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Tape-automated bonding
Known as:
TAB
, Tape automated bonding
Tape-automated bonding (TAB) is a process that places bare integrated circuits onto a printed circuit board (PCB) by attaching them to fine…
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Related topics
Related topics
5 relations
Integrated circuit
Integrated circuit packaging
Printed circuit board
Semiconductor device fabrication
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2010
2010
Saliency-Based Candidate Inspection Region Extraction in Tape Automated Bonding
Martina Dümcke
,
Hiroki Takahashi
Industrial Conference on Data Mining
2010
Corpus ID: 44381227
Electronic circuits are composed of components connected by traces which conduct the current. While the interconnections between…
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Review
2004
Review
2004
Recent advances on electrical conductive adhesives (ECAs)
Yi Li
,
C. Wong
4th IEEE International Conference on Polymers and…
2004
Corpus ID: 40516263
As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more…
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1998
1998
Current Evolution of Electrodeposited Copper Bumps with Photoresist Angle
K. Kondo
,
K. Fukui
1998
Corpus ID: 89611430
We report the current distribution of copper bumps with photoresist sidewall angles. The role of outer diffusion, vortices, and…
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1997
1997
Shape evolution of electrodeposited copper Bumps with high peclet numbers
K. Kondo
,
K. Fukui
,
M. Yokoyama
,
K. Shinohara
1997
Corpus ID: 93213329
The authors report the shape evolution of initial copper bumps at Peclet numbers higher than a hundred. The role of vortices and…
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1996
1996
Reliability of tape automated bonding using Au‐Sn alloy
Shibata Susumu
,
M. Kimura
1996
Corpus ID: 62203725
This paper describes the relationship between the tape automated bonding (TAB) condition and reliability. When too much…
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1994
1994
High-performance gold plating for microdevices
A. Gemmier
,
W. Keller
,
H. Richter
,
K. Ruess
1994
Corpus ID: 15477665
Gold bumps of high quality have been electrodeposited from a sulfitic gold electrolyte. Periodic recording, both of existing…
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1991
1991
Development of laser bonding as a manufacturing process for inner-lead bonding
J. Hayward
Other Conferences
1991
Corpus ID: 136939592
The conventional thermo-compression bonding processes for bonding tape-automated-bonding (TAB) leadframes to silicon die has…
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1990
1990
Putting the automation in tape automated bonding
W. Whitworth
Optics & Photonics
1990
Corpus ID: 109271824
Tape automated bonding processes have been adapted to the development of a fully automated cell. Details of the early cell design…
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1988
1988
High Frequency Characterization Of Tape-Automated Bonding (TAB) Interconnects
S. Wentworth
,
D. Neikirk
,
C. R. Brahce
Other Conferences
1988
Corpus ID: 110401826
The geometry of tape automated bonding (TAB) tape lends itself to microwave packaging applications where high density signal…
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1985
1985
Tape automated bonding
D. Small
,
A. Blain
1985
Corpus ID: 137733667
Historique. Variantes. Fabrication des pattes de connexion verifiables a 3 couches avec plots d'or connectables par…
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