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TO-263

Known as: D2PAK, DDPAK, TO263 
The D2PAK or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. They are similar… 
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Related topics

Related topics

5 relations
List of integrated circuit packaging typesPrinted circuit boardSemiconductor packageTO-220

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Board-Level Reliability Performance of Discrete Power Packages
Board-level thermal cycling reliability performance of two buckets of discrete power packages is evaluated by both Finite Element… 
2007
2007
Thermal Numerical Simulation and Correlation for a Power Package
Thermal resistance is sensitive to package structure, package material, thermal test board and ambient conditions. In this paper… 
2005
2005
AN-7009 Dual Layout for BGA and SO 8 Packages
  • 2005
  • Corpus ID: 13988389
A few years ago, Fairchild Semiconductor introduced the BGA as the power package of the future. The BGA package offers superior… 
2004
2004
Compact thermal model of a D2Pak case with convection
The paper presents a compact thermal model of an electronic component enclosed in a D2Pak case. The model includes convection… 
2002
2002
Thermal compact modeling for power electronic devices in D2Pak enclosures
In this paper, the compact modeling of power electronic devices is presented. Physical modeling using ANSYS is helpful to… 
2002
2002
TM HIP 2060 , N-Channel Half-Bridge Power MOSFET Array
The HIP2060 is a dual MOSFET array topology in a half-bridge configuration which represents a new innovation of power… 
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