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Thermal management (electronics)
Known as:
Thermal dissipation
, Thermal management of electronics
, Thermal management of electronic devices and systems
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All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure…
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Related topics
Related topics
24 relations
Annealed pyrolytic graphite
Computational fluid dynamics
Computer cooling
Digital signal processor
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2010
2010
Thermal analysis of 3D packaging with a simplified thermal resistance network model and finite element simulation
Zhaohui Chen
,
Xiaobing Luo
,
Sheng Liu
11th International Conference on Electronic…
2010
Corpus ID: 36613973
Analytical solution is established to calculate equivalent thermal resistances of the through silicon via (TSV) structure in both…
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Highly Cited
2008
Highly Cited
2008
Multicore Processors - A Necessity
Bryan Schauer
2008
Corpus ID: 62048846
As personal computers have become more prevalent and more applications have been designed for them, the end-user has seen the…
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Highly Cited
2008
Highly Cited
2008
Coil Array Structures Compared for Contactless Battery Charging Platform
J. Achterberg
,
E. Lomonova
,
J. de Boeij
IEEE transactions on magnetics
2008
Corpus ID: 33203979
We propose two new coil topologies for a contactless battery charging platform. The new topologies consist of square printed…
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Highly Cited
2006
Highly Cited
2006
Simplified thermal lattice Boltzmann in incompressible limit
C. S. N. Azwadi
,
T. Tanahashi
2006
Corpus ID: 56339378
In this paper, an incompressible thermohydrodynamics for the lattice Boltzmann scheme is developed. The basic idea is to solve…
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Highly Cited
2006
Highly Cited
2006
Controlling the Morphology of Carbon Nanotube Films by Varying the Areal Density of Catalyst Nanoclusters Using Block‐Copolymer Micellar Thin Films
R. Bennett
,
A. Hart
,
R. Cohen
2006
Corpus ID: 14637746
In spite of much research progress in the science and synthesis of carbon nanotubes (CNTs), control over the location and…
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Highly Cited
2004
Highly Cited
2004
Water relations of indigenous versus exotic tree species, growing at the same site in a tropical montane forest in southern Ethiopia
M. Fetene
,
E. Beck
Trees
2004
Corpus ID: 33873425
The objective of the study was to compare the water relations of two indigenous [Podocarpus falcatus (Thunb.) Endl., Croton…
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Highly Cited
2003
Highly Cited
2003
Thermal analysis of ultra-thin body device scaling [SOI and FinFet devices]
E. Pop
,
R. Dutton
,
K. Goodson
IEEE International Electron Devices Meeting
2003
Corpus ID: 29226046
This paper explores the effect of confined dimensions and complicated geometries on the self-heating of ultra-thin body SOI and…
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Highly Cited
1998
Highly Cited
1998
A test pattern generation methodology for low power consumption
Fulvio Corno
,
P. Prinetto
,
M. Rebaudengo
,
M. Reorda
Proceedings of the ... IEEE VLSI Test Symposium
1998
Corpus ID: 10337214
This paper proposes an ATPG technique that reduces power dissipation during the test of sequential circuits. The proposed…
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Highly Cited
1988
Highly Cited
1988
Regulation of thermal dissipation of absorbed light energy in chloroplasts indicated by energy-dependent fluorescence quenching
G. Krause
,
H. Laasch
,
E. Weis
1988
Corpus ID: 89072494
Highly Cited
1978
Highly Cited
1978
Wafer-scale integration-a fault-tolerant procedure
R. Aubusson
,
I. Catt
IEEE Journal of Solid-State Circuits
1978
Corpus ID: 36425907
Considers a new approach to full-slice technology in relation to existing procedures for achieving this goal. Under external…
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