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TO-263

Known as: D2PAK, DDPAK, TO263 
The D2PAK or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. They are similar… 
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Related topics

Related topics

5 relations
List of integrated circuit packaging typesPrinted circuit boardSemiconductor packageTO-220

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
Transient Electro-Thermal Coupled System Simulation - Modeling Approach and Experimental Validation
This contribution describes an approach for modeling a coupled electro-thermal design problem for the transient system simulation… 
2017
2017
Efficient modelling approach for transient coupled electro-thermal simulation on the example of a D2PAK application
This contribution derives an efficient approach to model a coupled electro-thermal design problem for transient system simulation… 
2016
2016
Miniaturized power-diode package with superior thermal performance using embedding technology
A novel double diode package (footprint D2PAK compatible) was designed, simulated, and fabricated using an innovative embedding… 
2016
2016
Board-Level Reliability Performance of Discrete Power Packages
Board-level thermal cycling reliability performance of two buckets of discrete power packages is evaluated by both Finite Element… 
2012
2012
High performance and reliable TO package
The development of new TO package towards package miniaturization trend for improving cost performance while enhancing product… 
2007
2007
Thermal Numerical Simulation and Correlation for a Power Package
Thermal resistance is sensitive to package structure, package material, thermal test board and ambient conditions. In this paper… 
2006
2006
Modeling and Analysis of Metal Interconnect Resistance of Power MOSFETs with Ultra Low On-Resistance
The issue of metal interconnect resistance becomes increasingly critical as the power MOSFET technology continues to advance… 
2006
2006
Minimization of the Thermal Interface Resistance of Power SMD Assemblies for High-Temperature Applications
Heat removal from power SMDs in a D2PAK package for high temperature applications is investigated. The components are mounted on… 
2005
2005
Breakthroughs in laser bar component packaging enable a new generation of applications for self-cooled laser diode arrays
Laser Diode Arrays continue to gain momentum as versatile, cost effective, reliable solution for a wide variety of existing and… 
Review
2004
Review
2004
Enhancement of open-cracks detection using a principal component analysis / wavelet technique in photothermal nondestructive testing by
  • 2004
  • Corpus ID: 38274411
s – QIRT 2002 1 QIRT’2002: Quantitative InfraRed Thermography 6 ~ Abstracts ~ edited by D. Balageas, G. Busse, G.M. Carlomagno… 
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