TO-263

Known as: D2PAK, DDPAK, TO263 
The D2PAK or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. They are similar… (More)
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Topic mentions per year

Topic mentions per year

2005-2016
01220052016

Papers overview

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2017
2017
Due to the advancement of electric mobility in recent years, the need for reliable power electronics has risen exponentially. To… (More)
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2016
2016
This paper demonstrates the performance of a 900 V silicon carbide (SiC) power MOSFET operating at 13.56 MHz in a 2 kW resonant… (More)
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2015
2015
The use of copper-based dual gauge leadframe design is proven effective in the thermal, electrical, and reliability of power… (More)
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2015
2015
  • 2015
One of effort to overcome the planar MOSFET’s limit is super-junction technology in high voltage power MOSFET. This technology… (More)
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Review
2013
Review
2013
One important challenge in power electronics design is removing the heat cost effectively from the power devices. A thermal via… (More)
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2012
2012
The development of new TO package towards package miniaturization trend for improving cost performance while enhancing product… (More)
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2012
2012
Super high thermal die attach adhesive towards better thermal resistance and RDSON is highly desired in green robust package… (More)
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2007
2007
Thermal resistance is sensitive to package structure, package material, thermal test board and ambient conditions. In this paper… (More)
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2005
2005
A few years ago, Fairchild Semiconductor introduced the BGA as the power package of the future. The BGA package offers superior… (More)
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