WLP-S-10
National Institutes of Health
Papers overview
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Even though CMOS-based power amplifiers (PAs) provide reductions in size and cost for wireless local area network (WLAN…
The measurement of formant frequencies of vowels is among the most common measurements in speech studies, but measurements are…
In this paper, an efficient higher order complex frequency shifted (CFS) perfectly matched layer (PML) derived from a stretched…
We present an efficient implementation of the unconditionally stable finite-difference time-domain (FDTD) algorithm based on the…
A theoretical analysis of numerical dispersion in the high-order finite-difference time-domain (FDTD) method with weighted…
Warpage issue of wafer level package (WLP) has caught the attention of WLP industry. This paper aims at the warpage…
기존의 LED 패키지가 갖는 온도에 따른 광 특성 변화 문제를 해결하기 위하여 온도센서가 집적된 LED…
The Bump on Flexible Lead (BoFL) is a chip-to-substrate interconnect technology which uses flexible structures to accommodate the…
Northrop Grumman Space Technology (NGST) has developed a MMIC compatible, hermetic wafer-level packaging (WLP) technology that is…
The relative spectral sensitivity distributions of ten vacuum photodiodes with S-10 (Ag-Bi-O-Cs) photocathodes have been…