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Thermal management (electronics)

Known as: Thermal dissipation, Thermal management of electronics, Thermal management of electronic devices and systems 
All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure… 
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Related topics

Related topics

24 relations
Annealed pyrolytic graphiteComputational fluid dynamicsComputer coolingDigital signal processor

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2010
2010
Thermal analysis of 3D packaging with a simplified thermal resistance network model and finite element simulation
Analytical solution is established to calculate equivalent thermal resistances of the through silicon via (TSV) structure in both… 
Highly Cited
2008
Highly Cited
2008
Multicore Processors - A Necessity
As personal computers have become more prevalent and more applications have been designed for them, the end-user has seen the… 
Highly Cited
2008
Highly Cited
2008
Coil Array Structures Compared for Contactless Battery Charging Platform
We propose two new coil topologies for a contactless battery charging platform. The new topologies consist of square printed… 
Highly Cited
2006
Highly Cited
2006
Simplified thermal lattice Boltzmann in incompressible limit
In this paper, an incompressible thermohydrodynamics for the lattice Boltzmann scheme is developed. The basic idea is to solve… 
Highly Cited
2006
Highly Cited
2006
Controlling the Morphology of Carbon Nanotube Films by Varying the Areal Density of Catalyst Nanoclusters Using Block‐Copolymer Micellar Thin Films
In spite of much research progress in the science and synthesis of carbon nanotubes (CNTs), control over the location and… 
Highly Cited
2004
Highly Cited
2004
Water relations of indigenous versus exotic tree species, growing at the same site in a tropical montane forest in southern Ethiopia
The objective of the study was to compare the water relations of two indigenous [Podocarpus falcatus (Thunb.) Endl., Croton… 
Highly Cited
2003
Highly Cited
2003
Thermal analysis of ultra-thin body device scaling [SOI and FinFet devices]
This paper explores the effect of confined dimensions and complicated geometries on the self-heating of ultra-thin body SOI and… 
Highly Cited
1998
Highly Cited
1998
A test pattern generation methodology for low power consumption
This paper proposes an ATPG technique that reduces power dissipation during the test of sequential circuits. The proposed… 
Highly Cited
1988
Highly Cited
1988
Regulation of thermal dissipation of absorbed light energy in chloroplasts indicated by energy-dependent fluorescence quenching
Highly Cited
1978
Highly Cited
1978
Wafer-scale integration-a fault-tolerant procedure
Considers a new approach to full-slice technology in relation to existing procedures for achieving this goal. Under external… 
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