광 특성 변화 문제를 해결하기 위하여 온도센서가 집적된 LED… 
2009
2009
The Bump on Flexible Lead (BoFL) is a chip-to-substrate interconnect technology which uses flexible structures to accommodate the… 
2007
2007
Northrop Grumman Space Technology (NGST) has developed a MMIC compatible, hermetic wafer-level packaging (WLP) technology that is… 
1973
1973
  • W. Budde
  • Applied Optics
  • 1973
  • Corpus ID: 3828782
The relative spectral sensitivity distributions of ten vacuum photodiodes with S-10 (Ag-Bi-O-Cs) photocathodes have been…