Integrated circuit packaging

Known as: Die attachment, Area array package, IC encapsulation 
In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly… (More)
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Papers overview

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2015
2015
Existing bridgeless boost (BLB) converter with soft switching utilize more than two active switches and extra resonant networks… (More)
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2013
2013
A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The… (More)
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Highly Cited
2011
Highly Cited
2011
  • K. N. Tu
  • Microelectronics Reliability
  • 2011
0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.031 E-mail address: kntu@ucla.edu At the moment… (More)
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2010
2010
Decapsulation of plastic Integrated Circuit (IC) packages is an important step in package level failure analysis. In this paper… (More)
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2010
2010
The tri(o-phenylenediamine) cyclotriphosphazene (TPCTP) was synthesized using titrating technology of… (More)
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2008
2008
Electronic products may be subjected to shock and vibration during shipping, normal usage, and accidental drop. High strain rate… (More)
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2007
2007
Efficiency and accuracy are the two main factors to develop the competence for the integrated-circuit (IC) packaging industry. An… (More)
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2007
2007
Microelectromechanical systems (MEMS) resonators have been investigated for over forty years but have never delivered the high… (More)
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Highly Cited
2006
Highly Cited
2006
A nanoscale silver paste containing 30-nm silver particles that can be sintered at 280degC was made for interconnecting… (More)
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2003
2003
Micro-springs are characterized and demonstrated in integrated circuit (IC) packaging and microelectromechanical system (MEMS… (More)
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