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TO-263

Known as: D2PAK, DDPAK, TO263 
The D2PAK or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. They are similar… 
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Related topics

Related topics

5 relations
List of integrated circuit packaging typesPrinted circuit boardSemiconductor packageTO-220

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
Transient Electro-Thermal Coupled System Simulation - Modeling Approach and Experimental Validation
This contribution describes an approach for modeling a coupled electro-thermal design problem for the transient system simulation… 
2016
2016
Miniaturized power-diode package with superior thermal performance using embedding technology
A novel double diode package (footprint D2PAK compatible) was designed, simulated, and fabricated using an innovative embedding… 
2013
2013
Water Mass Transformations in the Southern Ocean Diagnosed from Observations: Contrasting Effects of Air–Sea Fluxes and Diapycnal Mixing
AbstractTransformation and formation rates of water masses in the Southern Ocean are estimated in a neutral-surface framework… 
2013
2013
Reliability of discrete power semiconductor packages and systems — D2Pak and CanPAK in comparison
The reliability of discrete power semiconductor packages is getting more and more important in regard to the increasing number of… 
2012
2012
High performance and reliable TO package
The development of new TO package towards package miniaturization trend for improving cost performance while enhancing product… 
2012
2012
Material analysis and process characterization of super high thermal performance die attach epoxy towards package reliability, thermal and electrical performance
Super high thermal die attach adhesive towards better thermal resistance and RDSON is highly desired in green robust package… 
2007
2007
Thermal Numerical Simulation and Correlation for a Power Package
Thermal resistance is sensitive to package structure, package material, thermal test board and ambient conditions. In this paper… 
Review
2006
Review
2006
Accelerated Active High-Temperature Cycling Test for Power MOSFETs
In this paper reliability test equipment is presented that allows accelerated failure tests of packaged power MOSFETs (e.g. TO220… 
2006
2006
Modeling and Analysis of Metal Interconnect Resistance of Power MOSFETs with Ultra Low On-Resistance
The issue of metal interconnect resistance becomes increasingly critical as the power MOSFET technology continues to advance… 
2003
2003
Understanding the Effect of Power MOSFET Package Parasitics on VRM Circuit Efficiency at Frequencies above 1 MHz
The effect of frequency on the parasitic inductance and resistance of DPAK, D2PAK, MLP, SO-8 and the proprietary DirectFET power… 
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