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Integrated circuit packaging
Known as:
Die attachment
, Area array package
, IC encapsulation
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In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly…
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Related topics
Related topics
38 relations
B-staging
Back end of line
Ball grid array
Chip carrier
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Broader (1)
Semiconductor device fabrication
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Reliability challenges of Cu wire deployment in flash memory packaging
C.L. Gan
,
E. Ng
,
B. L. Chan
,
U. Hashim
Impact
2012
Corpus ID: 26273389
Cu wirebonding become a great interest of industry in recent years due to its cost effectiveness and electrical and mechanical…
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2006
2006
THE ROLE OF POSTHARVEST MACHINERIES AND PACKAGING IN MINIMIZING AFLATOXIN CONTAMINATION IN PEANUT
R. Paramawati
,
Puji Widodo
,
Uning Budiharti
,
Handaka Handaka
2006
Corpus ID: 54735245
As a tropical country with relatively high humidity and temperature, Indonesia is struggling with aflatoxin which frequently…
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2005
2005
Copper Ball Bonding Advances for Leading Edge Packaging
M. Deley
,
L. Levine
2005
Corpus ID: 107731256
The Graphic Processing Unit (GPU) represents the leading edge in assembly technology, eclipsing the Central Processing Unit (CPU…
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2004
2004
Back-end compatibility of bonding and thinning processes for a wafer-level 3D interconnect technology platform
S. Pozder
,
J. Lu
,
+6 authors
R. Gutmann
Proceedings of the IEEE International…
2004
Corpus ID: 45078403
A previously proposed wafer-level 3D IC technology platform has been extensively evaluated for compatibility with conventional IC…
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2004
2004
Experimental investigation of bare silicon wafer warp
N. Draney
,
Jun Liu
,
T. Jiang
IEEE Workshop on Microelectronics and Electron…
2004
Corpus ID: 37096286
IC packaging trends demand smaller packaging, which translates to thinner silicon; in some cases as thin as 50 /spl mu/m…
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2004
2004
Optimisation modelling for microelectronics packaging and product design
S. Stoyanov
2004
Corpus ID: 60188924
The objective of this research is to develop a design framework for virtual prototyping of electronic packaging. This framework…
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2000
2000
Microelectronics Packaging
P. Khandelwal
,
K. Shenai
The VLSI Handbook
2000
Corpus ID: 42376058
1996
1996
TRENDS IN IC PACKAGING
R. Marrs
1996
Corpus ID: 204286640
1987
1987
Materials for IC packaging with very low permittivity via colloidal sol-gel processing
W. Yarbrough
,
T. R. Gururaja
,
L. Cross
1987
Corpus ID: 138873068
1984
1984
Microelectronics packaging. II
B. Schwartz
1984
Corpus ID: 138353300
Description des modules utilises par IBM durant ces quinze dernieres annees. Les ceramiques multicouches y ont trouve la voie de…
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