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Tape-automated bonding

Known as: TAB, Tape automated bonding 
Tape-automated bonding (TAB) is a process that places bare integrated circuits onto a printed circuit board (PCB) by attaching them to fine… 
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Papers overview

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2010
2010
Electronic circuits are composed of components connected by traces which conduct the current. While the interconnections between… 
Review
2004
Review
2004
  • Yi LiC. Wong
  • 2004
  • Corpus ID: 40516263
As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more… 
1998
1998
We report the current distribution of copper bumps with photoresist sidewall angles. The role of outer diffusion, vortices, and… 
1997
1997
The authors report the shape evolution of initial copper bumps at Peclet numbers higher than a hundred. The role of vortices and… 
1996
1996
This paper describes the relationship between the tape automated bonding (TAB) condition and reliability. When too much… 
1994
1994
Gold bumps of high quality have been electrodeposited from a sulfitic gold electrolyte. Periodic recording, both of existing… 
1991
1991
  • J. Hayward
  • 1991
  • Corpus ID: 136939592
The conventional thermo-compression bonding processes for bonding tape-automated-bonding (TAB) leadframes to silicon die has… 
1990
1990
Tape automated bonding processes have been adapted to the development of a fully automated cell. Details of the early cell design… 
1988
1988
The geometry of tape automated bonding (TAB) tape lends itself to microwave packaging applications where high density signal… 
1985
1985
Historique. Variantes. Fabrication des pattes de connexion verifiables a 3 couches avec plots d'or connectables par…