Skip to search form
Skip to main content
Skip to account menu
Semantic Scholar
Semantic Scholar's Logo
Search 226,356,142 papers from all fields of science
Search
Sign In
Create Free Account
Thermal management (electronics)
Known as:
Thermal dissipation
, Thermal management of electronics
, Thermal management of electronic devices and systems
Expand
All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure…
Expand
Wikipedia
(opens in a new tab)
Create Alert
Alert
Related topics
Related topics
24 relations
Annealed pyrolytic graphite
Computational fluid dynamics
Computer cooling
Digital signal processor
Expand
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2010
2010
Piezo Fan for Thermal Management of Electronics
Kuo-Hao Tseng
,
M. Mochizuki
,
+4 authors
R. Kikutake
2010
Corpus ID: 55427807
In order to satisfy the demand for light-weight, low power consumption, and compact-sized personal computers, portable…
Expand
Highly Cited
2008
Highly Cited
2008
Multicore Processors - A Necessity
Bryan Schauer
2008
Corpus ID: 62048846
As personal computers have become more prevalent and more applications have been designed for them, the end-user has seen the…
Expand
Highly Cited
2008
Highly Cited
2008
Coil Array Structures Compared for Contactless Battery Charging Platform
J. Achterberg
,
E. Lomonova
,
J. de Boeij
IEEE transactions on magnetics
2008
Corpus ID: 33203979
We propose two new coil topologies for a contactless battery charging platform. The new topologies consist of square printed…
Expand
Highly Cited
2006
Highly Cited
2006
Simplified thermal lattice Boltzmann in incompressible limit
C. S. N. Azwadi
,
T. Tanahashi
2006
Corpus ID: 56339378
In this paper, an incompressible thermohydrodynamics for the lattice Boltzmann scheme is developed. The basic idea is to solve…
Expand
Highly Cited
2006
Highly Cited
2006
Controlling the Morphology of Carbon Nanotube Films by Varying the Areal Density of Catalyst Nanoclusters Using Block‐Copolymer Micellar Thin Films
R. Bennett
,
A. Hart
,
R. Cohen
2006
Corpus ID: 14637746
In spite of much research progress in the science and synthesis of carbon nanotubes (CNTs), control over the location and…
Expand
Highly Cited
2003
Highly Cited
2003
Thermal analysis of ultra-thin body device scaling [SOI and FinFet devices]
E. Pop
,
R. Dutton
,
K. Goodson
IEEE International Electron Devices Meeting
2003
Corpus ID: 29226046
This paper explores the effect of confined dimensions and complicated geometries on the self-heating of ultra-thin body SOI and…
Expand
Highly Cited
2001
Highly Cited
2001
Measurement and modeling of thermal resistance of high speed SiGe heterojunction bipolar transistors
J. Rieh
,
D. Greenberg
,
Basanth Jagannathan
,
G. Freeman
,
S. Subbanna
Topical Meeting on Silicon Monolithic Integrated…
2001
Corpus ID: 14644013
Thermal resistance has been measured for high speed SiGe HBTs with various emitter widths and lengths. The smaller devices…
Expand
Highly Cited
1998
Highly Cited
1998
A test pattern generation methodology for low power consumption
Fulvio Corno
,
P. Prinetto
,
M. Rebaudengo
,
M. Reorda
Proceedings of the ... IEEE VLSI Test Symposium
1998
Corpus ID: 10337214
This paper proposes an ATPG technique that reduces power dissipation during the test of sequential circuits. The proposed…
Expand
Highly Cited
1988
Highly Cited
1988
Regulation of thermal dissipation of absorbed light energy in chloroplasts indicated by energy-dependent fluorescence quenching
G. Krause
,
H. Laasch
,
E. Weis
1988
Corpus ID: 89072494
Highly Cited
1978
Highly Cited
1978
Wafer-scale integration-a fault-tolerant procedure
R. Aubusson
,
I. Catt
IEEE Journal of Solid-State Circuits
1978
Corpus ID: 36425907
Considers a new approach to full-slice technology in relation to existing procedures for achieving this goal. Under external…
Expand
By clicking accept or continuing to use the site, you agree to the terms outlined in our
Privacy Policy
(opens in a new tab)
,
Terms of Service
(opens in a new tab)
, and
Dataset License
(opens in a new tab)
ACCEPT & CONTINUE
or Only Accept Required