Skip to search formSkip to main contentSkip to account menu
You are currently offline. Some features of the site may not work correctly.

WLP-S-10

National Institutes of Health

Related topics

Related topics

3 relations

Broader (2)

BenzodioxolesMethionine
analogs & derivatives

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
A Fully Integrated −32-dB EVM Broadband 802.11abgn/ac PA With an External PA Driver in WLP 40-nm CMOS
Even though CMOS-based power amplifiers (PAs) provide reductions in size and cost for wireless local area network (WLAN… 
  • figure 1
  • figure 4
  • figure 2
  • figure 3
  • figure 5
2016
2016
Comparing measurement errors for formants in synthetic and natural vowels.
The measurement of formant frequencies of vowels is among the most common measurements in speech studies, but measurements are… 
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
2016
2016
An Optimized Higher Order PML in Domain Decomposition WLP-FDTD Method for Time Reversal Analysis
In this paper, an efficient higher order complex frequency shifted (CFS) perfectly matched layer (PML) derived from a stretched… 
  • figure 1
  • figure 2
  • figure 3
  • table I
  • figure 4
2016
2016
Tridiagonalized WLP-FDTD Implementation for Wave Propagation in Magnetized Plasma
We present an efficient implementation of the unconditionally stable finite-difference time-domain (FDTD) algorithm based on the… 
  • figure 1
  • figure 2
2016
2016
An Efficient Spectral WLP-FDTD Algorithm for Periodic Structures
An efficient weighted Laguerre polynomials based spectral finite-difference time-domain scheme for 2-D periodic structures is… 
  • figure 1
  • figure 2
  • figure 3
  • figure 4
2015
2015
Analysis of Numerical Dispersion in the High-Order 2-D WLP-FDTD Method
A theoretical analysis of numerical dispersion in the high-order finite-difference time-domain (FDTD) method with weighted… 
  • table 1
  • figure 1
  • figure 2
  • table 2
  • figure 4
2012
2012
온도센서가 집적된 WLP LED의 제작과 이를 통한 광 특성 보상 시스템의 구현
기존의 LED 패키지가 갖는 온도에 따른 광 특성 변화 문제를 해결하기 위하여 온도센서가 집적된 LED… 
2009
2009
Design study of the Bump on Flexible Lead by FEA for Wafer Level packaging
The Bump on Flexible Lead (BoFL) is a chip-to-substrate interconnect technology which uses flexible structures to accommodate the… 
  • figure 1
  • figure 3
  • figure 2
  • table I
  • figure 4
2007
2007
MMIC Compatible Wafer-Level Packaging Technology
Northrop Grumman Space Technology (NGST) has developed a MMIC compatible, hermetic wafer-level packaging (WLP) technology that is… 
  • figure 1
  • figure 4
  • figure 6
  • figure 7
1973
1973
Ageing of s-10 photocathodes.
  • W. Budde
  • Applied optics
  • 1973
  • Corpus ID: 3828782
The relative spectral sensitivity distributions of ten vacuum photodiodes with S-10 (Ag-Bi-O-Cs) photocathodes have been… 
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy, Terms of Service, and Dataset License
ACCEPT & CONTINUE